STTH4R06DEE [STMICROELECTRONICS]

Turbo 2 ultrafast recovery diode; 涡轮2超快恢复二极管
STTH4R06DEE
型号: STTH4R06DEE
厂家: ST    ST
描述:

Turbo 2 ultrafast recovery diode
涡轮2超快恢复二极管

二极管 快恢复二极管 超快恢复二极管
文件: 总9页 (文件大小:88K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STTH4R06DEE  
Turbo 2 ultrafast recovery diode  
Datasheet production data  
Features  
NC  
Very low switching losses  
A
K
A
High frequency and high pulse current  
operation  
A
Low thermal resistance  
High junction temperature  
NC  
A
A
A
A
A
®
A
ECOPACK 2 compliant component  
NC  
Description  
K
K
The STTH4R06 series uses ST’s new 600 V  
planar Pt doping technology. The STTH4R06 is  
specially suited for switching mode base drive and  
transistor circuits.  
PowerFLAT(3.3 x 3.3)  
STTH4R06DEE-TR  
Packaged in PowerFLAT™, this device is  
intended for use in low profile applications.  
Table 1.  
Device summary  
Symbol  
Value  
IF(AV)  
VRRM  
4 A  
600 V  
150 °C  
1.0 V  
30 ns  
Tj (max)  
VF (typ)  
TRR (typ)  
TM: PowerFLAT is a trademark of STMicroelectronics  
September 2012  
Doc ID 023262 Rev 1  
1/8  
This is information on a product in full production.  
www.st.com  
8
Characteristics  
STTH4R06DEE  
1
Characteristics  
Table 2.  
Symbol  
Absolute ratings (limiting values T  
Parameter  
= 25 °C unless otherwise specified)  
amb  
Value  
Unit  
V
VRRM  
IF(RMS)  
IF(AV)  
IFSM  
Tstg  
Repetitive peak reverse voltage  
Forward rms current  
600  
15  
A
Average forward current  
Tc = 120 °C, = 0.5  
4
60  
A
Surge non repetitive forward current tp = 10 ms sinusoidal  
Storage temperature range  
A
-65 to +150  
150  
°C  
°C  
Tj  
Maximum operating junction temperature  
Table 3.  
Symbol  
Thermal resistance  
Parameter  
Value  
Unit  
Rth(j-c) Junction to case  
4.5  
°C/W  
Junction to ambient on printed circuit board (with recommended  
footprint, copper thickness = 35 µm)  
Rth(j-a)  
250  
°C/W  
Table 4.  
Symbol  
Static electrical characteristics  
Parameter  
Test conditions  
Min.  
Typ.  
Max.  
Unit  
Tj = 25 °C  
Tj = 125 °C  
Tj = 25 °C  
Tj = 150 °C  
-
-
3
µA  
µA  
Reverse leakage  
current  
(1)  
IR  
VR = VRRM  
IF = 4A  
3
30  
1.30  
1.0  
1.70  
1.25  
(2)  
VF  
Forward voltage drop  
V
-
1. Pulse test: tp = 5 ms, < 2%  
2. Pulse test: tp = 380 µs, < 2%  
To evaluate the conduction losses use the following equation:  
2
P = 1 x IF(AV) + 0.062 x IF (RMS)  
Table 5.  
Symbol  
Dynamic electrical characteristics  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
Reverse recovery  
current  
IRM  
5.5  
2
7.5  
A
IF = 4 A, VR = 400 V,  
dlF/dt = -200 A/µs  
Tj = 125 °C  
Sfactor Softness factor  
IF = 1A, VR = 30 V,  
dlF/dt = -50 A/µs  
35  
50  
trr  
Reverse recovery time Tj = 25 °C  
ns  
IF = 1A, VR = 30 V,  
dlF/dt = -100 A/µs  
30  
40  
100  
5
tfr  
Forward recovery time Tj = 25 °C  
ns  
V
IF = 4 A, VFR = 2 V  
dlF/dt = 100 A/µs  
Forward recovery  
Tj = 25 °C  
VFP  
3.5  
voltage  
2/8  
Doc ID 023262 Rev 1  
STTH4R06DEE  
Characteristics  
Figure 1.  
Average forward power dissipation Figure 2.  
Forward voltage drop versus  
versus average forward current  
forward current  
I
(A)  
FM  
P
(W)  
F(AV)  
8
7
6
5
4
3
2
1
0
100.0  
10.0  
1.0  
δ = 0.05  
δ = 0.2  
δ = 0.1  
δ = 0.5  
δ = 1  
Tj=150 °C  
(Typical values)  
Tj=150 °C  
(Maximum values)  
Tj=25 °C  
(Maximum values)  
T
tp  
=tp/T  
I
(A)  
3
δ
F(AV)  
V
(V)  
FM  
0.1  
0
1
2
4
5
6
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
Figure 3.  
Relative variation of thermal  
impedance junction to case versus  
pulse duration  
Figure 4.  
Peak reverse recovery current  
versus dl /dt (typical values)  
F
Z
/R  
th(j-c) th(j-c)  
IRM(A)  
12  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
IF=IF(AV)  
VR=400 V  
Tj=125 °C  
10  
8
6
4
2
0
Single pulse  
dIF/dt(A/µs)  
400 450  
t
(s)  
p
0
50  
100  
150  
200  
250  
300  
350  
500  
1.E-04  
1.E-03  
1.E-02  
1.E-01  
1.E+00  
Figure 5.  
Reverse recovery time versus dl /dt Figure 6.  
(typical values)  
Reverse recovery charges versus  
dl /dt (typical values)  
F
F
t
RR(ns)  
QRR(nC)  
320  
280  
240  
200  
160  
120  
80  
240  
200  
160  
120  
80  
IF=IF(AV)  
VR=400 V  
Tj=125 °C  
IF=IF(AV)  
VR=400 V  
Tj=125 °C  
40  
40  
dIF/dt(A/µs)  
400 450  
dIF/dt(A/µs)  
0
0
0
50  
100  
150  
200  
250  
300  
350  
500  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
500  
Doc ID 023262 Rev 1  
3/8  
Characteristics  
STTH4R06DEE  
Figure 7.  
Reverse recovery softness factor  
versus dl /dt (typical values)  
Figure 8.  
Relative variation of dynamic  
parameters versus junction  
temperature  
F
1.20  
1.00  
0.80  
0.60  
0.40  
0.20  
SFACTOR  
4.0  
IF=IF(AV)  
VR=400 V  
Tj=125 °C  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
IRM  
SFACTOR  
QRR  
IF=IF(AV)  
VR=400 V  
Reference: Tj=125 °C  
Tj(°C)  
75  
dIF/dt(A/µs)  
0.00  
25  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
500  
50  
100  
125  
Figure 9.  
Transient peak forward voltage  
Figure 10. Forward recovery time versus dl /dt  
F
versus dl /dt (typical values)  
(typical values)  
F
VFP(V)  
12  
t
fr(ns)  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
IF=IF(AV)  
VFR=2V  
Tj=125 °C  
IF=IF(AV)  
Tj=125 °C  
10  
8
6
4
2
dIF/dt(A/µs)  
dIF/dt(A/µs)  
0
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
500  
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
500  
Figure 11. Junction capacitance versus  
reverse voltage applied (typical  
values)  
Figure 12. Thermal resistance junction to  
ambient versus copper surface  
under tab  
C(pF)  
100  
R
(°C/W)  
th(j-a)  
250  
200  
150  
100  
50  
F=1 MHz  
OSC=30 mVRMS  
Tj=25 °C  
PowerFLAT (3.3x3.3)  
epoxy printed board FR4, copper thickness=35µm  
V
10  
S
(cm²)  
9
Cu  
V
(V)  
R
1
0
1
10  
100  
1000  
0
1
2
3
4
5
6
7
8
10  
4/8  
Doc ID 023262 Rev 1  
STTH4R06DEE  
Package information  
2
Package information  
Epoxy meets UL94,V0  
Lead-free package  
In order to meet environmental requirements, ST offers these devices in different grades of  
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK  
specifications, grade definitions and product status are available at: www.st.com.  
®
ECOPACK is an ST trademark.  
Figure 13. PowerFLAT (3.3 x 3.3) dimensions (definitions)  
Exposed pad  
L
E
E2  
E/2  
L1  
A3  
b
nc  
a
nc  
a
D/2  
e/2  
e
D
D2  
k
k
A
Index area  
(D/2 x E/2)  
0.10 mm Ref.  
0.10 mm Ref.  
0.20 mm Ref.  
Projection  
Table 6.  
PowerFLAT (3.3 x 3.3) dimensions (values)  
Dimensions  
Ref.  
Millimeters  
Typ.  
Inches  
Typ.  
Min.  
Max.  
Min.  
Max.  
A
A3  
b
0.95  
1.0  
0.037  
0.039  
0.2  
0.008  
0.013  
0.130  
0.090  
0.130  
0.067  
0.026  
0.016  
0.20  
0.29  
3.20  
2.24  
3.20  
1.66  
0.34  
3.30  
2.29  
3.30  
1.71  
0.65  
0.40  
0.50  
0.39  
3.40  
2.34  
3.40  
1.76  
0.011  
0.126  
0.088  
0.126  
0.065  
0.015  
0.134  
0.092  
0.134  
0.069  
D
D2  
E
E2  
e
L
L1  
0.45  
0.55  
0.018  
0.22  
Doc ID 023262 Rev 1  
5/8  
Package information  
Figure 14. Footprint (dimensions in mm)  
STTH4R06DEE  
2.39  
1.195  
2.21  
3.4  
0.59  
0.6  
0.65  
0.325  
0.44  
6/8  
Doc ID 023262 Rev 1  
STTH4R06DEE  
Ordering information  
3
Ordering information  
Table 7.  
Ordering information  
Order code  
Marking  
Package  
Weight Base qty Delivery mode  
PowerFLAT  
(3.3 x 3.3)  
Tape and reel  
STTH4R06DEE-TR  
TH4R06  
34 mg  
3000  
13” reel  
4
Revision history  
Table 8.  
Date  
11-Sep-2012  
Document revision history  
Revision  
Changes  
1
First issue.  
Doc ID 023262 Rev 1  
7/8  
STTH4R06DEE  
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