STPS6045CP_03 [STMICROELECTRONICS]
POWER SCHOTTKY RECTIFIER; 功率肖特基整流器型号: | STPS6045CP_03 |
厂家: | ST |
描述: | POWER SCHOTTKY RECTIFIER |
文件: | 总5页 (文件大小:118K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
®
STPS6045CP/CPI/CW
POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
A1
IF(AV)
VRRM
2x30 A
45 V
K
A2
Tj (max)
VF (max)
175 °C
0.63 V
A2
K
A1
FEATURES AND BENEFITS
Insulated
TOP-3I
STPS6045CPI
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VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
EXTREME FAST SWITCHING
LOW THERMAL RESISTANCE
INSULATED PACKAGE: TOP-3I
Insulating voltage = 2500VRMS
Capacitance = 12pF
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AVALANCHE CAPABILITY SPECIFIED
A2
A2
DESCRIPTION
K
K
A1
Dual center tap Schottky rectifier suited for
switchmode power supply and high frequency DC
to DC converters.
A1
TO-247
SOT-93
Packaged either in SOT-93, TOP-3I or TO-247,
this device is intended for use in low voltage, high
frequency inverters, free wheeling and polarity
protection applications.
STPS6045CW
STPS6045CP
ABSOLUTE RATINGS (limiting values, per diode)
Symbol
VRRM
Parameter
Repetitive peak reverse voltage
Value
45
Unit
V
A
A
IF(RMS)
IF(AV)
60
30
RMS forward current
SOT-93
TO-247
Average forward current
δ = 0.5
Tc = 150°C
Tc = 130°C
Per diode
Per device
TOP-3I
60
400
1
IFSM
IRRM
A
A
Surge non repetitive forward current
Repetitive Peak reverse current
tp = 10 ms sinusoidal
tp = 2 µs square
F = 1kHz
IRSM
PARM
Tstg
3
A
Non repetitive peak reverse current
Repetitive peak avalanche power
Storage temperature range
tp = 100 µs square
tp = 1µs Tj = 25°C
10600
W
- 65 to + 175 °C
Tj
175
°C
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
dV/dt
10000
V/µs
dPtot
1
* :
<
thermal runaway condition for a diode on its own heatsink
dTj
Rth(j − a)
July 2003 - Ed: 7B
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STPS6045CP/CPI/CW
THERMAL RESISTANCES
Symbol
Parameter
Value
Unit
Rth (j-c)
SOT-93 / TO-247
0.95
0.55
°C/W
Junction to case
Per diode
Total
TOP-3I
1.8
1.1
Per diode
Total
Rth (c)
SOT-93 / TO-247
TOP-3I
0.15
0.4
Coupling
When the diodes 1 and 2 are used simultaneously:
∆ TJ(diode 1) = P(diode1) x Rth(j-c) (Per diode) + P(diode 2) x Rth(c)
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Symbol
Parameter
Tests Conditions
Min. Typ. Max.
Unit
IR *
500
µA
Reverse leakage
current
Tj = 25°C
Tj = 125°C
VR = VRRM
20
80
mA
V
VF *
0.53
0.63
0.84
0.78
Forward voltage drop Tj = 125°C
Tj = 25°C
IF = 30 A
IF = 60 A
IF = 60 A
0.68
Tj = 125°C
Pulse test : ** tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
2
P = 0.48 x IF(AV) + 0.005 IF (RMS)
Fig. 1: Average forward power dissipation
versus average forward current (per diode).
Fig. 2: Average current versus ambient
temperature (δ=0.5, per diode).
PF(av)(W)
IF(av)(A)
25
35
δ = 0.1 δ = 0.2
δ = 0.5
SOT-93
TO-247
δ = 0.05
Rth(j-a)=Rth(j-c)
Rth(j-a)=10°C/W
30
25
20
15
10
5
20
δ = 1
TOP-3I
15
10
T
T
5
tp
tp
=tp/T
=tp/T
δ
IF(av) (A)
δ
Tamb(°C)
0
0
0
25
50
75
100
125
150
175
0
5
10
15
20
25
30
35
40
Fig. 3: Normalized avalanche power derating
versus pulse duration.
Fig. 4: Normalized avalanche power derating
versus junction temperature.
P
(t )
p
(1µs)
ARM
P
ARM
(t )
p
(25°C)
ARM
P
ARM
P
1
1.2
1
0.1
0.8
0.6
0.4
0.2
0
0.01
T (°C)
j
t (µs)
p
0.001
0
25
50
75
100
125
150
0.01
0.1
1
10
100
1000
2/5
STPS6045CP/CPI/CW
Fig. 5-1: Non repetitive surge peak forward current
versus overload duration (maximum values, per
diode) (SOT-93 and TO-247).
Fig. 5-2: Non repetitive surge peak forward current
versus overload duration (maximum values, per
diode) (TOP-3I).
IM(A)
IM(A)
350
250
300
250
200
150
200
Tc=75°C
Tc=75°C
Tc=100°C
150
Tc=100°C
100
Tc=125°C
100
IM
IM
Tc=125°C
50
50
0
t
t
δ=0.5
t(s)
δ=0.5
t(s)
0
1E-3
1E-2
1E-1
1E+0
1E-3
1E-2
1E-1
1E+0
Fig. 6: Relative variation of thermal transient
impedance junction to case versus pulse duration.
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values, per diode).
IR(µA)
Zth(j-c)/Rth(j-c)
1E+5
1.0
Tj=150°C
Tj=125°C
1E+4
0.8
Tj=100°C
1E+3
Tj=75°C
δ = 0.5
0.6
Tj=50°C
1E+2
0.4
T
δ = 0.2
δ = 0.1
Tj=25°C
1E+1
0.2
0.0
Single pulse
tp
=tp/T
δ
tp(s)
1E+0
0
5
10
15
20
VR(V)
25
30
35
40
45
1E-4
1E-3
1E-2
1E-1
1E+0
Fig. 9: Forward voltage drop versus forward
current (maximum values, per diode).
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values, per diode).
IFM(A)
C(nF)
200
5.0
F=1MHz
Tj=25°C
100
Typical values
Tj=125°C
Tj=25°C
1.0
10
Tj=125°C
VFM(V)
VR(V)
1
0.1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
3/5
1
2
5
10
20
50
STPS6045CP/CPI/CW
PACKAGE MECHANICAL DATA
SOT-93
DIMENSIONS
Millimeters
Min. Typ. Max. Min. Typ. Max.
REF.
Inches
A
C
4.70
1.90
4.90 1.185
2.10 0.075
0.193
0.083
D
D1
E
2.50
2.00
0.098
0.078
0.50
1.10
0.78 0.020
1.30 0.043
0.031
0.051
F
F3
F4
G
H
L
L2
L3
L5
L6
O
1.75
2.10
0.069
0.083
10.80
14.70
11.10 0.425
15.20 0.279
12.20
0.437
0.598
0.480
0.638
16.20
18.0
0.709
1.220
3.95
4.00
4.15 0.156
4.10 0.157
0.163
0.161
31.00
PACKAGE MECHANICAL DATA
TOP-3I (isolated)
DIMENSIONS
REF.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A
B
C
D
E
F
G
H
J
4.4
1.45
14.35
0.5
4.6 0.173
1.55 0.057
15.60 0.565
0.7 0.020
2.9 0.106
16.5 0.622
21.1 0.815
15.5 0.594
5.65 0.213
3.65 0.134
4.17 0.161
1.40 0.047
0.181
0.061
0.614
0.028
0.114
0.650
0.831
0.610
0.222
0.144
0.164
0.055
2.7
15.8
20.4
15.1
5.4
K
L
3.4
4.08
1.20
P
R
4.60
0.181
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STPS6045CP/CPI/CW
DIMENSIONS
PACKAGE MECHANICAL DATA
TO-247
V
REF.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
Dia.
V
A
D
E
F
F1
F2
4.85
2.20
0.40
1.00
5.15 0.191
2.60 0.086
0.80 0.015
1.40 0.039
0.203
0.102
0.031
0.055
A
H
3.00
2.00
0.118
0.078
F3 2.00
F4 3.00
G
2.40 0.078
3.40 0.118
0.094
0.133
L5
10.90
0.429
H
L
15.45
19.85
15.75 0.608
20.15 0.781
4.30 0.145
0.620
0.793
0.169
L
L2 L4
L1
L1 3.70
L2
L3 14.20
L4
L5
M
V
V2
18.50
0.728
14.80 0.559
3.00 0.078
3.65 0.139
0.582
0.118
0.143
F2
F3
F1
34.60
5.50
1.362
0.216
D
V2
L3
F4
2.00
5°
60°
5°
60°
F(x3)
M
E
Dia. 3.55
G
=
=
Type
Marking
Package
Weight
Base qty
Delivery mode
STPS6045CP STPS6045CP
STPS6045CPI STPS6045CPI
STPS6045CW STPS6045CW
Cooling method: by conduction (C)
Recommended torque value: 0.8 N.m.
Maximum torque value: 1.0 N.m.
Epoxy meets UL94,V0
SOT-93
TOP-3I
TO-247
3.97 g.
4.46 g.
4.36 g.
30
120
30
Tube
Bulk
Tube
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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
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© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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