STTH10R04B [STMICROELECTRONICS]

High efficiency rectifier; 高效率整流
STTH10R04B
型号: STTH10R04B
厂家: ST    ST
描述:

High efficiency rectifier
高效率整流

文件: 总11页 (文件大小:165K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STTH10R04  
High efficiency rectifier  
Features  
A
K
Ultrafast recovery  
Low power losses  
K
High surge capability  
Low leakage current  
High junction temperature  
A
A
NC  
K
D2PAK  
TO-220FPAC  
STTH10R04G  
STTH10R04FP  
Description  
K
K
The STTH10R04 is an ultrafast recovery power  
rectifier dedicated to energy recovery in PDP  
application.  
A
NC  
A
K
DPAK  
STTH10R04B  
TO-220AC  
STTH10R04D  
It is especially designed for clamping function in  
energy recovery block.  
The compromise between forward voltage drop  
and recovery time offers optimized performances.  
Table 1.  
Device summary  
IF(peak)  
10 A  
400 V  
15 ns  
VRRM  
trr (typ)  
Tj  
175 °C  
1.15 V  
VF (typ)  
November 2007  
Rev 1  
1/11  
www.st.com  
11  
Characteristics  
STTH10R04  
1
Characteristics  
Table 2.  
Symbol  
Absolute ratings (limiting values)  
Parameter  
Value  
Unit  
VRRM  
Repetitive peak reverse voltage  
400  
20  
V
A
IF(RMS) Forward current (rms)  
Tc = 135 °C δ = 0.5  
DPAK, TO-220AC, D2PAK  
TO-220FPAC  
Square signal  
Peak working  
IF(peak)  
10  
A
A
forward current  
Tc = 130 °C δ = 0.5  
Square signal  
IFSM  
Tstg  
Tj  
Surge non-repetitive forward current  
Storage temperature range  
tp = 10 ms sinusoidal  
100  
-65 to + 175  
175  
°C  
°C  
Maximum operating junction temperature  
Table 3.  
Symbol  
Thermal parameters  
Parameter  
Value  
Unit  
DPAK, TO-220AC, D2PAK  
TO-220FPAC  
3.5  
6
Rth(j-c)  
Junction to case  
°C/W  
Table 4.  
Symbol  
Static electrical characteristics  
Parameter  
Test conditions  
Min  
Typ  
Max  
Unit  
Tj = 25 °C  
Tj = 125 °C  
Tj = 25 °C  
Tj = 125 °C  
10  
100  
1.7  
(1)  
IR  
Reverse leakage current  
VR = VRRM  
IF = 10 A  
µA  
10  
1.5  
(2)  
VF  
Forward voltage drop  
V
1.15  
1.35  
1. Pulse test: tp = 5 ms, δ < 2%  
2. Pulse test: tp = 380 µs, δ < 2%  
To evaluate the conduction losses use the following equation:  
2
P = 1.05 x I  
+ 0.03 I  
F(AV)  
F (RMS)  
Table 5.  
Symbol  
Recovery characteristics  
Parameter  
Test conditions  
Min Typ Max Unit  
IF = 0.5 A, Irr = 0.25 A, IR = 1 A  
15  
20  
40  
trr  
Reverse recovery time  
Forward recovery time  
Tj = 25 °C  
ns  
IF = 1 A, VR = 30 V, dIF/dt = -50 A/µs  
IF = 10 A, dIF/dt = 100 A/µs  
VFR = 1.1 x VFmax  
tfr  
Tj = 25 °C  
140 ns  
VFP  
IRM  
Peak forward voltage  
Tj = 25 °C IF = 10 A , dIF/dt = 100 A/µs  
3
8
V
A
Reverse recovery current  
6.2  
0.3  
IF = 10 A, VCC = 200 V  
Tj = 125 °C  
dIF/dt = 200 A/µs  
Sfactor Softness factor  
2/11  
STTH10R04  
Figure 1.  
Characteristics  
Conduction losses versus  
average forward current  
Figure 2.  
Forward voltage drop versus  
forward current  
I
(A)  
FM  
P (W)  
200  
180  
160  
140  
120  
100  
80  
18  
d=0.2  
d=1  
d=0.5  
d=0.1  
16  
14  
12  
10  
8
Tj=125°C  
(Maximum values)  
d=0.05  
Tj=125°C  
(Typical values)  
Tj=25°C  
(Maximum values)  
6
60  
T
4
40  
2
20  
I
(A)  
V
(V)  
F(av)  
FM  
0
0
0
2
4
6
8
10  
12  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
Figure 3.  
Relative variation of thermal  
Figure 4.  
Relative variation of thermal  
impedance junction to case versus  
pulse duration  
impedance junction to case versus  
pulse duration  
Zth(j-c)/Rth(j-c)  
Zth(j-c)/Rth(j-c)  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
Single pulse  
PAK  
DPAK  
Single pulse  
TO-220FPAC  
tP(s)  
tP(s)  
1.E-03  
1.E-02  
1.E-01  
1.E+00  
1.E+01  
1.E-04  
1.E-03  
1.E-02  
1.E-01  
1.E+00  
Figure 5.  
Peak reverse recovery current  
Figure 6.  
Reverse recovery time versus  
versus dI /dt (typical values)  
dI /dt (typical values)  
F
F
t (ns)  
rr  
I
(A)  
RM  
80  
70  
60  
50  
40  
30  
20  
10  
0
14  
13  
12  
11  
10  
9
8
7
6
5
IF=IF(AV)  
VR=200V  
Tj=125°C  
IF=IF(AV)  
VR=200V  
Tj=125°C  
4
3
2
1
dI /dt(A/µs)  
F
dI /dt(A/µs)  
F
0
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
500  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
500  
3/11  
Characteristics  
STTH10R04  
Figure 7.  
Reverse recovery charges versus Figure 8.  
dI /dt (typical values)  
Reverse recovery softness factor  
versus dI /dt (typical values)  
F
F
QRR(nC)  
S
factor  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
300  
250  
200  
150  
100  
50  
IF=IF(AV)  
VR=200V  
Tj=125°C  
IF < 2 x IF(AV)  
VR=200V  
Tj=125°C  
dI /dt(A/µs)  
F
dI /dt(A/µs)  
F
0
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
500  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
500  
Figure 9.  
Relative variations of dynamic  
parameters versus junction  
temperature  
Figure 10. Transient peak forward voltage  
versus dI /dt (typical values)  
F
V
(V)  
FP  
3.0  
2.8  
2.6  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
25  
12  
11  
10  
9
IF=IF(AV)  
VR=200V  
Reference: Tj=125°C  
IF=IF(AV)  
Tj=125°C  
SFACTOR  
8
7
6
5
4
IRM  
3
2
QRR  
T (°C)  
dI /dt(A/µs)  
F
j
1
0
50  
75  
100  
125  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
500  
4/11  
STTH10R04  
Characteristics  
Figure 11. Forward recovery time  
Figure 12. Junction capacitance versus  
versus dI /dt (typical values)  
reverse voltage applied (typical  
values)  
F
C(pF)  
t (ns)  
fr  
100  
200  
180  
160  
140  
120  
100  
80  
F=1MHz  
OSC=30mVRMS  
Tj=25°C  
IF=IF(AV)  
VFR=1.1 x VF max.  
Tj=125°C  
V
60  
40  
20  
dI /dt(A/µs)  
F
VR(V)  
0
10  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
500  
1
10  
100  
1000  
Figure 13. Thermal resistance, junction to  
ambient, versus copper surface  
under tab (epoxy printed board  
Figure 14. Thermal resistance, junction to  
ambient, versus copper surface  
under tab (epoxy printed board  
FR4, copper thickness = 35 µm)  
DPAK  
FR4, copper thickness = 35 µm)  
2
D PAK  
Rth(j-a)(°C/W)  
Rth(j-a)(°C/W)  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
80  
70  
60  
50  
40  
30  
20  
10  
0
DPAK  
PAK  
SCU(cm²)  
20  
SCU(cm²)  
20  
0
5
10  
15  
25  
30  
35  
40  
0
5
10  
15  
25  
30  
35  
40  
5/11  
Package information  
STTH10R04  
2
Package information  
Epoxy meets UL94, V0  
Cooling method: by conduction (C)  
Recommended torque calue: 0.8 N·m  
Maximum torque value: 1.0 N·m  
In order to meet environmental requirements, ST offers these devices in ECOPACK®  
packages. These packages have a lead-free second level interconnect. The category of  
second level interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label. ECOPACK is an ST trademark.  
ECOPACK specifications are available at: www.st.com.  
Table 6.  
TO-220AC dimensions  
Dimensions  
Millimeters  
Ref.  
Inches  
Min.  
Max.  
Min.  
Max.  
A
C
4.40  
1.23  
2.40  
0.49  
0.61  
1.14  
4.95  
10.00  
4.60  
1.32  
2.72  
0.70  
0.88  
1.70  
5.15  
10.40  
0.173  
0.048  
0.094  
0.019  
0.024  
0.044  
0.194  
0.393  
0.181  
0.051  
0.107  
0.027  
0.034  
0.066  
0.202  
0.409  
A
H2  
Ø I  
C
D
L5  
L7  
E
F
L6  
F1  
G
L2  
D
F1  
L9  
H2  
L2  
L4  
L5  
L6  
L7  
L9  
M
16.40 typ.  
0.645 typ.  
L4  
13.00  
2.65  
14.00  
2.95  
0.511  
0.104  
0.600  
0.244  
0.137  
0.551  
0.116  
0.620  
0.259  
0.154  
F
M
E
15.25  
6.20  
15.75  
6.60  
G
3.50  
3.93  
2.6 typ.  
0.102 typ.  
Diam. I  
3.75  
3.85  
0.147  
0.151  
6/11  
STTH10R04  
Package information  
Dimensions  
Table 7.  
TO-220FPAC dimensions  
Ref.  
Millimeters  
Inches  
Min.  
Max.  
Min.  
Max.  
A
B
4.4  
2.5  
4.6  
2.7  
0.173  
0.098  
0.098  
0.018  
0.030  
0.045  
0.195  
0.094  
0.393  
0.181  
0.106  
0.108  
0.027  
0.039  
0.067  
0.205  
0.106  
0.409  
A
B
H
D
2.5  
2.75  
0.70  
1
E
0.45  
0.75  
1.15  
4.95  
2.4  
Dia  
F
L6  
L5  
F1  
G
1.70  
5.20  
2.7  
L2  
L3  
L7  
G1  
H
10  
10.4  
D
F1  
L2  
L3  
L4  
L5  
L6  
L7  
Dia.  
16 Typ.  
0.63 Typ.  
L4  
28.6  
9.8  
30.6  
10.6  
3.6  
1.126  
0.386  
0.114  
0.626  
0.354  
0.118  
1.205  
0.417  
0.142  
0.646  
0.366  
0.126  
F
E
G1  
2.9  
G
15.9  
9.00  
3.00  
16.4  
9.30  
3.20  
7/11  
Package information  
Table 8.  
STTH10R04  
Inches  
DPAK dimensions  
Dimensions  
Millimeters  
Min. Max.  
Ref.  
Min.  
Max.  
A
A1  
A2  
B
2.20  
0.90  
0.03  
0.64  
5.20  
0.45  
0.48  
6.00  
6.40  
4.40  
9.35  
2.40  
1.10  
0.23  
0.90  
5.40  
0.60  
0.60  
6.20  
6.60  
4.60  
10.10  
0.086  
0.035  
0.001  
0.025  
0.204  
0.017  
0.018  
0.236  
0.251  
0.173  
0.368  
0.094  
0.043  
0.009  
0.035  
0.212  
0.023  
0.023  
0.244  
0.259  
0.181  
0.397  
E
A
B2  
C2  
L2  
B2  
C
D
R
H
L4  
C2  
D
A1  
R
B
G
C
E
A2  
G
0.60 MIN.  
H
V2  
L2  
L4  
V2  
0.80 typ.  
0.031 typ.  
0.60  
0°  
1.00  
8°  
0.023  
0°  
0.039  
8°  
Figure 15. DPAK footprint (dimensions in mm)  
1.6  
6.7  
3
3
2.3  
6.7  
2.3  
1.6  
8/11  
STTH10R04  
Package information  
Dimensions  
2
Table 9.  
D PAK dimensions  
Ref.  
Millimeters  
Inches  
Min.  
Max.  
Min.  
Max.  
A
A1  
A2  
B
4.40  
2.49  
0.03  
0.70  
1.14  
0.45  
1.23  
8.95  
10.00  
4.88  
15.00  
1.27  
1.40  
2.40  
4.60  
2.69  
0.23  
0.93  
1.70  
0.60  
1.36  
9.35  
10.40  
5.28  
15.85  
1.40  
1.75  
3.20  
0.173  
0.098  
0.001  
0.027  
0.045  
0.017  
0.048  
0.352  
0.393  
0.192  
0.590  
0.050  
0.055  
0.094  
0.181  
0.106  
0.009  
0.037  
0.067  
0.024  
0.054  
0.368  
0.409  
0.208  
0.624  
0.055  
0.069  
0.126  
A
E
C2  
L2  
D
B2  
C
L
L3  
A1  
C2  
D
B2  
B
R
C
E
G
G
A2  
L
M
*
L2  
L3  
M
V2  
* FLAT ZONE NO LESS THAN 2mm  
R
0.40 typ.  
0.016 typ.  
V2  
0°  
8°  
0°  
8°  
2
Figure 16. D PAK footprint (dimensions in mm)  
16.90  
10.30  
5.08  
1.30  
3.70  
8.90  
9/11  
Ordering information  
STTH10R04  
3
Ordering information  
Table 10. Ordering information  
Order code  
Marking  
Package  
Weight  
Base qty Delivery mode  
STTH10R04FP  
STTH10R04B  
STTH10R04FP  
STTH10R04B  
STTH10R04B  
STTH10R04G  
STTH10R04G  
STTH10R04D  
TO-220FPAC  
1.64 g  
50  
75  
Tube  
Tube  
DPAK  
0.3g  
STTH10R04B-TR  
STTH10R04G  
2500  
50  
Tape and reel  
Tube  
D2PAK  
1.48 g  
1.86 g  
STTH10R04G-TR  
STTH10R04D  
1000  
50  
Tape and reel  
Tube  
TO-220AC  
4
Revision history  
Table 11. Document revision history  
Date  
Revision  
Description of changes  
07-Nov-2007  
1
First issue  
10/11  
STTH10R04  
Please Read Carefully:  
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the  
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any  
time, without notice.  
All ST products are sold pursuant to ST’s terms and conditions of sale.  
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no  
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this  
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products  
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such  
third party products or services or any intellectual property contained therein.  
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WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED  
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS  
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.  
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Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void  
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any  
liability of ST.  
ST and the ST logo are trademarks or registered trademarks of ST in various countries.  
Information in this document supersedes and replaces all information previously supplied.  
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© 2007 STMicroelectronics - All rights reserved  
STMicroelectronics group of companies  
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www.st.com  
11/11  

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