STPS640CM [STMICROELECTRONICS]

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STPS640CM
型号: STPS640CM
厂家: ST    ST
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STPS640CT/CF/CB  
POWER SCHOTTKY RECTIFIER  
MAIN PRODUCT CHARACTERISTICS  
A1  
IF(AV)  
VRRM  
2 x 3 A  
40 V  
K
A2  
Tj (max)  
VF (max)  
150 °C  
0.57 V  
K
FEATURESAND BENEFITS  
VERY SMALL CONDUCTION LOSSES  
NEGLIGIBLESWITCHING LOSSES  
EXTREMELY FAST SWITCHING  
LOW FORWARD DROP VOLTAGE  
LOW CAPACITANCE  
A2  
A1  
DPAK  
STPS640CB  
LOW THERMAL RESISTANCE  
INSULATEDPACKAGE:  
Insulatingvoltage = 2000V DC  
Capacitance= 12pF  
SMD PACKAGE (tapeand reel option: -TR)  
A2  
DESCRIPTION  
K
A2  
A1  
K
Dual Schottky rectifier suited to Switch Mode  
Power Suppliesand other Power Converters.  
A1  
ISOWATT220AB  
STPS640CF  
This device is intended for use in low and medium  
voltage operation, and particulary, in high fre-  
quency circuitries where low switching losses are  
required (free wheeling and polarity protection).  
TO-220AB  
STPS640CT  
ABSOLUTE RATINGS (limiting values, per diode)  
Symbol  
Parameter  
Value  
40  
10  
6
Unit  
VRRM Repetitivepeak reverse voltage  
IF(RMS) RMS forward current  
V
A
TO-220AB/ ISOWATT220AB  
DPAK  
IF(AV) Average forward current δ = 0.5  
TO-220AB  
ISOWATT220AB Tc = 130°C  
DPAK Tc = 120°C  
tp = 10 ms Sinusoidal  
Tc = 135°C  
3
A
IFSM  
IRRM  
Tstg  
Tj  
Surge non repetitive forward current  
Repetitivepeak reverse current  
Storage temperaturerange  
75  
1
A
A
µ
tp = 2 s F = 1kHz square  
- 65 to + 150 °C  
Maximum operatingjunction temperature  
150  
°C  
µ
V/ s  
dV/dt Critical rate of rise of reverse voltage  
10000  
August 1999 - Ed: 4A  
1/6  
STPS640CT/CF/CB  
THERMAL RESISTANCES  
Symbol  
Parameter  
TO-220AB/DPAK  
Value  
Unit  
Rth (j-c) Junction to case  
Per diode  
Total  
5.5  
3
°C/W  
ISOWATT220AB  
Per diode  
Total  
7.5  
5.2  
Rth(c)  
Coupling  
TO-220AB  
0.5  
3
°C/W  
ISOWATT220AB  
When the diodes 1 and 2 are used simultaneously:  
Tj(diode 1) = P(diode1)x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)  
STATIC ELECTRICAL CHARACTERISTICS  
(per diode)  
Symbol  
Tests Conditions  
Min. Typ. Max.  
Unit  
µA  
mA  
V
IR *  
Reverse leakage current  
Forward voltage drop  
Tj = 25°C  
VR = VRRM  
100  
Tj = 125°C  
Tj = 25°C  
2
10  
VF *  
IF = 3 A  
IF = 6 A  
IF = 3 A  
IF = 6 A  
0.63  
0.84  
0.57  
0.72  
°
Tj = 25 C  
Tj = 125°C  
Tj = 125°C  
0.5  
0.67  
Pulse test : * tp = 380 µs, δ < 2%  
To evaluate the maximum conduction losses use the following equation :  
2
P = 0.42 x IF(AV) + 0.050 IF  
(RMS)  
Fig. 1: Average forward power dissipation versus  
averageforward current (per diode).  
Fig. 2: Average current versusambient temperature  
( = 0.5, per diode).  
δ
IF(av)(A)  
PF(av)(W)  
2.50  
4.0  
3.5  
δ = 0.2  
δ = 0.5  
δ = 0.1  
δ = 0.05  
2.25  
2.00  
1.75  
1.50  
1.25  
1.00  
0.75  
0.50  
0.25  
0.00  
TO-220AB/DPAK  
Rth(j-a)=Rth(j-c)  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
ISOWATT220AB  
δ = 1  
Rth(j-a)=15°C/W  
T
T
tp  
=tp/T  
δ
tp  
=tp/T  
δ
Tamb(°C)  
IF(av) (A)  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
0
25  
50  
75  
100  
125  
150  
2/6  
STPS640CT/CF/CB  
Fig. 3-1:  
versus overload duration.  
Fig. 3-2:  
Nonrepetitive surgepeakforward current  
versus overload duration.  
Nonrepetitive surgepeak forwardcurrent  
(Maximum values, per diode)(TO-220AB/ DPAK).  
(Maximum values, per diode) (ISOWATT220AB).  
IM(A)  
IM(A)  
45  
40  
35  
30  
40  
35  
30  
25  
25  
Tc=75°C  
Tc=75°C  
20  
20  
Tc=100°C  
Tc=100°C  
15  
15  
Tc=130°C  
Tc=135°C  
IM  
10  
IM  
10  
t
t
5
5
δ=0.5  
δ=0.5  
t(s)  
t(s)  
0
0
1E-3  
1E-2  
1E-1  
1E+0  
1E-3  
1E-2  
1E-1  
1E+0  
Fig. 4.1: Relative variation of thermal transient  
impedancejunction to case versus pulse duration  
(TO-220AB / DPAK).  
Fig. 4-2: Relative variation of thermal transient  
impedance junction to case versus pulse duration  
(ISOWATT220AB).  
Zth(j-c)/Rth(j-c)  
Zth(j-c)/Rth(j-c)  
1.0  
1.0  
0.8  
0.8  
δ = 0.5  
δ = 0.5  
0.6  
0.6  
δ
= 0.2  
0.4  
0.2  
0.0  
0.4  
δ = 0.2  
δ = 0.1  
T
T
δ = 0.1  
0.2  
Single pulse  
tp  
=tp/T  
δ
tp(s)  
tp(s)  
Single pulse  
=tp/T  
δ
tp  
0.0  
1E-3  
1E-3  
1E-2  
1E-1  
1E+0  
1E-2  
1E-1  
1E+0  
1E+1  
Fig. 5:  
Fig. 6:  
Junction capacitance versus reverse  
voltage applied (typical values, per diode).  
Reverse leakage current versus reverse  
voltage applied (typical values, per diode).  
C(pF)  
IR(A)  
500  
1E-2  
F=1MHz  
Tj=25°C  
Tj=150°C  
Tj=125°C  
1E-3  
100  
Tj=100°C  
1E-4  
Tj=75°C  
VR(V)  
VR(V)  
1E-5  
10  
0
5
10  
15  
20  
25  
30  
35  
40  
1
2
5
10  
20  
50  
3/6  
STPS640CT/CF/CB  
Fig.7: Forward voltagedropversus forwardcurrent  
(maximum values, per diode).  
Fig. 8: Thermalresistancejunctionto ambientversus  
copper surface under tab (Epoxy printed circuit  
board FR4, copper thickness: 35µm).  
Rth(j-a) (°C/W)  
IFM(A)  
10.0  
80  
70  
60  
50  
40  
30  
20  
Typical values  
Tj=150°C  
Tj=125°C  
1.0  
VFM(V)  
10  
0
S(Cu) (cm )  
0.1  
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0  
0
4
8
12 16 20 24 28 32 36 40  
PACKAGE MECHANICAL DATA  
TO-220AB  
DIMENSIONS  
REF.  
Millimeters  
Min. Max.  
4.40 4.60  
Inches  
Min.  
Max.  
A
C
0.173  
0.048  
0.094  
0.019  
0.024  
0.044  
0.044  
0.194  
0.094  
0.393  
0.181  
0.051  
0.107  
0.027  
0.034  
0.066  
0.066  
0.202  
0.106  
0.409  
1.23  
2.40  
0.49  
0.61  
1.14  
1.14  
4.95  
2.40  
10  
1.32  
2.72  
0.70  
0.88  
1.70  
1.70  
5.15  
2.70  
10.40  
A
H2  
D
Dia  
C
E
L5  
L7  
F
F1  
F2  
G
L6  
L4  
L2  
F2  
F1  
G1  
H2  
L2  
L4  
L5  
L6  
L7  
L9  
M
D
L9  
16.4 typ.  
0.645 typ.  
13  
14  
0.511  
0.104  
0.600  
0.244  
0.137  
0.551  
0.116  
0.620  
0.259  
0.154  
F
2.65  
15.25  
6.20  
3.50  
2.95  
15.75  
6.60  
3.93  
M
G1  
E
G
2.6 typ.  
0.102 typ.  
Diam.  
3.75  
3.85  
0.147  
0.151  
4/6  
STPS640CT/CF/CB  
PACKAGE MECHANICAL DATA  
DPAK  
DIMENSIONS  
Millimeters Inches  
Min.  
REF.  
Min.  
2.20  
0.90  
0.03  
0.64  
5.20  
0.45  
0.48  
6.00  
6.40  
4.40  
9.35  
Max  
2.40  
1.10  
0.23  
0.90  
5.40  
0.60  
0.60  
6.20  
6.60  
4.60  
10.10  
Max.  
0.094  
0.043  
0.009  
0.035  
0.212  
0.023  
0.023  
0.244  
0.259  
0.181  
0.397  
A
A1  
A2  
B
0.086  
0.035  
0.001  
0.025  
0.204  
0.017  
0.018  
0.236  
0.251  
0.173  
0.368  
B2  
C
C2  
D
E
G
H
L2  
L4  
V2  
0.80 typ.  
0.031 typ.  
0.60  
1.00  
0.023  
0.039  
0°  
8°  
0°  
8°  
FOOTPRINT DIMENSIONS  
(in millimeters)  
6.7  
6.7  
3
3
1.6  
1.6  
2.3 2.3  
5/6  
STPS640CT/CF/CB  
PACKAGE MECHANICAL DATA  
ISOWATT220AB  
DIMENSIONS  
Millimeters Inches  
Min. Max.  
REF.  
Min.  
4.40  
2.50  
2.50  
0.40  
0.75  
1.15  
1.15  
4.95  
2.40  
Max.  
4.60  
2.70  
2.75  
0.70  
1.00  
1.70  
1.70  
5.20  
2.70  
A
B
0.173 0.181  
0.098 0.106  
0.098 0.108  
0.016 0.028  
0.030 0.039  
0.045 0.067  
0.045 0.067  
0.195 0.205  
0.094 0.106  
D
E
F
F1  
F2  
G
G1  
H
10.00 10.40 0.394 0.409  
16.00 typ. 0.630 typ.  
28.60 30.60 1.125 1.205  
9.80 10.60 0.386 0.417  
15.90 16.40 0.626 0.646  
L2  
L3  
L4  
L6  
L7  
Diam  
9.00  
3.00  
9.30  
3.20  
0.354 0.366  
0.118 0.126  
Orderingtype  
Marking  
Package  
Weight  
Base qty Deliverymode  
STPS640CT  
STPS640CB  
STPS640CT  
S640C  
TO-220AB  
DPAK  
2.20g  
0.30g  
0.30g  
2.08g  
50  
75  
Tube  
Tube  
STPS640CB-TR  
S640C  
DPAK  
2500  
50  
Tapeand reel  
Tube  
STPS640CF  
STPS640CF  
ISOWATT220AB  
Epoxymeets UL94,V0  
Informationfurnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of  
use of such information nor forany infringementof patents or other rights of thirdparties which may result from its use. No license is granted by  
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to  
change without notice. This publication supersedes and replaces all information previously supplied.  
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-  
proval of STMicroelectronics.  
The ST logo is a registered trademark of STMicroelectronics  
1999 STMicroelectronics - Printed in Italy - All rights reserved.  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia  
Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.  
http://www.st.com  
6/6  

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