STTH1002CBY-TR [STMICROELECTRONICS]
Automotive high efficiency ultrafast diode; 汽车高效率超快二极管
| 型号： | STTH1002CBY-TR |
| 厂家： | 
ST |
| 描述： | Automotive high efficiency ultrafast diode |
| 文件： | 总10页 (文件大小：122K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STTH1002C-Y
Automotive high efficiency ultrafast diode
Features
A1
K
■ Suited for SMPS
■ Low losses
A2
■ Low forward and reverse recovery times
■ High junction temperature
■ Low leakage current
K
K
A2
K
K
A1
■ AEC-Q101 qualified
A2
A1
D2PAK
STTH1002CGY
DPAK
STTH1002CBY
Description
Dual center tap rectifier suited for switch mode
power supplies and high frequency DC to DC
converters.
Table 1.
Device summary
2
Packaged in DPAK and D PAK, this device is
Symbol
Value
intended for use in low voltage, high frequency
inverters, free wheeling and polarity protection for
automotive applications.
IF(AV)
VRRM
Up to 2 x 8 A
200 V
Tj (max)
VF(typ)
trr (typ)
175 °C
0.78 V
20 ns
November 2011
Doc ID 17536 Rev 2
1/9
www.st.com
9
Characteristics
STTH1002C-Y
1
Characteristics
Table 2.
Symbol
Absolute ratings (limiting values, per diode)
Parameter
Value
Unit
VRRM Repetitive peak reverse voltage
200
V
D2PAK
DPAK
20
IF(RMS) Forward rms current
A
A
10
Tc = 155 °C Per diode
Tc = 150 °C Per device
Tc = 135 °C Per diode
Tc = 125 °C Per device
tp = 10 ms sinusoidal
5
10
IF(AV) Avarage forward current δ = 0.5
8
16
IFSM
Tstg
Tj
Surge non repetitive forward current
Storage temperature range
50
A
-65 to + 175
-40 to + 175
°C
°C
Operating junction temperature range
Table 3.
Symbol
Thermal parameters
Parameter
Value (max)
Unit
Per diode
Per device
4.0
2.5
1.0
Rth(j-c) Junction to case
Rth(j-c) Coupling
°C/W
When the diodes 1 and 2 are used simultaneously:
Δ T (diode1) = P(diode1) x R (per diode) + P(diode2) x R
th(c)
j
th(j-c)
Table 4.
Symbol
Static electrical characteristics (per diode)
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 25 °C
5
(1)
IR
Reverse leakage current
VR = VRRM
µA
3
40
IF = 5 A
1.1
IF = 10 A
1.25
0.89
1.05
(2)
VF
Forward voltage drop
V
Tj = 150 °C IF = 5 A
Tj = 150 °C IF = 10 A
0.78
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
To evaluate the conduction losses use the following equation:
2
P = 0.73 x I
+ 0.032 I
F(AV)
F (RMS)
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Doc ID 17536 Rev 2
STTH1002C-Y
Characteristics
Table 5.
Symbol
Dynamic electrical characteristics
Parameter
Test conditions
Min.
Typ.
Max.
Unit
IF = 1 A VR = 30 V
dIF/dt = 100 A/µs
trr
IRM
tfr
Reverse recovery time Tj = 25 °C
20
25
ns
Reverse recovery
Tj = 125 °C
current
IF = 5 A
VR = 160 V
5.9
2.4
7.6
A
ns
V
dIF/dt = 200 A/µs
IF = 5 A dIF/dt = 100 A/µs
VFR = 1.1 x VFmax
Forward recovery time Tj = 25 °C
110
Forward recovery
Tj = 25 °C
VFP
IF = 5 A dIF/dt = 100 A/µs
voltage
Doc ID 17536 Rev 2
3/9
Characteristics
STTH1002C-Y
Figure 1.
Peak current versus duty cycle
Figure 2.
Forward voltage drop versus
(per diode)
forward current
(typical values, per diode)
I
(A)
I
(A)
FM
M
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
Tj=150°C
IM
T
P = 10W
P = 5W
tp
=tp/T
δ
Tj=25°C
P = 2W
V
(V)
FM
δ
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00
Figure 3.
Forward voltage drop versus
forward current
(maximum values, per diode)
Figure 4.
Relative variation of thermal
impedance junction to case versus
pulse duration
Z
/R
I
(A)
FM
th(j-c) th(j-c)
1.0
100
90
80
70
60
50
40
30
20
10
0
Tj=150°C
Single pulse
Tj=25°C
V
(V)
FM
t (s)
p
0.1
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00
1.E-03
1.E-02
1.E-01
1.E+00
Figure 5.
Junction capacitance versus
reverse voltage applied
Figure 6.
Reverse recovery charges versus
dI /dt (typical values, per diode)
F
(typical values, per diode)
Q (nC)
rr
C(pF)
240
220
200
180
160
140
120
100
80
100
F=1MHz
VOSC=30mVRMS
Tj=25°C
IF=5A
VR=160V
Tj=125°C
60
40
Tj=25°C
20
V (V)
R
dI /dt(A/µs)
F
10
0
0
50
100
150
200
10
100
1000
4/9
Doc ID 17536 Rev 2
STTH1002C-Y
Characteristics
Figure 7.
Reverse recovery time versus dI /dt Figure 8.
Peak reverse recovery current
F
(typical values, per diode)
versus dI /dt
F
(typical values, per diode)
t (ns)
rr
I
(A)
RM
80
70
60
50
40
30
20
10
0
13
12
11
10
9
IF=5A
VR=160V
IF=5A
VR=160V
Tj=125°C
8
7
Tj=125°C
6
5
4
3
Tj=25°C
Tj=25°C
2
1
dI /dt(A/µs)
F
dI /dt(A/µs)
F
0
10
100
1000
10
100
1000
Figure 9.
Dynamic parameters versus
junction temperature
Figure 10. Thermal resistance junction to
ambient versus copper surface
2
under tab for D PAK
Q ;I [T ]/Q ;I [T =125°C]
R
th(j-a)
(°C/W)
rr RM
j
rr RM
j
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
80
70
60
50
40
30
20
10
0
IF=5A
VR=160V
Epoxy printed circuit board FR4, copper thickness = 35 µm
IRM
Qrr
T (°C)
j
S(Cu)(cm²)
25
50
75
100
125
150
0
2
4
6
8
10
12
14
16
18
20
Figure 11. Thermal resistance junction to ambient versus copper surface under tab (Epoxy
printed circuit board FR4, copper thickness = 35 µm) for DPAK
R (°C/W)
th(j-a)
100
90
80
70
60
50
40
30
20
10
0
S(Cu)(cm²)
0
2
4
6
8
10
12
14
16
18
20
Doc ID 17536 Rev 2
5/9
Package mechanical data
STTH1002C-Y
2
Package mechanical data
●
●
Epoxy meets UL94, V0
Cooling method: by conduction (method C)
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
Table 6.
DPAK dimensions
Dimensions
Millimeters
Min. Max.
Ref.
Inches
Min. Max.
A
A1
A2
B
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
6.40
4.40
9.35
2.40
1.10
0.23
0.90
5.40
0.60
0.60
6.20
6.60
4.60
10.10
0.086
0.035
0.001
0.025
0.204
0.017
0.018
0.236
0.251
0.173
0.368
0.094
0.043
0.009
0.035
0.212
0.023
0.023
0.244
0.259
0.181
0.397
E
A
B2
C2
L2
B2
C
D
R
H
L4
C2
D
A1
R
B
G
C
E
A2
G
0.60 MIN.
H
V2
L2
L4
V2
0.80 typ.
0.031 typ.
0.60
0°
1.00
8°
0.023
0°
0.039
8°
Figure 12. Footprint (dimensions in mm)
1.6
6.7
3
3
2.3
6.7
2.3
1.6
6/9
Doc ID 17536 Rev 2
STTH1002C-Y
Package mechanical data
Dimensions
2
Table 7.
D PAK dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
A1
A2
B
4.40
2.49
0.03
0.70
1.14
0.45
1.23
8.95
10.00
4.88
15.00
1.27
1.40
2.40
4.60
2.69
0.23
0.93
1.70
0.60
1.36
9.35
10.40
5.28
15.85
1.40
1.75
3.20
0.173
0.098
0.001
0.027
0.045
0.017
0.048
0.352
0.393
0.192
0.590
0.050
0.055
0.094
0.181
0.106
0.009
0.037
0.067
0.024
0.054
0.368
0.409
0.208
0.624
0.055
0.069
0.126
A
E
C2
L2
D
B2
C
L
L3
A1
C2
D
B2
B
R
C
E
G
G
A2
L
M
*
L2
L3
M
V2
* FLAT ZONE NO LESS THAN 2mm
R
0.40 typ.
0.016 typ.
V2
0°
8°
0°
8°
Figure 13. Footprint (dimensions in mm)
16.90
10.30
5.08
1.30
3.70
8.90
Doc ID 17536 Rev 2
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Ordering information
STTH1002C-Y
3
Ordering information
Table 8.
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
STTH1002CBY-TR
STTH1002CGY-TR
STTH1002CY
DPAK
0.3 g
2500
1000
Tape and reel
STTH1002CGY
D2PAK
1.48 g
4
Revision history
Table 9.
Document revision history
Date
21-Oct-2010
03-Nov-2011
Revision
Changes
1
2
First issue.
Updated Table 7 and Table 8.
8/9
Doc ID 17536 Rev 2
STTH1002C-Y
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