STTH5R06G-TR [STMICROELECTRONICS]
TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER; TURBO 2超快高压整流
| 型号： | STTH5R06G-TR |
| 厂家： | 
ST |
| 描述： | TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER |
| 文件： | 总8页 (文件大小：138K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
®
STTH5R06D/FP/B/G
TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER
K
MAIN PRODUCT CHARACTERISTICS
IF(AV)
5 A
600 V
5 A
VRRM
IRM (typ.)
Tj (max)
VF (max)
trr (max)
A
A
175 °C
1.8 V
40 ns
K
K
TO-220AC
TO-220FPAC
STTH5R06D
STTH5R06FP
FEATURES AND BENEFITS
K
K
■
■
■
■
Ultrafast switching
Low reverse recovery current
Reduces switching losses
Low thermal resistance
A
A
NC
NC
DPAK
STTH5R06B
D2PAK
STTH5R06G
DESCRIPTION
The STTH5R06D/FP/B/G, which is using ST
Turbo 2 600V technology, is specially suited as
boost diode in continuous mode power factor
corrections and hard switching conditions.
The
device
(available
in
TO-220AC,
TO-220FPAC, D2PAK and DPAK) is also intended
for use as a free wheeling diode in power supplies
and other power switching applications.
ABSOLUTE RATINGS (limiting values)
Symbol
VRRM
Parameter
Value
600
20
Unit
Repetitive peak reverse voltage
RMS forward current
V
A
A
A
IF(RMS)
TO-220AC / TO-220FPAC / D2PAK
DPAK
10
IF(AV)
Average forward current
TO-220AC
5
Tc = 105°C δ = 0.5
TO-220FPAC
DPAK / D2PAK
IFSM
Tstg
Tj
Surge non repetitive forward current
Storage temperature range
tp = 10 ms Sinusoidal
50
A
- 65 + 175 °C
175 °C
Maximum operating junction temperature
October 2002 - Ed: 3B
1/8
STTH5R06D/FP/B/G
THERMAL RESISTANCES
Symbol
Parameter
TO-220AC / DPAK / D2PAK
TO-220FPAC
Value
3.0
Unit
Rth (j-c) Junction to case
°C/W
5.5
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Tests conditions
Min. Typ. Max.
Unit
IR
Reverse leakage
current
VR = 600V
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
20
µA
25
250
2.9
1.8
VF
Forward voltage drop IF = 5 A
V
1.4
To evaluate the maximum2conduction losses use the following equation :
P = 1.16 x IF(AV) + 0.128 IF (RMS)
DYNAMIC ELECTRICAL CHARACTERISTICS
Symbol
Tests conditions
Min.
Typ. Max. Unit
trr
IF = 0.5 A Irr = 0.25 A IR = 1A Tj = 25°C
25
40
ns
IF = 1 A dIF/dt = - 50 A/µs
VR = 30V
IRM
S factor
Qrr
VR = 400 V IF = 5A
dIF/dt = - 200A/µs
Tj = 125°C
Tj = 25°C
5.0
0.35
110
6.0
A
nC
ns
V
tfr
IF = 5 A
dIF/dt = 40 A/µs
150
4.5
VFR = 1.1 x VFmax
VFP
Fig. 1: Conduction losses versus average current.
Fig. 2: Forward voltage drop versus forward
current.
P(W)
13
IFM(A)
50
δ = 0.1
δ = 0.2
δ = 0.05
δ = 0.5
12
11
10
9
45
40
δ = 1
Tj=125°C
(Maximum values)
35
8
30
7
25
Tj=125°C
(Typical values)
6
20
5
4
15
10
5
Tj=25°C
(Maximum values)
T
3
2
1
IF(av)(A)
VFM(V)
4
tp
=tp/T
δ
0
0
0
1
2
3
4
5
6
7
0
1
2
3
5
6
2/8
STTH5R06D/FP/B/G
Fig. 3-1: Relative variation of thermal impedance
junction to case versus pulse duration (TO-220AC,
DPAK, D2PAK).
Fig. 3-2: Relative variation of thermal impedance
junction to case versus pulse duration
(TO-220FPAC).
Zth(j-c)/Rth(j-c)
1.0
Zth(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
0.9
0.8
0.7
δ = 0.5
0.6
0.6
δ = 0.5
0.5
0.5
0.4
0.4
δ = 0.2
δ = 0.1
0.3
δ = 0.2
0.3
T
T
0.2
δ = 0.1
0.2
Single pulse
0.1
tp(s)
0.1
tp
1.E+00
tp(s)
Single pulse
=tp/T
δ
tp
1.E+01
=tp/T
δ
0.0
1.E-03
0.0
1.E-03
1.E-02
1.E-01
1.E-02
1.E-01
1.E+00
Fig. 4: Peak reverse recovery current versus
dIF/dt (90% confidence).
Fig. 5: Reverse recovery time versus dIF/dt
(90% confidence).
IRM(A)
trr(ns)
80
22
VR=400V
VR=400V
Tj=125°C
20
Tj=125°C
IF=2 x IF(av)
70
18
60
16
IF=2 x IF(av)
IF=IF(av)
14
IF=0.5 x IF(av)
50
IF=IF(av)
12
IF=0.5 x IF(av)
40
IF=0.25 x IF(av)
10
30
20
8
6
4
10
2
dIF/dt(A/µs)
dIF/dt(A/µs)
0
0
0
200
400
600
800
1000
0
200
400
600
800
1000
Fig. 7: Softness factor versus dIF/dt (typical
values).
Fig. 6: Reverse recovery charges versus dIF/dt
(90% confidence).
Qrr(nC)
350
S factor
0.70
IF=IF(av)
VR=400V
Tj=125°C
VR=400V
Tj=125°C
IF=2 x IF(av)
0.65
300
250
200
150
100
50
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
IF=IF(av)
IF=0.5 x IF(av)
0.15
dIF/dt(A/µs)
dIF/dt(A/µs)
0.10
0
0
200
400
600
800
1000
0
200
400
600
800
1000
3/8
STTH5R06D/FP/B/G
Fig. 9: Transient peak forward voltage versus
dIF/dt (90% confidence).
Fig. 8: Relative variation of dynamic
parameters versus junction temperature.
VFP(V)
2.50
20
IF=IF(av)
VR=400V
Tj=125°C
IF=IF(av)
Tj=125°C
2.25
18
16
14
12
10
8
S factor
2.00
1.75
1.50
1.25
1.00
0.75
IRM
6
0.50
4
0.25
Qrr
Tj(°C)
2
Reference: Tj=125°C
dIF/dt(A/µs)
0.00
0
25
50
75
100
125
0
100
200
300
400
500
Fig. 10: Forward recovery time versus dIF/dt
(90% confidence).
Fig. 11: Junction capacitance versus reverse
voltage applied (typical values).
C(pF)
100
tfr(ns)
120
IF=IF(av)
VFR=1.1 x VF max.
Tj=125°C
F=1MHz
Vosc=30mV
Tj=25°C
100
80
60
40
20
dIF/dt(A/µs)
VR(V)
0
10
0
100
200
300
400
500
1
10
100
1000
Fig. 12: Thermal resistance junction to ambient
versus copper surface under tab (epoxy printed
circuit board FR4, Cu=35µm) (DPAK and D2PAK).
Rth(j-a)(°C/W)
100
90
80
70
60
50
40
30
20
10
S(cm²)
0
0
2
4
6
8
10
12
14
16
18
20
4/8
STTH5R06D/FP/B/G
PACKAGE MECHANICAL DATA
TO-220FPAC
DIMENSIONS
Millimeters Inches
Min.
REF.
A
Min.
4.4
Max.
Max.
0.181
0.106
0.108
0.027
0.039
0.067
0.205
0.106
0.409
H
B
A
B
4.6
2.7
0.173
0.098
0.098
0.018
0.030
0.045
0.195
0.094
0.393
2.5
D
2.5
2.75
0.70
1
Dia
E
0.45
0.75
1.15
4.95
2.4
L6
F
F1
G
1.70
5.20
2.7
L2
L3
L7
G1
H
L5
10
10.4
D
L2
L3
L4
L5
L6
L7
Dia.
16 Typ.
0.63 Typ.
F1
28.6
9.8
30.6
10.6
3.6
1.126
0.386
0.114
0.626
0.354
0.118
1.205
0.417
0.142
0.646
0.366
0.126
L4
2.9
F
E
15.9
9.00
3.00
16.4
9.30
3.20
G1
G
PACKAGE MECHANICAL DATA
TO-220AC
DIMENSIONS
Millimeters Inches
Min. Max.
4.40 4.60
REF.
Min.
0.173
0.048
0.094
0.019
0.024
0.044
0.194
0.393
Max.
0.181
0.051
0.107
0.027
0.034
0.066
0.202
0.409
H2
A
A
C
C
1.23
2.40
0.49
0.61
1.14
4.95
10.00
1.32
2.72
0.70
0.88
1.70
5.15
10.40
D
L5
L7
Ø I
E
F
L6
F1
G
L2
D
L9
H2
L2
L4
L5
L6
L7
L9
M
F1
L4
16.40 typ.
0.645 typ.
13.00
2.65
14.00
2.95
0.511
0.104
0.600
0.244
0.137
0.551
0.116
0.620
0.259
0.154
M
F
E
15.25
6.20
15.75
6.60
G
3.50
3.93
2.6 typ.
0.102 typ.
Diam. I
3.75
3.85
0.147
0.151
5/8
STTH5R06D/FP/B/G
PACKAGE MECHANICAL DATA
DPAK
DIMENSIONS
Millimeters Inches
Min.
REF.
Min.
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
6.40
4.40
9.35
Max
2.40
1.10
0.23
0.90
5.40
0.60
0.60
6.20
6.60
4.60
10.10
Max.
0.094
0.043
0.009
0.035
0.212
0.023
0.023
0.244
0.259
0.181
0.397
A
A1
A2
B
0.086
0.035
0.001
0.025
0.204
0.017
0.018
0.236
0.251
0.173
0.368
B2
C
C2
D
E
G
H
L2
L4
V2
0.80 typ.
0.031 typ.
0.60
0°
1.00
8°
0.023
0°
0.039
8°
FOOT PRINT DIMENSIONS (in millimeters)
DPAK
6.7
6.7
3
3
1.6
1.6
2.3 2.3
6/8
STTH5R06D/FP/B/G
PACKAGE MECHANICAL DATA
D2PAK
DIMENSIONS
Millimeters Inches
Min. Min.
REF.
Max.
4.60
2.69
0.23
0.93
1.70
0.60
1.36
9.35
10.40
5.28
15.85
1.40
1.75
3.20
Max.
0.181
0.106
0.009
0.037
0.067
0.024
0.054
0.368
0.409
0.208
0.624
0.055
0.069
0.126
A
A
A1
A2
B
4.40
2.49
0.03
0.70
1.14
0.45
1.23
8.95
10.00
4.88
15.00
1.27
1.40
2.40
0.173
0.098
0.001
0.027
0.045
0.017
0.048
0.352
0.393
0.192
0.590
0.050
0.055
0.094
E
C2
L2
D
B2
C
L
L3
A1
C2
D
B2
R
C
B
E
G
G
L
A2
L2
L3
M
M
*
V2
R
0.40 typ.
0.016 typ.
* FLAT ZONE NO LESS THAN 2mm
V2
0°
8°
0°
8°
FOOT PRINT DIMENSIONS (in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
7/8
STTH5R06D/FP/B/G
Ordering code
STTH5R06D
Marking
Package
TO-220AC
TO-220FPAC
DPAK
Weight
1.9 g
Base qty Delivery mode
STTH5R06D
STTH5R06FP
STTH5R06B
STTH5R06B
STTH5R06G
STTH5R06G
50
50
Tube
Tube
STTH5R06FP
STTH5R06B
1.7 g
0.3 g
75
Tube
STTH5R06B-TR
STTH5R06G
DPAK
D2PAK
D2PAK
0.3 g
2500
50
Tape & reel
Tube
1.48 g
1.48 g
STTH5R06G-TR
1000
Tape & reel
■
■
■
■
Cooling method: by conduction (C)
Recommended torque value (TO-220AC): 0.55 Nm
Maximum torque value (TO-220AC / TO-220FPAC): 0.7 Nm
Epoxy meets UL 94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2002 STMicroelectronics - Printed in Italy - All rights reserved.
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