STRH100N10FSY2 [STMICROELECTRONICS]

72A, 100V, N-CHANNEL, Si, POWER, MOSFET, TO-254AA, HERMETIC SEALED PACKAGE-3;
STRH100N10FSY2
型号: STRH100N10FSY2
厂家: ST    ST
描述:

72A, 100V, N-CHANNEL, Si, POWER, MOSFET, TO-254AA, HERMETIC SEALED PACKAGE-3

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STRH100N10FSY3  
N-channel 100V - 0.024- TO-254AA  
Rad-hard low gate charge STripFET™ Power MOSFET  
PRELIMINARY DATA  
General features  
Type  
VDSS  
STRH100N10FSY3  
100V  
Exceptional dv/dt capability  
100% avalanche tested  
3
Application oriented characterization  
Hermetically sealed  
2
1
TO-254AA  
Description  
This Power MOSFET series realized with  
STMicroelectronics unique STripFET process has  
specifically been designed to improve immunity to  
space effect. It is therefore suitable as power  
switch in mainly high-efficiency DC-DC  
Internal schematic diagram  
converters. It is also intended for any application  
with low gate charge drive requirements.  
Applications  
Satellite  
High reliability  
Order codes  
Part number  
Marking  
Package  
Packaging  
STRH100N10FSY1 (1)  
STRH100N10FSY2 (2)  
STRH100N10FSY3 (3)  
RH100N10FSY1  
RH100N10FSY2  
RH100N10FSY3  
TO-254AA  
TO-254AA  
TO-254AA  
Individual strip pack  
Individual strip pack  
Individual strip pack  
1. Mil temp range  
2. Mil temp range + burn in  
3. Space flights parts (full ESA flow screening)  
July 2006  
Rev 1  
1/9  
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to  
change without notice.  
www.st.com  
9
Electrical ratings  
STRH100N10FSY3  
1
Electrical ratings  
Table 1.  
Symbol  
Absolute maximum ratings (pre-irradiation)  
Parameter  
Value  
Unit  
VDS  
VGS  
Drain-source voltage (VGS = 0)  
100  
V
Gate-source voltage  
14  
72  
V
A
(1)  
ID  
Drain current (continuous) at TC= 25°C  
Drain current (continuous) at TC= 100°C  
Drain current (pulsed)  
(1)  
ID  
52  
A
(2)  
IDM  
288  
A
(1)  
PTOT  
Total dissipation at TC= 25°C  
Peak diode recovery voltage slope  
Storage temperature  
288  
W
dv/dt (3)  
Tstg  
3.7  
V/ns  
°C  
°C  
–55 to 175  
175  
Tj  
Max. operating junction temperature  
1. Rated according to the Rthj-case  
2. Pulse width limited by safe operating area  
3. ISD < 80A, di/dt < 1100A/µs, VDD = 80%V(BR)DSS  
Table 2.  
Symbol  
Thermal data  
Parameter  
Value  
Unit  
Rthj-case Thermal resistance junction-case max  
Rthc-s Case-to-sink typ  
Rthj-amb Thermal resistance junction -amb max  
0.52  
0.21  
48  
°C/W  
°C/W  
°C/W  
Table 3.  
Symbol  
Avalanche characteristics  
Parameter  
Value  
Unit  
Avalanche current, repetitive or not-repetitive  
(pulse width limited by Tj Max)  
IAR  
40  
A
Single pulse avalanche energy  
EAS  
EAR  
3810  
53  
mJ  
mJ  
(starting Tj=25°C, ID=IAR, VDD=50V)  
Repetitive avalanche  
2/9  
STRH100N10FSY3  
Electrical characteristics  
2
Electrical characteristics  
(T  
= 25°C unless otherwise specified)  
CASE  
2.1  
Pre-irradiation  
Table 4.  
Symbol  
On/off states  
Parameter  
Test condictions  
80% BVDss  
Min.  
Typ. Max. Unit  
Zero gate voltage drain  
current (VGS = 0)  
IDSS  
10  
µA  
Gate body leakage current  
(VDS = 0)  
IGSS  
VGS = 14V  
±100  
nA  
Drain-to-source breakdown VGS = 0V, ID = 1mA  
voltage  
100  
V
BVDSS  
VGS(th)  
VDS = VGS, ID = 1mA  
Gate threshold voltage  
2
4.5  
V
V
GS = 12V  
Static drain-source on  
resistance  
RDS(on)  
0.024  
ID = 36A  
Table 5.  
Symbol  
Dynamic  
Parameter  
Test condictions  
Min.  
Typ. Max. Unit  
Ciss  
Coss  
Crss  
Input capacitance  
Output capacitance  
Reverse transfer  
capacitance  
VGS = 0V, VDS = 25V,  
f=1MHz  
6600  
710  
210  
pF  
pF  
pF  
Qg  
Qgs  
Qgd  
Total gate charge  
Gate-to-source charge  
Gate-to-drain (“Miller”)  
charge  
VDD = 50V, ID = 36A,  
VGS=12V  
180  
25.4  
46.2  
nC  
nC  
nC  
f=1MHz Gate DC Bias=0  
Test signal level=20mV  
open drain  
RG  
Gate input resistance  
2
Table 6.  
Symbol  
Switching times  
Parameter  
Test conditions  
Min. Typ.  
Max  
Unit  
td(on)  
tr  
td(off)  
tf  
Turn-on delay time  
Rise time  
37  
60  
ns  
ns  
ns  
ns  
VDD = 50V, ID = 40A,  
Turn-off-delay time  
Fall time  
RG = 4.7, VGS = 12V  
115  
58  
3/9  
Electrical characteristics  
STRH100N10FSY3  
Table 7.  
Symbol  
Source drain diode  
Parameter  
Test Conditions  
Min. Typ. Max Unit  
ISD  
Source-drain current  
72  
A
A
(1)  
ISDM  
Source-drain current (pulsed)  
288  
(2)  
VSD  
trr  
Forward on voltage  
ISD = 72A, VGS = 0  
1.1  
V
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
332  
4.48  
27  
ns  
µC  
A
ISD = 72A, di/dt = 100A/µs  
VDD= 50V, Tj = 25°C  
Qrr  
IRRM  
trr  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
380  
5.62  
29.6  
ns  
µC  
A
ISD = 72A, di/dt = 100A/µs  
VDD= 50V, Tj = 150°C  
Qrr  
IRRM  
1. Pulse width limited by safe operating area  
2. Pulsed: pulse duration = 300µs, duty cycle 1.5%  
2.2  
Radiation characteristics  
(a)  
(@Tj=25°C up to 100Krad  
)
Table 8.  
Symbol  
On/off states  
Parameter  
Test condictions  
80% BVDss  
Min.  
Typ. Max. Unit  
Zero gate voltage drain  
current (VGS = 0)  
IDSS  
10  
µA  
Gate body leakage current  
(VDS = 0)  
IGSS  
VGS = 14V  
±100  
nA  
Drain-to-source breakdown VGS = 0V, ID = 1mA  
voltage  
100  
V
BVDSS  
VGS(th)  
VDS = VGS, ID = 1mA  
Gate threshold voltage  
2
4.5  
V
V
GS = 12V  
Static drain-source on  
resistance  
RDS(on)  
0.024  
ID = 36A  
Table 9.  
Single event effect  
Let  
Let  
VDS(V) @VGS=0  
Ion  
Br  
Energy (MeV)  
(Mev/(mg/cm2))  
range (µm)  
37  
230  
32  
100  
a. According to ESCC 22900 specification, Co60 gamma rays, dose rags:0.1rad/sec.  
4/9  
STRH100N10FSY3  
Electrical characteristics  
2.3  
Electrical characteristics (curves)  
Figure 1.  
Safe operating area  
Figure 2.  
Thermal impedance  
Figure 3.  
Output characteristics  
Figure 4.  
Transfer characteristics  
Figure 5.  
Gate charge vs gate-source voltage Figure 6.  
Capacitance variations  
5/9  
Electrical characteristics  
STRH100N10FSY3  
Figure 7.  
Normalized BV  
vs temperature Figure 8.  
Static drain-source on resistance  
DSS  
Figure 9.  
Normalized gate threshold voltage Figure 10. Normalized on resistance vs  
vs temperature temperature  
Figure 11. Sorce drain-diode forward  
characteristics  
6/9  
STRH100N10FSY3  
Package mechanical data  
3
Package mechanical data  
TO-254 MECHANICAL DATA  
mm.  
TYP  
inch  
TYP.  
DIM.  
MIN.  
13.59  
13.59  
20.07  
6.32  
1.02  
3.53  
16.89  
MAX.  
13.84  
13.84  
20.32  
6.60  
1.27  
3.78  
17.40  
MIN.  
0.535  
0.535  
0.790  
0.249  
0.040  
0.139  
0.665  
MAX.  
0.545  
0.545  
0.80  
0.260  
0.050  
0.149  
0.685  
A
B
C
D
E
F
G
H
I
J
K
6.86  
0.270  
0.89  
1.14  
0.035  
0.510  
0.045  
0.570  
3.81  
3.81  
0.150  
0.150  
L
12.95  
14.50  
M
N
R1  
R2  
3.05  
1.65  
0.120  
0.065  
0.71  
1.0  
0.025  
0.040  
7/9  
Revision history  
STRH100N10FSY3  
4
Revision history  
Table 10. Revision history  
Date  
Revision  
Changes  
03-Jul-2006  
1
First release  
8/9  
STRH100N10FSY3  
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9/9  

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