STPS61H100-Y [STMICROELECTRONICS]
Automotive 100 V, 60A, low drop power Schottky rectifier;
| 型号： | STPS61H100-Y |
| 厂家： | 
ST |
| 描述： | Automotive 100 V, 60A, low drop power Schottky rectifier |
| 文件： | 总9页 (文件大小：204K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STPS61H100-Y
Datasheet
Automotive 100 V low drop power Schottky rectifier
Features
A1
A2
K
•
•
•
•
•
•
•
•
AEC-Q101 qualified
PPAP capable
Negligible switching losses
High junction temperature capability
Low leakage current
A2
TO-247
K
A1
Good trade-off between leakage current and forward voltage drop
Avalanche capability specified
Low thermal resistance
Application
•
•
•
DC/DC converters
Freewheeling diodes
Electrical vehicles (EV) and hybrid electrical vehicles
Description
The STPS61H100-Y is a dual center tap Schottky rectifier designed for high
frequency switched mode power supplies such as on board DC/DC converters for
automotive applications.
Product status link
STPS61H100-Y
Product summary
I
2 x 30 A
F(AV)
V
100 V
175 °C
0.63 V
RRM
T
j(max.)
V
F(typ.)
DS13064 - Rev 1 - July 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
STPS61H100-Y
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values, per diode, at 25 °C unless otherwise specified)
Symbol
Parameter
Value
100
Unit
V
V
RRM
T = -40 to +175 °C
j
Repetitive peak reverse voltage
Forward rms current
I
80
A
F(RMS)
Per diode, T = 160 °C
30
c
I
Average forward current, δ = 0.5 square wave
A
F(AV)
Per device, T = 160 °C
60
c
I
t = 10 ms sinusoidal
Surge non repetitive forward current
Repetitive peak avalanche power
Storage temperature range
450
A
FSM
p
P
t = 10 µs, T = 125 °C
1900
W
°C
°C
ARM
p
j
T
-65 to +175
-40 to +175
stg
Operating junction temperature range(1)
T
j
1. (dP /dT ) < (1/R ) condition to avoid thermal runaway for a diode on its own heatsink.
th(j-a)
tot
j
Table 2. Thermal resistance parameters
Symbol
Parameter
Typ. value
0.38
Unit
°C/W
Per diode
R
th(j-c)
Junction to case
Per device
0.19
Table 3. Static electrical characteristics (per diode)
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
16
Unit
T = 25 °C
-
-
-
-
-
-
3
µA
j
(1)
V
= V
RRM
I
Reverse leakage current
R
R
T = 125 °C
4
16
mA
j
T = 25 °C
0.76
0.63
0.87
0.75
0.81
0.7
j
I = 30 A
F
T = 125 °C
j
(2)
V
F
Forward voltage drop
V
T = 25 °C
0.93
0.83
j
I = 60 A
F
T = 125 °C
j
1. t = 5 ms, δ < 2%
p
2. t = 380 μs, δ < 2%
p
To evaluate the conduction losses, use the following equation:
2
P = 0.57 x IF(AV) + 0.0043 x IF (RMS)
DS13064 - Rev 1
page 2/9
STPS61H100-Y
Characteristics (curves)
1.1
Characteristics (curves)
Figure 2. Relative variation of thermal impedance junction
to case versus pulse duration
Figure 1. Average forward current versus case
temperature (δ = 0.5, per diode)
Z
th(j-c) /Rth(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Single pulse
tP(s)
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
Figure 3. Reverse leakage current versus reverse voltage
applied (typical values, per diode)
Figure 4. Junction capacitance versus reverse voltage
applied (typical values, per diode)
IR(µA)
1.E+05
C(nF)
10.00
F = 1 MHz
V
OSC = 30 mVRMS
Tj = 25 °C
1.E+04
Tj = 150 °C
Tj = 125 °C
1.E+03
Tj = 100 °C
1.00
1.E+02
Tj = 75 °C
Tj = 50 °C
1.E+01
1.E+00
Tj = 25 °C
VR(V)
VR(V)
0.10
1.E-01
1
10
100
0
10
20
30
40
50
60
70
80
90
100
DS13064 - Rev 1
page 3/9
STPS61H100-Y
Characteristics (curves)
Figure 5. Normalized avalanche power derating versus
pulse duration (Tj = 125 °C)
Figure 6. Forward voltage drop versus forward current
(typical values, per diode)
PARM(t )
p
PARM(10 µs)
IF(A)
100.0
1
0.1
10.0
Tj = 25 °C
1.0
Tj = 75 °C
0.01
0.001
Tj = 125 °C
Tj = -40 °C
Tj = 150 °C
VF(V)
0.1
tp(µs)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1
10
100
1000
DS13064 - Rev 1
page 4/9
STPS61H100-Y
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
TO-247 package information
•
•
•
•
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.8 N·m
Maximum torque value: 1.0 N·m
Figure 7. TO-247 package outline
Heat-sink plane
A
E
∅P
S
∅R
D
L2
L1
b1
b2
L
3
2
1
1
2
3
b
c
A1
Back view
e
DS13064 - Rev 1
page 5/9
STPS61H100-Y
TO-247 package information
Table 4. TO-247 package mechanical data
Dimensions
Millimeters
Ref.
Inches (for reference only)
Min.
4.85
2.20
1.00
2.00
3.00
0.40
19.85
15.45
5.30
14.20
3.70
Typ.
Max.
5.15
2.60
1.40
2.40
3.40
0.80
20.15
15.75
5.60
14.80
4.30
Min.
0.191
0.086
0.039
0.078
0.118
0.015
0.781
0.608
0.209
0.559
0.145
Typ.
Max.
0.203
0.102
0.055
0.094
0.133
0.031
0.793
0.620
0.220
0.582
0.169
A
A1
b
b1
b2
c
D
E
e
5.45
18.50
5.50
0.215
0.728
0.216
L
L1
L2
ØP
ØR
S
3.55
4.50
5.30
3.65
5.50
5.70
0.139
0.177
0.209
0.143
0.217
0.224
DS13064 - Rev 1
page 6/9
STPS61H100-Y
Ordering information
3
Ordering information
Table 5. Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STPS61H100CWY STPS61H100CWY
TO-247
4.4 g
30
Tube
DS13064 - Rev 1
page 7/9
STPS61H100-Y
Revision history
Table 6. Document revision history
Date
Version
Changes
11-Jul-2019
1
Initial release.
DS13064 - Rev 1
page 8/9
STPS61H100-Y
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© 2019 STMicroelectronics – All rights reserved
DS13064 - Rev 1
page 9/9
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