STTH10002TV1 [STMICROELECTRONICS]

Ultrafast recovery diode; 超快恢复二极管
STTH10002TV1
型号: STTH10002TV1
厂家: ST    ST
描述:

Ultrafast recovery diode
超快恢复二极管

二极管 快恢复二极管 超快恢复二极管
文件: 总8页 (文件大小:110K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STTH10002  
Ultrafast recovery diode  
Main product characteristics  
IF(AV)  
VRRM  
2 x 50 A  
200 V  
Tj (max)  
VF (typ)  
trr (typ)  
150° C  
0.72 V  
30 ns  
K2  
A1  
K1  
A1 K1  
Features and benefits  
A2 K2  
A1  
A2  
A1  
Very low forward losses  
Low recovery time  
High surge current capability  
Insulated  
K1  
K2  
A2  
K1  
– Insulating voltage = 2500 Vrms  
– Capacitance = 45 pF  
A2  
K2  
ISOTOP  
STTH10002TV1  
ISOTOP  
STTH10002TV2  
Description  
The STTH10002 is a dual rectifier suited for  
welding equipment, and high power industrial  
applications.  
Packaged in ISOTOP, this device is intended for  
use in the secondary rectification of power  
converters.  
Order codes  
Part Number  
Marking  
STTH10002TV1  
STTH10002TV2  
STTH10002TV1  
STTH10002TV2  
April 2006  
Rev 1  
1/8  
www.st.com  
Characteristics  
STTH10002  
1
Characteristics  
Table 1.  
Symbol  
Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)  
Parameter Value  
Unit  
VRRM  
Repetitive peak reverse voltage  
200  
150  
V
A
IF(RMS) RMS forward current  
Per diode  
Per diode Tc = 100° C  
Per device Tc = 95° C  
tp = 10 ms Sinusoidal  
IF(AV)  
Average forward current, δ = 0.5  
50  
A
IFSM  
Tstg  
Tj  
Surge non repetitive forward current  
Storage temperature range  
750  
A
-55 to + 175 ° C  
Maximum operating junction temperature  
150  
° C  
Table 2.  
Thermal parameters  
Symbol  
Rth(j-c)  
Rth(c)  
Parameter  
Value  
Unit  
Per diode  
Total  
1
Junction to case  
Coupling  
0.55  
0.1  
° C/W  
When the two diodes 1 and 2 are used simultaneously:  
Tj(diode 1) = P (diode 1) X Rth(j-c) (Per diode) + P (diode 2) x Rth(c)  
Table 3.  
Static electrical characteristics  
Symbol  
Parameter  
Test conditions  
Min.  
Typ  
Max.  
Unit  
Tj = 25° C  
50  
500  
1
(1)  
IR  
Reverse leakage current  
VR = VRRM  
µA  
Tj = 125° C  
Tj = 25° C  
Tj = 125° C  
Tj = 150° C  
50  
IF = 50 A  
IF = 100 A  
IF = 100 A  
IF = 50 A  
IF = 100 A  
1.15  
1.0  
(2)  
0.90  
0.72  
0.86  
VF  
Forward voltage drop  
V
0.80  
0.97  
1. Pulse test: t = 5 ms, δ < 2 %  
p
2. Pulse test: t = 380 µs, δ < 2 %  
p
To evaluate the conduction losses use the following equation:  
2
P = 0.63 x IF(AV) + 0.0034 IF (RMS)  
2/8  
STTH10002  
Characteristics  
Table 4.  
Symbol  
Dynamic characteristics  
Parameter  
Test conditions  
Min. Typ Max. Unit  
IF = 1 A, dIF/dt = -50 A/µs,  
VR = 30 V, Tj = 25 °C  
53  
30  
65  
37  
13  
ns  
trr  
Reverse recovery time  
IF = 1 A, dIF/dt = -200 A/µs,  
VR = 30 V, Tj = 25 °C  
IF = 50 A, dIF/dt = 200 A/µs,  
VR = 160 V, Tj = 125 °C  
IRM  
tfr  
Reverse recovery current  
Forward recovery time  
10  
A
IF = 50 A, dIF/dt = 200 A/µs  
180  
ns  
VFR = 1.1 x VFmax, Tj = 25 °C  
IF = 50 A, dIF/dt = 200 A/µs,  
Tj = 25 °C  
VFP  
Forward recovery voltage  
1.6  
V
Figure 1.  
Peak current versus duty cycle  
Figure 2.  
Forward voltage drop versus  
forward current (typical values, per  
diode)  
IM(A)  
600  
IFM(A)  
300  
250  
200  
150  
100  
50  
T
IM  
500  
400  
300  
200  
100  
tp  
=tp/T  
δd  
P = 100 W  
P = 60 W  
Tj=150°C  
P = 30 W  
Tj=25°C  
VFM(V)  
δ
0
0
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
0.0  
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1.0  
Figure 3.  
Forward voltage drop versus  
forward current (maximum values,  
per diode)  
Figure 4.  
Relative variation of thermal  
impedance, junction to case,  
versus pulse duration  
Zth(j-c)/Rth(j-c)  
IFM(A)  
300  
1.0  
Single pulse  
ISOTOP  
250  
200  
150  
100  
50  
Tj=150°C  
Tj=25°C  
VFM(V)  
tp(s)  
0
0.1  
1.E-03  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.E-02  
1.E-01  
1.E+00  
1.E+01  
3/8  
Characteristics  
STTH10002  
Figure 5.  
Junction capacitance versus  
reverse applied voltage (typical  
values)  
Figure 6.  
Reverse recovery charges versus  
dIF/dt (typical values)  
C(pF)  
QRR(nC)  
450  
400  
350  
300  
250  
200  
150  
100  
50  
1000  
F=1MHz  
osc=30mVRMS  
Tj=25°C  
IF = 50 A  
R=160 V  
V
V
Tj=125 °C  
Tj=25 °C  
VR(V)  
dIF/dt(A/µs)  
100  
0
1
10  
100  
1000  
10  
100  
1000  
Figure 7.  
Reverse recovery time versus dIF/dt Figure 8.  
(typical values)  
Peak reverse recovery current  
versus dIF/dt (typical values)  
tRR(ns)  
IRM(A)  
120  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
20  
16  
12  
8
IF= 50 A  
R=160V  
IF= 50 A  
V
VR= 160 V  
Tj=125 °C  
Tj=25 °C  
Tj=125 °C  
4
Tj=25 °C  
dIF/dt(A/µs)  
dIF/dt(A/µs)  
0
10  
100  
1000  
10  
100  
1000  
Figure 9.  
Dynamic parameters versus  
junction temperature  
QRR; IRM [Tj] / QRR; IRM [Tj=125°C]  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
IF= 50 A  
R=160V  
V
IRM  
QRR  
Tj(°C)  
25  
50  
75  
100  
125  
150  
4/8  
STTH10002  
Ordering information scheme  
2
Ordering information scheme  
STTH 100 02 TVx  
Ultrafast switching diode  
Average forward current  
100 = 100 A  
Repetitive peak reverse voltage  
02 = 200 V  
Package  
TVx = ISOTOP  
5/8  
Package information  
STTH10002  
3
Package information  
Table 5.  
ISOTOP dimensions  
DIMENSIONS  
Millimeters Inches  
REF.  
E
Min.  
Max.  
Min.  
Max.  
G2  
C
A
A1  
B
11.80  
8.90  
12.20  
9.10  
0.465  
0.350  
0.307  
0.030  
0.077  
1.488  
1.240  
0.990  
0.939  
0.480  
0.358  
0.323  
0.033  
0.081  
1.504  
1.248  
1.004  
0.951  
A
A1  
7.8  
8.20  
C2  
E2  
C
0.75  
0.85  
F1  
F
C2  
D
1.95  
2.05  
37.80  
31.50  
25.15  
23.85  
38.20  
31.70  
25.50  
24.15  
D1  
E
P1  
B
E1  
E2  
G
D1  
S
G
D
24.80 typ.  
0.976 typ.  
14.90  
12.60  
3.50  
15.10  
12.80  
4.30  
0.587  
0.496  
0.138  
0.161  
0.181  
0.157  
0.157  
1.185  
0.594  
0.504  
0.169  
0.169  
0.197  
0.69  
G1  
G2  
F
4.10  
4.30  
ØP  
G1  
F1  
P
4.60  
5.00  
4.00  
4.30  
E1  
P1  
S
4.00  
4.40  
0.173  
1.193  
30.10  
30.30  
In order to meet environmental requirements, ST offers these devices in ECOPACK®  
packages. These packages have a lead-free second level interconnect. The category of  
second level interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label. ECOPACK is an ST trademark.  
ECOPACK specifications are available at: www.st.com.  
6/8  
STTH10002  
Ordering information  
4
Ordering information  
Part Number  
Marking  
Package  
Weight Base qty Delivery mode  
STTH10002TV1  
STTH10002TV2  
STTH10002TV1  
STTH10002TV2  
ISOTOP  
ISOTOP  
27 g  
27 g  
10  
10  
Tube  
Tube  
5
Revision history  
Date  
Revision  
Description of Changes  
05-Apr-2006  
1
First issue  
7/8  
STTH10002  
Please Read Carefully:  
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the  
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any  
time, without notice.  
All ST products are sold pursuant to ST’s terms and conditions of sale.  
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no  
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this  
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products  
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such  
third party products or services or any intellectual property contained therein.  
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED  
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED  
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS  
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Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void  
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Information in this document supersedes and replaces all information previously supplied.  
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.  
© 2006 STMicroelectronics - All rights reserved  
STMicroelectronics group of companies  
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www.st.com  
8/8  

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