STV7619 [STMICROELECTRONICS]

DC PLASMA DISPLAY DRIVER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100;
STV7619
型号: STV7619
厂家: ST    ST
描述:

DC PLASMA DISPLAY DRIVER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

驱动 CD 接口集成电路
文件: 总21页 (文件大小:186K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
®
STV7619DU  
Scan Driver for Plasma Display Panels  
Main Features  
64-output Scan Driver  
120 V Absolute Maximum Supply  
5 V Logic Supply  
Optional 12 V Supply for driving the output  
stage  
150mA/1A Source/Sink Output  
1 A Source/Sink Output Diode  
64-bit Bi-directional Shift Register (8 MHz)  
BCD Technology  
TQFP100 (14 x 14 x 1.4 mm Slug-down)  
(Thin Plastic Quad Flat Pack)  
100-pin TQFP package with integrated  
heatsink  
ORDER CODE: STV7619D  
Description  
The STV7619 is a scan driver for plasma display  
panels (PDP) implemented in ST’s proprietary BCD  
(Bi-polar CMOS DMOS) technology. Using a 64-bit  
cascadable 8 MHz shift register, it drives 64 high-  
current and high-voltage outputs.  
By connecting several STV7619 devices in series,  
any vertical pixel definition can be performed. The  
STV7619 is supplied with separate 110V power  
output and 5 V logic supplies. The logic section of  
the output stage is supplied either externally by a  
5V or 12V supply or internally by a charge pump  
cell. The choice of the supply value is related to the  
PDP size. All command inputs are CMOS  
compatible.  
TQFP100 (14 x 14 x 1.4 mm)  
(Thin Plastic Quad Flat Pack)  
ORDER CODE: STV7619  
The STV7619 package is a 100-pin TQFP with  
integrated heatsink located on the bottom  
(STV7619D) of the package. It is also available  
without heatsink (STV7619).  
August 2003  
1/21  
STV7619DU  
Table of Contents  
Chapter 1  
Pin Allocation and Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3  
1.1  
Pinout Diagrams ...............................................................................................................3  
Chapter 2  
Circuit Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7  
Chapter 3  
Application Hints: Charge Pump Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9  
Power Supply .......................................................................................................................9  
Sink Current Characteristics ..............................................................................................10  
Recommendations .............................................................................................................10  
3.1  
3.2  
3.3  
Chapter 4  
4.1  
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11  
Absolute Maximum Ratings ..............................................................................................11  
Thermal Data ....................................................................................................................12  
Supply Characteristics ....................................................................................................... 12  
Power Output Characteristics ...........................................................................................13  
SOUT Characteristics .......................................................................................................14  
Input (CLK, STB, BLK, POC, SIN, CLR, F/R and ENABLE) Characteristics ....................14  
AC Timing Requirements ...................................................................................................14  
AC Timing Characteristics .................................................................................................15  
4.2  
4.3  
4.4  
4.5  
4.6  
4.7  
4.8  
Chapter 5  
Chapter 6  
Chapter 7  
Input/Output Schematic Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18  
Package Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19  
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20  
2/21  
Pin Allocation and Descriptions  
STV7619DU  
1
Pin Allocation and Descriptions  
1.1  
Pinout Diagrams  
Figure 1: STV7619 and STV7619D (TQFP100)  
OUT4  
1
75  
74  
73  
72  
71  
70  
69  
68  
67  
66  
65  
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
OUT61  
OUT60  
OUT59  
OUT5  
2
OUT6  
3
OUT7  
4
OUT58  
OUT57  
OUT56  
OUT55  
OUT54  
OUT53  
OUT8  
5
OUT9  
6
OUT10  
OUT11  
OUT12  
OUT13  
OUT14  
OUT15  
OUT16  
OUT17  
OUT18  
OUT19  
OUT20  
OUT21  
OUT22  
OUT23  
OUT24  
OUT25  
OUT26  
OUT27  
OUT28  
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
OUT52  
OUT51  
OUT50  
OUT49  
OUT48  
TQFP100  
(Top View)  
OUT47  
OUT46  
OUT45  
OUT44  
OUT43  
OUT42  
OUT41  
OUT40  
OUT39  
OUT38  
OUT37  
*NC: Not Connected  
3/21  
STV7619DU  
Pin Allocation and Descriptions  
Table 1: Supply Pins  
Pin Description  
Pin No.  
Pin Name  
88  
84  
33  
34  
42  
43  
79  
97  
36  
40  
83  
30  
31  
45  
46  
81  
82  
94  
95  
37  
39  
VCC  
VDD  
5V Logic Supply  
5/12V Internal/External Logic Supply  
High Voltage Supply for Power Outputs  
High Voltage Supply for Power Outputs  
High Voltage Supply for Power Outputs  
High Voltage Supply for Power Outputs  
High Voltage Supply for Power Outputs  
High Voltage Supply for Power Outputs  
Logic Ground  
VPP  
VPP  
VPP  
VPP  
VPP  
VPP  
VSSLOG  
VSSLOG  
VSSLOG  
VSSP  
VSSP  
VSSP  
VSSP  
VSSP  
VSSP  
VSSP  
VSSP  
VSSSUB  
VSSSUB  
Logic Ground  
Logic Ground  
Ground for Power Outputs  
Ground for Power Outputs  
Ground for Power Outputs  
Ground for Power Outputs  
Ground for Power Outputs  
Ground for Power Outputs  
Ground for Power Outputs  
Ground for Power Outputs  
Substrate Ground  
Substrate Ground  
Table 2: Shift Register and Input Pins  
Pin Description  
Pin No.  
Pin Name  
38  
85  
86  
87  
89  
90  
91  
92  
93  
ENABLE  
SOUT  
CLK  
Enable Charge Pump mode  
Shift Register Data Output  
Clock for Shift Register Data  
STB  
Latch for Shift Register Data (Strobe Input)  
Blanking Control for Power Outputs  
Polarity Output Control  
BLK  
POC  
SIN  
Shift Register Data Input  
CLR  
Clear for Shift Register Data  
F/R  
Foward/Reserve modes for selecting Shift Register  
4/21  
Pin Allocation and Descriptions  
STV7619DU  
Table 3: Power Output Pins  
Pin No.  
Pin Name  
Pin Description  
Pin No.  
Pin Name  
Pin Description  
Power Output 33  
98  
99  
100  
1
OUT1  
OUT2  
Power Output 1  
Power Output 2  
Power Output 3  
Power Output 4  
Power Output 5  
Power Output 6  
Power Output 7  
Power Output 8  
Power Output 9  
Power Output 10  
Power Output 11  
Power Output 12  
Power Output 13  
Power Output 14  
Power Output 15  
Power Output 16  
Power Output 17  
Power Output 18  
Power Output 19  
Power Output 20  
Power Output 21  
Power Output 22  
Power Output 23  
Power Output 24  
Power Output 25  
Power Output 26  
Power Output 27  
Power Output 28  
Power Output 29  
Power Output 30  
Power Output 31  
Power Output 32  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
65  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75  
76  
77  
78  
OUT33  
OUT34  
OUT35  
OUT36  
OUT37  
OUT38  
OUT39  
OUT40  
OUT41  
OUT42  
OUT43  
OUT44  
OUT45  
OUT46  
OUT47  
OUT48  
OUT49  
OUT50  
OUT51  
OUT52  
OUT53  
OUT54  
OUT55  
OUT56  
OUT57  
OUT58  
OUT59  
OUT60  
OUT61  
OUT62  
OUT63  
OUT64  
Power Output 34  
Power Output 35  
Power Output 36  
Power Output 37  
Power Output 38  
Power Output 39  
Power Output 40  
Power Output 41  
Power Output 42  
Power Output 43  
Power Output 44  
Power Output 45  
Power Output 46  
Power Output 47  
Power Output 48  
Power Output 49  
Power Output 50  
Power Output 51  
Power Output 52  
Power Output 53  
Power Output 54  
Power Output 55  
Power Output 56  
Power Output 57  
Power Output 58  
Power Output 59  
Power Output 60  
Power Output 61  
Power Output 62  
Power Output 63  
Power Output 64  
OUT3  
OUT4  
2
OUT5  
3
OUT6  
4
OUT7  
5
OUT8  
6
OUT9  
7
OUT10  
OUT11  
OUT12  
OUT13  
OUT14  
OUT15  
OUT16  
OUT17  
OUT18  
OUT19  
OUT20  
OUT21  
OUT22  
OUT23  
OUT24  
OUT25  
OUT26  
OUT27  
OUT28  
OUT29  
OUT30  
OUT31  
OUT32  
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
5/21  
STV7619DU  
Pin Allocation and Descriptions  
Table 4: Miscellaneous Pins  
Pin Description  
Pin No.  
Pin Name  
32  
35  
41  
44  
80  
96  
NC  
NC  
NC  
NC  
NC  
NC  
Not connected  
Not connected  
Not connected  
Not connected  
Not connected  
Not connected  
6/21  
Circuit Description  
STV7619DU  
2
Circuit Description  
Figure 2: Block Diagram  
CLR  
F/R  
CLK  
64-bit Shift Register  
SOUT (SIN)  
P
64  
P1  
SIN (SOUT)  
S64  
S1  
Latch  
STB  
BLK  
POC  
Q1 Q2  
Q63 Q64  
VCC  
VSSSUB  
VSSP  
VSSLOG  
VPP  
Voltage  
Generator  
Vcc  
VDD  
V
V
SSP  
SSP  
V
V
PP  
PP  
ENABLE  
STV7619  
OUT64  
OUT1  
The STV7619 includes all the necessary logic and power circuits to drive the rows of electrodes of  
a plasma display panel (PDP). Data is shifted at each low to high transition of the (CLK) shift clock.  
After 64 shifts, the first bit presented at the serial input (SIN) is available at the serial output (SOUT).  
This output is used to cascade several drivers to perform any vertical resolution (Table 5). CLK,  
STB, SIN and SOUT inputs are Schmitt trigger inputs.  
Table 5: Shift Register Truth Table  
F/R  
CLK  
SIN  
SOUT  
Comments  
H
H
L
Rise  
L or H  
Rise  
In  
In  
Out  
Out  
In  
Forward Shift  
Steady  
Out  
Out  
Reverse Shift  
Steady  
L
L or H  
In  
In reverse mode (F/R = low), data is input on the SOUT pin and output on the SIN pin.  
The clear signal (CLR) sets the shift register data to low.  
Shift register outputs (P1, ... P64) are transferred from the shift register to the latch stage when the  
latch input (STB) is at low level.  
All the data is kept memorized in the latch stage when the strobe input (STB) is pulled high.  
7/21  
STV7619DU  
Circuit Description  
Driver outputs can be simultaneously polarized at high or low level depending on the biasing of the  
POC input signal (Table 6).  
Table 6: Output State Configuration  
STB  
CLR  
POC  
BLK  
Comments  
*
*
*
*
L
*
H
L
L
L
All at low level  
All at high level  
All at high level  
H
H
H
H
L
L
H
H
L
*
Inverted copy of input data  
Inverted copy of latched data  
The STV7619 integrates a charge pump cell to manage the current drive capabilities of the output  
sink transistor, as explained in Table 7. More details are given in Chapter 3.  
Table 7: Voltage Generator Table  
ENABLE  
VDD  
Output Performances  
Minimum Sink Current mode  
External Power Supply (V = 5V)  
DD  
L
External Power Supply (V = 12V)  
Maximum Sink Current mode  
DD  
Internal Power Supply (Charge Pump mode)  
V
connected to an external capacitance  
H
Medium Sink Current mode  
DD  
(C  
= 100nF (20V))  
VDD  
8/21  
Application Hints: Charge Pump Function  
STV7619DU  
3
Application Hints: Charge Pump Function  
3.1  
Power Supply  
The STV7619 is designed to drive panels up to 42” with low voltage logic supplies (pins VCC and  
VDD). In this case, pin VDD must be connected to pin VCC. The driving of large panels (50”, 60”)  
requires a 100 nF capacitor connected between pin VDD and the ground. An internal charge pump  
provides a higher driving voltage for the low stage. If requested, higher performances are obtained  
when a 12V power supply is directly connected to pin VDD.  
The logic supply management of the output stage mainly depends on the write current value of the  
plasma cells. The write current is related to the size of the PDP. The following figures illustrate the  
different possibilities to supply the STV7619 according to the current drive performances requested  
by the plasma panel.  
Figure 3: External Power Supply (Small-size PDP)  
110V  
V
PP  
V
CC  
5V  
STV7619  
V
DD  
ENABLE  
Figure 4: External Power Supply (Large-size PDP)  
110V  
V
PP  
V
CC  
5V  
STV7619  
ENABLE  
V
DD  
12V  
Figure 5: Internal Power Supply, Charge Pump mode (Medium- or Large-size PDP)  
110V  
V
PP  
V
CC  
5V  
STV7619  
V
ENABLE  
DD  
100nF  
(16V)  
9/21  
STV7619DU  
Application Hints: Charge Pump Function  
3.2  
Sink Current Characteristics  
Figure 6: Typical Sink Stage Characteristics (Peak current and T  
= 25 °C)  
AMB  
1400  
1200  
1000  
800  
600  
400  
200  
0
Vgs =5V  
Vgs =chpum p  
Vgs =12V  
0
5
10  
15  
20  
25  
30  
Vpoutl(V)  
3.3  
Recommendations  
The Sustain current must not be sunk in the power outputs to VPP when the power supply is  
applied. VSSSUB and VSSLOG must be connected close to the logical reference ground of the  
logic control signal buffers.  
10/21  
Electrical Characteristics  
STV7619DU  
4
Electrical Characteristics  
4.1  
Absolute Maximum Ratings  
Symbol  
Parameter  
Value  
Units  
V
V
Logic Supply  
-0.3, +7  
-0.3, +14  
-0.3, +120  
V
V
V
V
V
V
CC  
DD  
Logic supply of power part  
Output Pins  
OUTi  
V
-0.3, V +0.3  
Logic Input Voltage  
Logic Output Voltage  
IN  
CC  
V
-0.3, V + 0.3  
OUT  
CC  
V
Driver Output Voltage (scanning mode)  
-0.3, +120  
POUT  
ESD Susceptibility (Human Body model: 100 pF capacitor discharged through  
1.5 kserial resistor) (See Note 1)  
V
±2200  
V
ESD  
I
Driver Output Current (See Note 2, Note 5 and Note 6)  
Diode Output Current (See Note 3 and Note 5)  
Diode Output Current (See Note 4 and Note 5)  
Junction Temperature  
-150 mA/+1.2  
±1  
A
A
POUT  
I
I
DOUT1  
DOUT2  
±700  
mA  
°C  
°C  
°C  
T
+150  
JMAX  
T
Operating Temperature  
-20, +85  
-20, +150  
OPER  
T
Storage Temperature  
STG  
Note:1. All pins in relation to VCC = -1500V  
2. Through one power output.  
3. Through one diode  
4. Through all power outputs (see test diagram): with power dissipation lower than or equal to Ptot and  
Junction temperature lower than or equal to Tjmax and VPP = VSSP.  
5. These parameters are measured during ST’s internal qualification which includes temperature  
characterisation on standard batches and on corners batches of the process. These parameters are  
not tested on the parts.  
6. For VDD = 9 V, IPOUT = 1.0 A, for VDD = 5 V, IPOUT = 0.5 A  
11/21  
STV7619DU  
Electrical Characteristics  
4.2  
Thermal Data  
Symbol  
Parameter  
Value  
Units  
T
Maximum Operating Junction  
125  
20  
°C  
JOPER  
R
R
R
Junction-ambient Thermal Resistance (See Note 1)  
Junction-ambient Thermal Resistance (See Note 2)  
Junction-ambient Thermal Resistance (See Note 3)  
°C/W  
°C/W  
°C/W  
thJA  
thJA  
thJA  
40  
29  
Note:1. For TQFP100 packaging with slug soldered on printed circuit board.  
2. TQFP soldered on 4-layer printed circuit board.  
3. For TQFP100 packaging with slug not soldered on printed circuit board.  
4.3  
Supply Characteristics  
(VSSP = 0 V, VSSLOG = 0 V, VSSSUB = 0 V, TAMB = 25°C and fCLK = 8 MHz, unless otherwise  
specified)  
Symbol  
Parameter  
Logic Supply Voltage  
Test Conditions  
Min.  
Typ.  
Max. Units  
V
V
4.5  
5
5.5  
13  
V
V
V
CC  
DD  
V
Logic Supply Voltage for Output Stage  
Power Output Supply Voltage  
CC  
V
20  
110  
PP  
with V =5 or 12 V  
DD  
100  
2
µA  
(ENABLE=L)  
with pump charge capacitor  
(ENABLE=H)  
I
Logic Supply Current  
CCH  
0.3  
mA  
mA  
µA  
I
f
= 8 MHz  
Dynamic Logic Supply Current  
TBD  
CCL  
CLK  
I
Power Output Supply Current (steady outputs)  
100  
PPH  
12/21  
Electrical Characteristics  
STV7619DU  
4.4  
Power Output Characteristics  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max. Units  
Power Output High Level  
(Voltage drop versus V  
V
I
= - 60 mA  
TBD  
4.2  
V
POUTH  
POUTH  
)
PP  
V
V
=12V (ENABLE = L)  
=5V (ENABLE = L)  
2.5  
3.4  
TBD  
TBD  
V
V
DD  
DD  
Power Output Low Level voltage drop  
= +400 mA  
V
POUTL  
I
POUTL  
pump charge capacitor on  
2.8  
TBD  
V
V
V
V
(ENABLE = H)  
DD  
DD  
DD  
=12 V (ENABLE = L)  
= 5V (ENABLE= L)  
TBD  
TBD  
1100  
530  
mA  
mA  
Power Output Low Level Peak current  
=12 V (See Note 1)  
I
V
POULP  
POUTL  
(Pulse 500ns)  
pump charge capacitor on  
TBD  
1000  
mA  
V
(ENABLE = H)  
DD  
V
I
= +400 mA  
Output Diode High Level (See Note 2 and Note 3)  
Output Diode Low Level (See Note 2 and Note 3)  
1.8  
3.0  
V
V
DOUTH  
DOUTH  
DOUTL  
V
I
= - 400 mA  
-1.25  
-3.00  
DOUTL  
Note:1. Peak current - Pulse mode 720 Hz - 0.2%. Duty cycle.  
2. Compatible with power dissipation and TJOPER 125°C.  
3. See Figure 8: Test Configuration on page 17.  
13/21  
STV7619DU  
Electrical Characteristics  
4.5  
SOUT Characteristics  
Symbol  
Parameter  
Logic Output High Level  
Logic Output Low Level  
Test Conditions  
= -1 mA  
Min.  
Typ.  
Max. Units  
V
I
I
4.2  
4.6  
0.1  
V
OH  
OH  
V
= +1 mA  
0.4  
V
OL  
OL  
4.6  
Input (CLK, STB, BLK, POC, SIN, CLR, F/R and ENABLE) Characteristics  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max. Units  
V
0.8 V  
Input High Level  
Input Low Level  
V
IH  
CC  
V
0.2V  
CC  
V
IL  
I
V
V
V
= V  
High Level Input Current  
±10  
±10  
µA  
IH  
IH  
IL  
IL  
CC  
Low Level Input Current for pins CLK, SIN, STB,  
CLR, BLK and POC  
I
= 0 V  
= 0 V  
µA  
µA  
IL  
I
Low Level Input Current for ENABLE pin  
-25  
IL  
4.7  
AC Timing Requirements  
VCC = 4.5 V to 5.5 V, TAMB = -20 to +85°C, max. leading/trailing edge for input signals (tr, tf) = 10 ns  
Symbol  
Parameter  
Duration of clock (CLK) pulse at high level  
Min.  
Typ.  
Max. Units  
t
40  
40  
10  
20  
25  
10  
20  
100  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
WHCLK  
t
Duration of clock (CLK) pulse at low level  
WLCLK  
t
Set-up Time of data input before clock (low to high) transition  
Hold Time of data input after clock (low to high) transition  
Minimum Delay to latch STB after clock (low to high) transition  
Set-up Time STB before clock (low to high) transition  
Latch STB Low Level Pulse Duration  
SDAT  
t
HDAT  
t
DSTB  
t
SSTB  
t
STB  
t
Blanking (BLK) Pulse Duration  
BLK  
14/21  
Electrical Characteristics  
STV7619DU  
4.8  
AC Timing Characteristics  
Symbol  
Parameter  
Min.  
Typ.  
Max. Units  
t
Data Clock Period  
125  
CLK  
t
Logical Data Output Rise Time  
Logical Data Output Fall Time  
25  
15  
RDAT  
t
FDAT  
PHL1  
Delay of logic data output (high to low transition) after clock (CLK) transition  
(CL=10pF)  
t
45  
50  
Delay of logic data output (low to high transition) after clock (CLK) transition  
(CL=10 pF)  
t
ns  
PLH1  
t
t
t
t
t
t
Delay of power output change (high to low transition) after clock (CLK) transition  
Delay of power output change (low to high transition) after clock (CLK) transition  
Delay of power output change (high to low transition) after Latch (STB) transition  
Delay of power output change (low to high transition) after Latch (STB) transition  
Delay of power output change (high to low transition) to POC transition  
Delay of power output change (low to high transition) to POC transition  
Power Output Rise Time (See Note 1)  
TBD  
TBD  
TBD  
TBD  
105  
100  
100  
30  
180  
180  
165  
165  
160  
160  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
PHL2  
PLH2  
PHL3  
PLH3  
PHL4  
PLH4  
t
ROUT  
t
Power Output Fall Time (See Note 1)  
FOUT  
Note:1. One output among 64, loading capacitor COUT = 200 pF, other outputs at low or high level.  
15/21  
STV7619DU  
Electrical Characteristics  
Figure 7: AC Characteristics Waveform  
tCLK  
tWLCLK  
tWHCLK  
"1"  
CLK  
SIN  
50%  
50%  
50%  
"0"  
tSDAT  
tHDAT  
"1"  
50%  
50%  
"0"  
tPHL1  
tFDAT  
"1"  
"0"  
10%  
10%  
90%  
90%  
SOUT  
50%  
tRDAT  
tPLH1  
tDSTB  
STB  
tSSTB  
"1"  
STB  
50%  
50%  
"0"  
tPHL2  
90%  
tPHL3  
90%  
"1"  
"0"  
OUTn  
10%  
10%  
tPLH2  
tPLH3  
tBLK  
"1"  
POC  
50%  
tPLH4  
50%  
"0"  
"1"  
tPHL4  
90%  
90%  
OUTn  
10%  
10%  
"0"  
tROUT  
tFOUT  
16/21  
Electrical Characteristics  
STV7619DU  
Figure 8: Test Configuration  
V
V
V
V
PP= SSP  
PP= SSP  
V
I
DOUTH  
DOUTH  
V
I
DOUTL  
DOUTL  
V
SSP  
V
SSP  
Output sinking current as positive value, sourcing current as negative value.  
17/21  
STV7619DU  
Input/Output Schematic Diagrams  
5
Input/Output Schematic Diagrams  
Figure 9: ENABLE Input  
Figure 11: SIN, SOUT Input  
V
V
CC  
CC  
V
CC  
V
CC  
SIN, SOUT  
V
CC  
ENABLE  
V
SSLOG  
V
SSLOG  
V
SSLOG  
V
SSLOG  
V
SSLOG  
Figure 10: F/R, CLR, CLK, STB, BLK and POC Inputs  
Figure 12: Power Outputs  
V
CC  
V
CC  
V
PP  
BLK, POC, F/R  
CLK, STB, CLR  
OUT1 to OUT64  
V
SSLOG  
V
V
SSLOG  
SSP  
18/21  
Package Mechanical Data  
STV7619DU  
6
Package Mechanical Data  
Figure 13: TQFP100 Package  
D
A
D1  
D3  
Seating  
Plane  
A2  
C
A1  
75  
51  
50  
76  
ccc  
C
e
H
S1  
E3 E1 E  
B
0.25mm  
.010 inch  
Gage Plane  
Pin 1  
Identification  
26  
100  
25  
1
C
K
TQFP100M  
L
S
L1  
Millimeters  
Typ.  
Inches  
Dimensions  
Min.  
Max.  
Min.  
Typ.  
Max.  
A
A1  
A2  
B
1.60  
0.15  
1.45  
0.27  
0.20  
0.063  
0.006  
0.057  
0.011  
0.008  
0.05  
1.35  
0.17  
0.09  
0.002  
0.053  
0.007  
0.004  
1.40  
0.22  
0.055  
0.009  
C
D
16.00  
14.00  
12.00  
0.50  
0.630  
0.551  
0.472  
0.20  
D1  
D3  
e
E
16.00  
14.00  
12.00  
0.60  
0.630  
0.551  
0.472  
0.024  
0.039  
E1  
E3  
L
L1  
K
0.45  
0.75  
0.018  
0.030  
1.00  
0° (Min.), 7° (Max.)  
Slug Dimension For L/Frame Pad Size 10.00 x 10.00 mm  
H
S
S1  
9.85  
0.388  
8.80  
8.80  
0.346  
0.346  
19/21  
STV7619DU  
Revision History  
7
Revision History  
Table 8: Summary of Modifications  
Description  
Version  
Date  
Target Specification  
1.0  
1.1  
1.2  
1.3  
April 2001  
First version issued  
April 2001  
May 2001  
May 2001  
Corrections from the design  
Corrections in Table 1 and text added in Circuit description  
Inversion of BLK and POC pinsin block diagram and Table 1.  
Product Preview  
Pin connections - pins 30 to 50 corrected, Pin assignements: completed, Block diagram: voltage  
generator added, Circuit description: text modified, Application hints chapter added, Electrical  
characteristics: few precisions, Input/output schematics: corrections  
September  
2.0  
2.1  
2001  
Pin connections - pins 38 added to pin description, Electrical characteristics: I and I typical  
IH  
IL,  
October  
2001  
value is ±10, AC timing characteristics: t  
and t  
: (BLK) replaced with (POC), Figure 5: AC  
PHL4  
PLH4  
characteristics waveform: STB and OUTn waveforms replaced, BLK renamed with POC.  
Page 10 - C value replaced with 100 nF (1 previously), Page 11 - figure 3 - C value  
VDD  
VDD  
replaced with 100 nF, Page 12 - Figure 4 replaced. Sentence modified in subsection 7.3  
recommendations: the logical reference ground “of the application” replaced with “of the logic  
control signal buffers”. Page 13 - absolute maximum ratings - Ioutput value replaced with -150mA/  
+1.2A. Note removed. Page 14- Electrical characteristics: values replaced. Page 15 - AC timing  
charactersitics: values replaced  
November  
2001  
2.2  
2.3  
January  
2002  
Electrical characteristics: First sentence: Vpp and Vdd removed, in the table: Vpp moved after Vdd.  
Preliminary Data  
Reformatted datasheet. Deletion of STV7619U (Slug-up) device and related information.  
Modification of values in Note 6 on page 11. Addition of Note 3 on page 12. Update of typical  
24 July  
2002  
2.4  
values in Section 4  
.
13 January  
2003  
Addition of V information in Section 4.1: Absolute Maximum Ratings on page 11  
.
2.5  
Datasheet  
3.0  
ESD  
August  
2003  
Published on internet.  
20/21  
STV7619DU  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such  
information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise  
under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication  
supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support  
devices or systems without express written approval of STMicroelectronics.  
The ST logo is a trademark of STMicroelectronics.  
© 2003 STMicroelectronics - All Rights Reserved  
Purchase of I2C Components of STMicroelectronics, conveys a license under the Philips I2C Patent.  
Rights to use these components in a I2C system, is granted provided that the system conforms to the I2C Standard Specifications as defined by Philips.  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain -  
Sweden - Switzerland - United Kingdom - United States.  
http://www.st.com  
21/21  

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