STQ1NE10L-AP [STMICROELECTRONICS]

N-channel 100V - 0.3ヘ - 1A - TO-92 STripFET⑩ Power MOSFET; N沟道100V - 0.3ヘ - 1A - TO- 92 STripFET⑩功率MOSFET
STQ1NE10L-AP
型号: STQ1NE10L-AP
厂家: ST    ST
描述:

N-channel 100V - 0.3ヘ - 1A - TO-92 STripFET⑩ Power MOSFET
N沟道100V - 0.3ヘ - 1A - TO- 92 STripFET⑩功率MOSFET

文件: 总13页 (文件大小:284K)
中文:  中文翻译
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STQ1NE10L  
N-channel 100V - 0.3- 1A - TO-92  
STripFET™ Power MOSFET  
General features  
Type  
VDSS  
100V  
RDS(on)  
ID  
STQ1NE10L  
<0.4Ω  
1A  
Exceptional high dv/dt capability  
100% avalanche tested  
Avalanche rugged technology  
Low threshold drive  
TO-92  
(Ammopack)  
TO-92  
Description  
This Power MOSFET is the latest development of  
STMicroelectronics unique "Single Feature  
Size™" strip-based process. The resulting  
transistor shows extremely high packing density  
for low on-resistance, rugged avalanche  
characteristics and less critical alignment steps  
therefore a remarkable manufacturing  
reproducibility.  
Internal schematic diagram  
Applications  
Switching application  
Order codes  
Part number  
Marking  
Package  
Packaging  
STQ1NE10L  
Q1NE10L  
Q1NE10L  
TO-92  
TO-92  
Tube  
STQ1NE10L-AP  
Ammopak  
January 2007  
Rev 5  
1/13  
www.st.com  
13  
Contents  
STQ1NE10L  
Contents  
1
2
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
2.1  
Electrical characteristics (curves)  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3
4
5
Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
2/13  
STQ1NE10L  
Electrical ratings  
1
Electrical ratings  
Table 1.  
Symbol  
Absolute maximum ratings  
Parameter  
Value  
Unit  
VDS  
VGS  
ID  
Drain-source voltage (VGS = 0)  
Gate-source voltage  
100  
16  
1
V
V
Drain current (continuous) at TC = 25°C  
Drain current (continuous) at TC=100°C  
Drain gate current (continuous)  
Gate source current (continuous)  
Drain current (pulsed)  
A
ID  
0.6  
50  
50  
4
A
IDG  
IGS  
mA  
mA  
A
(1)  
IDM  
(2)  
PTOT  
Total dissipation at TC = 25°C  
Derating factor  
3
W
0.025  
6
W/°C  
V/ns  
mJ  
dv/dt(3) Peak diode recovery voltage slope  
(4)  
EAS  
Single pulse avalanche energy  
Storage temperature  
400  
Tstg  
TJ  
-55 to 150  
°C  
Operating junction temperature  
1. Pulse width limited by safe operating area.  
2. Related to Rthj -l  
3. ISD 1A, di/dt 200A/µs, VDD V(BR)DSS, TJ TJMAX  
4. Starting TJ = 25 oC, ID = 1A, VDD = 50V  
Table 2.  
Symbol  
Thermal data  
Parameter  
Value  
Unit  
RthJC  
RthJA  
Thermal resistance junction-case max  
Thermal resistance junction-ambient max  
40  
°C/W  
°C/W  
125  
Maximum lead temperature for soldering  
purpose  
Tl  
260  
°C  
3/13  
Electrical characteristics  
STQ1NE10L  
2
Electrical characteristics  
(T  
= 25°C unless otherwise specified)  
CASE  
Table 3.  
Symbol  
On/off states  
Parameter  
Test conditions  
Min.  
Typ.  
Max.  
Unit  
V(BR)DG Clamped voltage  
ID = 250µA, VGS = 0  
100  
V
VDS = Max rating  
Zero gate voltage  
IDSS  
1
µA  
µA  
VDS = Max rating  
TC = 125°C  
drain current (VGS = 0)  
10  
Gate-body leakage  
IGSS  
VGS = 16 V  
100  
nA  
current (VDS = 0)  
VGS(th) Gate threshold voltage  
VDS = VGS, ID = 250µA  
VGS = 10 V, ID = 0.5 A  
VGS = 5 V, ID = 0.5 A  
1
2.5  
V
0.30  
0.35  
0.40  
0.45  
Static drain-source ON  
RDS(on)  
resistance  
Table 4.  
Symbol  
Dynamic  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
gfs  
Forward transconductance VDS = 15 V, ID = 0.5 µA  
2
S
Input capacitance  
Ciss  
Coss  
Crss  
345  
45  
pF  
pF  
pF  
Output capacitance  
VDS = 25 V, f = 1MHz, VGS = 0  
Reverse transfer  
capacitance  
20  
tr(on)  
tf  
Turn-on time  
Rise time  
VDD = 50 V, ID = 0.5 A,  
RG = 4.7 , VGS = 10 V  
Figure 12  
11  
12  
ns  
ns  
ns  
td(off)  
tf  
Turn-off delay time  
Fall time  
VDD = 50 V, ID = 0.5 A  
20  
13  
ns  
ns  
RG = 4.7, VGS = 5 V  
Figure 12  
Qg  
Qgs  
Qgd  
Total gate charge  
Gate-source charge  
Gate-drain charge  
VDD = 80 V, ID = 1A,  
VGS = 5V  
7
nC  
nC  
nC  
1.5  
3.5  
Figure 13  
4/13  
STQ1NE10L  
Electrical characteristics  
Min. Typ. Max Unit  
Table 5.  
Symbol  
Source drain diode  
Parameter  
Test conditions  
ISD  
Source-drain current  
1
4
A
A
V
(1)  
Source-drain current (pulsed)  
Forward on voltage  
ISDM  
(2)  
ISD=1A, VGS=0  
1.5  
VSD  
trr  
ISD = 1A,  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
52  
90  
ns  
nC  
A
Qrr  
di/dt = 100A/µs,  
VDD=30V, TJ = 100°C  
3.5  
IRRM  
1. Pulse width limited by safe operating area  
2. Pulsed: pulse duration=300µs, duty cycle 1.5%  
5/13  
Electrical characteristics  
STQ1NE10L  
2.1  
Electrical characteristics (curves)  
Figure 1. Safe operating area  
Figure 2. Thermal impedance  
Figure 3. Output characteristics  
Figure 4. Transfer characteristics  
Figure 5. Transconductance  
Figure 6. Static drain-source on resistance  
6/13  
STQ1NE10L  
Electrical characteristics  
Figure 7. Gate charge vs. gate-source voltage Figure 8. Capacitance variations  
Figure 9. Normalized gate threshold voltage Figure 10. Normalized on resistance vs.  
vs. temperature  
temperature  
Figure 11. Source-drain diode forward  
characteristics  
7/13  
Test circuit  
STQ1NE10L  
3
Test circuit  
Figure 12. Switching times test circuit for  
resistive load  
Figure 13. Gate charge test circuit  
Figure 14. Test circuit for inductive load  
switching and diode recovery times  
Figure 15. Unclamped Inductive load test  
circuit  
Figure 16. Unclamped inductive waveform  
8/13  
STQ1NE10L  
Package mechanical data  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in ECOPACK®  
packages. These packages have a Lead-free second level interconnect. The category of  
second level interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label. ECOPACK is an ST trademark.  
ECOPACK specifications are available at: www.st.com  
9/13  
Package mechanical data  
STQ1NE10L  
TO-92 MECHANICAL DATA  
mm.  
inch  
TYP.  
DIM.  
MIN.  
4.32  
0.36  
4.45  
3.30  
2.41  
1.14  
12.70  
2.16  
0.92  
0.41  
TYP  
MAX.  
4.95  
0.51  
4.95  
3.94  
2.67  
1.40  
15.49  
2.41  
1.52  
0.56  
MIN.  
0.170  
0.014  
0.175  
0.130  
0.094  
0.044  
0.50  
MAX.  
0.194  
0.020  
0.194  
0.155  
0.105  
0.055  
0.610  
0.094  
0.060  
0.022  
A
b
D
E
e
e1  
L
R
S1  
W
V
0.085  
0.036  
0.016  
5°  
5°  
10/13  
STQ1NE10L  
Package mechanical data  
11/13  
Revision history  
STQ1NE10L  
5
Revision history  
Table 6.  
Date  
Revision history  
Revision  
Changes  
21-Jun-2004  
31-Oct-2006  
31-Jan-2007  
3
4
5
Complete version  
Document has been reformatted  
Typo mistake on Table 1.  
12/13  
STQ1NE10L  
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www.st.com  
13/13  

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