STWLC04JR [STMICROELECTRONICS]
Qi based, 1 W optimized wireless power receiver;
| 型号： | STWLC04JR |
| 厂家： | 
ST |
| 描述： | Qi based, 1 W optimized wireless power receiver |
| 文件： | 总18页 (文件大小：1226K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STWLC04
Qi based, 1 W optimized wireless power receiver
Data brief
Configurable GPIO output
Rx coil NTC protection
Thermal protection
Low power dissipative rectifier overvoltage
clamp
Flip Chip 77 bumps (3.12x4.73 mm)
Applications
Wearable applications
Smart watches
Glasses
Medical and healthcare instrumentation
Description
Features
The STWLC04 is an integrated wireless power
receiver suitable for wearable applications. The
device is designed for 1-watt power transfer
based on the Qi protocol, with digital control and
precise analog control loops ensuring stable
operation. The I2C interface allows a high degree
of customization and settings can be stored in the
embedded non-volatile memory.
1 W output power
Qi 1.1 wireless standard communication
protocol based
Integrated high efficiency synchronous
rectifier
800 kHz programmable step-down converter
with input current and input voltage
regulation loop
The STWLC04 can deliver the output power in
two modes: as a power supply with configured
output voltage or as a simple CC/CV battery
charger with configurable charging current,
charging voltage and termination current. The
STWLC04 can detect the external (wired) power
supply connection and drive an external power
switch.
Step-down converter efficiency up to 90%
Simplified Li-Ion/Polymer charger function
32-bit, 16 MHz embedded microcontroller
with 16 kB ROM and 2 kB RAM memory
2 kB NVM for customization
Integrated driver for external supply switch
Precise voltage and current measurements
for received power calculation
I2C interface
Table 1: Device summary
Order code
Description
Package
Packing
STWLC04JR
Wearable optimized 1 W output
Flip Chip 77 bumps (3.12x4.73 mm)
Tape and reel
September 2016
DocID029626 Rev 2
1/18
www.st.com
For further information contact your local STMicroelectronics sales
office
Contents
STWLC04
Contents
1
2
3
4
Introduction .....................................................................................3
Pin configuration.............................................................................4
Maximum ratings.............................................................................7
Application information ..................................................................9
4.1
4.2
Application schematic and recommended external components.......9
External passive component selection............................................12
4.2.1
4.2.2
4.2.3
4.2.4
4.2.5
4.2.6
4.2.7
Input resonant circuit component selection (L1, C1, C2) ................. 12
Voltage clamp resistor selection (RCL1, RCL2)............................... 12
Load modulation capacitor selection (CM1, CM2) ........................... 13
Feedback resistor divider component selection (RFB1, RFB2) ....... 13
Rx NTC circuit component selection (RNTC, R1) ............................ 13
Soft-start capacitor selection (C10).................................................. 13
External supply transistor selection.................................................. 13
4.3
Reference PCB layout.....................................................................14
5
6
Package information .....................................................................15
5.1
Flip Chip 77 bumps (3.12x4.73 mm) package information ..............15
Revision history ............................................................................17
2/18
DocID029626 Rev 2
STWLC04
Introduction
1
Introduction
The STWLC04 is an advanced, integrated receiver IC for wireless power transceiver in
wearable applications optimized for 1 W. It works as a voltage source with regulated output
voltage, typically 5 V and can also be reconfigured into a simple battery charger mode
(CC/CV) to charge directly Li-Ion or Li-pol batteries. The STWLC04 can operate fully
autonomously or can be controlled through I2C by the host system. See the figure below.
Figure 1: Simplified block schematic
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Pin configuration
STWLC04
2
Pin configuration
Figure 2: Pin configuration Flip Chip 77 bumps (3.12x4.73 mm)
Table 2: Pin description
Description
Pin name
Pin position
CSP 77L
AC1
F6, F7, G7
RX coil circuit terminal connection
AC2
E9, E10, E11
RX coil circuit terminal connection
MOD1
MOD2
CLMP1
CLMP2
RMOD
G6
F11
G5
F9
Load modulation capacitor 1 connection
Load modulation capacitor 2 connection
Clamping capacitor/resistor 1 connection
Clamping capacitor/resistor 2 connection
E7
Modulation current sink connection, internally connected to VRECT
Load modulation external resistor connection.
RM resistor is not necessary for most applications
RMOD1
G11
VRECT
BOOT1
BOOT2
BOOT
F10, G10
Synchronous rectifier output
G8
Bootstrap capacitor connection for the rectifier
Bootstrap capacitor connection for the rectifier
Bootstrap capacitor connection for the step-down converter
Low power clamp connection
E8
G9
CLAMP
VSUP
F8
A8, B8, B7
Power supply input for the step-down converter
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STWLC04
Pin configuration
Pin name
VSUPS
RESL
Pin position
Description
A7, C6
A6
Sensing terminal of the external current sensing resistor
Sensing terminal of the external current sensing resistor
Step-down output voltage
VOUT
D5
VFB
A5
Step-down feedback input
Ground connection of the resistor feedback divider for step-down
converter
FBGND
B6
LX
A11, B11, B10 Step-down converter coil connection
NTCRX
A3
Comparator input for RX coil temperature sensing
NTC thermistor has to be placed close to RX coil
LDO1 output to filtering capacitor. ADC supply and sensitive analog
circuitries are connected to this LDO; any external circuit cannot be
connected to this node
VA
A4
F2
LDO2 output to filtering capacitor. The microcontroller core and logic
supply. VCORE voltage can be used as a reference voltage for the
RX coil NTC divider
VCORE
V5V
VIO
A9, B9
G1
LDO3 output to filtering capacitor
VIO, power supply for the digital interface, can be connected to
VCORE or provided externally
SCL
SDA
D1
D4
I2C clock input
I2C data
General purpose push-pull I/O pin. This function depends on firmware
configuration
GPIO0
GPIO1
GPIO2
GPIO3
D6
E5
E4
E1
General purpose push-pull I/O pin. This function depends on firmware
configuration
General purpose push-pull I/O pin. This function depends on firmware
configuration
Open drain output only pin. This function depends on firmware
configuration
RESET
INT
D2
C3
Chip reset input, active low
Open drain interrupt output to the host platform
D8, D9, D10,
D11
RPGND
BPGND
Rectifier power ground
C8, C9, C10,
C11
Step-down converter power ground
Digital ground
GND
G2, F3
AGND
B4, C4, B5, C5 Analog ground
Detection of the external power supply voltage – adapter/USB
voltage, 30 V spike tolerant
VEXT
A10
D7
External P-channel switch control to connect the adapter/USB voltage
to VOUT
SWDRV
USBOK
COMP
C2
C7
Digital input for the USBOK signal from platforms
Step-down converter soft-start capacitor connection
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Pin configuration
Pin name
STWLC04
Pin position
Description
Reserved. Connect to ground
GND
VCORE
N/C
G4, F4
A1
Reserved. Connect to VCORE
Reserved. Do not connect
G3
GND
N/C
B1, E2, E6, F1 Reserved. Connect to ground
B2, B3, D3, E3 Reserved. Do not connect
GND
N/C
C1
Reserved. Connect to ground
Reserved. Do not connect
A2, F5
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STWLC04
Maximum ratings
3
Maximum ratings
Table 3: Absolute maximum ratings
Pin
Parameter
Value
-0.3 to 20
Unit
V
AC1, AC2
Input AC voltage
MOD1, MOD2
CLMP1, CLMP2
Modulation transistor voltage
Clamp transistor voltage
-0.3 to 20
-0.3 to 20
V
V
AC1, AC2 -0.3;
AC1, AC2 + 6
BOOT1, BOOT2
BOOT
Voltage on bootstraps
V
V
VRECT-0.3;
VRECT + 6
Voltage on bootstrap
Rectified voltage
VRECT
-0.3 to 20
V
V
V
V
V
VRESL, VSUPS
VRESL-VSUPS
VSUP
Current sensing resistor connection voltage -0.3 to 20
Voltage on the current sensing resistor
Input voltage of the buck converter
Buck converter switching node voltage
-0.3 to 2
-0.3 to 20
-0.3 to 20
LX
Resistive modulation current source and
transistor voltage
RMOD, RMOD1
-0.3 to 20
V
FBGND
VOUT
VFB
Internal feedback transistor VDS voltage
Output voltage range
-0.3 to 20
-0.3 to 20
-0.3 to 3
V
V
V
Buck converter feedback voltage
Detection pin for the external voltage and
driver output for the external transistor
VEXT, SWDRW
-0.3 to 30
V
NTCRX
VA, VCORE
V5V
RX coil NTC voltage
LDO1, 2 voltages
LDO 3 voltage
-0.3 to 2.3
-0.3 to 2.3
-0.3 to 6
V
V
V
V
VIO
VIO voltage
-0.3 to 6
SCL, SDA, USBOK, INT,
RESET
Digital interface voltage
-0.3 to VIO+0.3
-0.3 to VIO+0.3
V
V
GPIO0, GPIO1, GPIO2,
GPIO3
General purpose I/O voltage
TSTG
TOP
TJ
Storage temperature range
Operating ambient temperature range
Maximum junction temperature
Machine model
-40 to 150
-40 to +85
+125
°C
°C
°C
V
±100
ESD
Charged device model
±500
V
Human body model
±2000
V
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Maximum ratings
STWLC04
Absolute maximum ratings are those values beyond which damage to the device
may occur. Functional operation under these conditions is not implied.
Table 4: Thermal data
Package
Symbol
Parameter
Value
Unit
RTHJA
Junction to ambient thermal resistance(1)
35
°C/W
CSP 3.12x4.73 77L
Notes:
(1)This parameter corresponds to the PCB board, 4-layers with 1 inch2 of cooling area.
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DocID029626 Rev 2
STWLC04
Application information
4
Application information
4.1
Application schematic and recommended external
components
Figure 3: STWLC04 application schematic
C8 and TRSWDRV are optional if VEXT detection is disabled.
DocID029626 Rev 2
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Application information
STWLC04
Figure 4: STWLC04 charger configuration
Before connecting the battery, the STWLC04 has to be configured as a battery
charger in NVM.
Table 5: STWLC04 recommended external components
Component
Manufacturer
Part Number
Value
Size
d10x1.68
mm
Wurth
760308101208
13 uH
L1
d11x1.4
mm
TDK
WR111118-36-F5-B1
18 μH
L2
TOKO
MFD160806-1R0
1 μH/600 mA
47nF/X7R
0603
0402
0402
0402
0402
C1
MURATA
MURATA
MURATA
MURATA
4x GRM155R61H473KE19
GRM155R71H332KA01
GRM155R61A106ME11
GRM155R61A105KE15D
C2
3.2 nF/C0G
10 μF/10 V
1 μF/10 V
C3, C5
C4
CBOOT1,
CBOOT2,
MURATA
GRM033R61A104KE84D
100 nF/10 V
0201
CBOOT, C11
C6, C7, C13
C10
MURATA
GRM033R60J105MEA2D
GRM035R60J475ME15D
GRM155R71H473KA12
GRM155R71H472KA12
ERJ-PA2J150V
1 µF/6.3 V
4.7 uF/6.3 V
47 nF/50 V
4.7 nF/50 V
15R
0201
0201
0402
0402
0402
0201
0402
0201
0201
0201
0402
0402
0402
0201
MURATA
CM1
MURATA
CM2
MURATA
RCL1, RCL2
CFB
PANASONIC
MURATA
GRM0335C1H150JA01
P.10AKCT
15 pF
RS
PANASONIC
0.1 Ω/1%
51 kΩ
R1
RFB1
STACKPOLE
TE-CONNECTIVITY
MURATA
RGC0201DTD150K-ND
7-2176074-1
150 kΩ
RFB2
30.9 kΩ
100 kΩ
RNTC
CCHG (filter)
LCHG (filter)
RLOAD
MURATA
3x GRM155R61A106ME11
LQB15NNR47J10D
10 μF/10 V
470 nH
MURATA
100 Ω
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STWLC04
Application information
All the above components refer to a typical application. Operation of the device is
not limited to the choice of these external components.
Figure 5: VIO and digital interface in standalone application schematic
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Application information
STWLC04
Figure 6: VIO and digital interface in platform application schematic
4.2
External passive component selection
4.2.1
Input resonant circuit component selection (L1, C1, C2)
RX coil selection should be optimized by the requested transferred power. The inductance
of the coil together with C1 and C2 capacitors create an input resonant circuit. Components
have to be carefully selected both to keep the resonant frequency compliant with the
wireless standard specification and also to deliver the power. For more details please see
wireless standard specifications.
The following equations list the resonant frequencies:
Equation 1:
1
푓 =
푠
2 ∗ 휋 ∗ 퐿 ∗ 퐶
√
ꢀ
ꢀ
Equation 2:
1
푓 =
퐷
1
1
2 ∗ 휋 ∗ ꢁ퐿ꢀ ∗ (
+
)
퐶ꢀ 퐶ꢂ
It is recommended high grade ceramic capacitors to be used with C0G dielectrics type.
X5R, X7R capacitors can be used for 5 W output power applications.
4.2.2
Voltage clamp resistor selection (RCL1, RCL2)
The purpose of these resistors is to load the rectifier output by decreasing the rectified
voltage below overvoltage threshold – hysteresis (VOVP-VOVPHYST), when VOVP is reached.
0.2 W resistors with pulse-withstanding character are recommended for this application.
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STWLC04
Application information
4.2.3
Load modulation capacitor selection (CM1, CM2)
These capacitors fulfill the backscatter modulation of the communication from the receiver
to the transmitter. X5R dielectrics type capacitors are suitable for this purpose.
4.2.4
4.2.5
Feedback resistor divider component selection (RFB1, RFB2)
Feedback voltage divider gives the ratio between the desired step-down converter output
voltage and the given feedback reference voltage. The RFB1 and RFB2 resistors should be
0.1% or 0.5% precision.
Rx NTC circuit component selection (RNTC, R1)
To protect the receiver coil from overtemperature, the STWLC04 is equipped with a
comparator input. If the input voltage crosses a certain level, the STWLC04 reacts
terminating the power transfer and sending an interrupt to the host system – depending on
the configuration. The input voltage is given as a ratio from RNTC thermistor and R1
common resistor divider. The divider can be supplied from LDO1 (VA pin) filtering
capacitor.
4.2.6
4.2.7
Soft-start capacitor selection (C10)
The soft-start capacitor C10 connected to COMP pin influences the ramp-up time of the
step-down converter. The nominal VREF voltage is 1.2 V and the time needed to reach the
nominal voltage is given by the following equation:
Equation 3:
푡푆푂퐹푇푆푇퐴푅푇 = 퐶 ∙ 106 ∙ 푉ꢃ퐸ꢄ[ꢅ, ꢄ, −, 푉]
Example: 470 nF ~ 560 ms
External supply transistor selection
The device contains the function of the connection external voltage supply directly to VOUT
by the external dual P-channel transistor back-to-back connected so to avoid the leakage
from VOUT to the external voltage supply.
DocID029626 Rev 2
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Application information
STWLC04
4.3
Reference PCB layout
Figure 7: Top overlay
Figure 8: Top layer
Figure 9: Mid layer 1
Figure 10: Mid layer 2
Figure 11: Bottom layer
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STWLC04
Package information
5
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
5.1
Flip Chip 77 bumps (3.12x4.73 mm) package information
Figure 12: Flip Chip 77 bumps (3.12x4.73 mm) package outline
DocID029626 Rev 2
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Package information
STWLC04
Table 6: Flip Chip 77 bumps (3.12x4.73 mm) package mechanical data
mm
Dim.
Min.
0.50
0.17
0.28
0.23
4.67
Typ.
0.55
0.20
0.30
0.26
4.70
4.00
3.09
2.40
0.40
0.20
0.20
0.352
0.346
0.05
0.075
Max.
0.60
0.23
0.32
0.29
4.73
A
A1
A2
b
D
D1
E
3.06
3.12
E1
e
SD
SE
fD
fE
$
ccc
The terminal A1 on the bump side is identified by a distinguishing feature (for
instance by a circular "clear area", typically 0.1 mm diameter) and/or a missing
bump. The terminal A1 on the backside of the product is identified by a
distinguishing feature (for instance by a circular "clear area", typically between 0.1
and 0.5 mm diameter, depending on the die size).
Figure 13: Flip Chip 77 bumps (3.12x4.73 mm) recommended footprint
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STWLC04
Revision history
6
Revision history
Table 7: Document revision history
Changes
Date
Revision
10-Aug-2016
1
Initial release.
Updated the cover image, the Section "Features" and the Section
"Description" .
06-Sep-2016
2
DocID029626 Rev 2
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STWLC04
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