STX30NM60ND [STMICROELECTRONICS]

N-channel 600 V, 0.11 Ω, 25 A FDmesh™ II Power MOSFET (with fast diode) TO-220, TO-220FP, D2PAK, I2PAK, TO-247; N沟道600 V , 0.11 Ω , 25 A FDmesh ?二功率MOSFET (具有快速二极管)的TO- 220,TO- 220FP , D2PAK , I2PAK ,TO- 247
STX30NM60ND
型号: STX30NM60ND
厂家: ST    ST
描述:

N-channel 600 V, 0.11 Ω, 25 A FDmesh™ II Power MOSFET (with fast diode) TO-220, TO-220FP, D2PAK, I2PAK, TO-247
N沟道600 V , 0.11 Ω , 25 A FDmesh ?二功率MOSFET (具有快速二极管)的TO- 220,TO- 220FP , D2PAK , I2PAK ,TO- 247

二极管
文件: 总18页 (文件大小:794K)
中文:  中文翻译
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STx30NM60ND  
N-channel 600 V, 0.11 , 25 A FDmesh™ II Power MOSFET  
(with fast diode) TO-220, TO-220FP, D2PAK, I2PAK, TO-247  
Features  
VDSS @TJ  
max  
RDS(on)  
max  
Type  
ID  
3
3
I2PAK  
2
2
STB30NM60ND  
STI30NM60ND  
STF30NM60ND  
STP30NM60ND  
STW30NM60ND  
25 A  
25 A  
1
1
TO-247  
650 V  
0.13 Ω  
25 A(1)  
3
25 A  
1
D2PAK  
25 A  
1. Limited only by maximum temperature allowed  
3
2
3
The world’s best R  
in TO-220 amongst  
1
TO-220  
2
DS(on)  
1
TO-220FP  
the fast recovery diode devices  
100% avalanche tested  
Low input capacitance and gate charge  
Low gate input resistance  
Figure 1.  
Internal schematic diagram  
Extremely high dv/dt and avalanche  
capabilities  
$ꢅꢆꢇ  
Application  
Switching applications  
'ꢅꢁꢇ  
Description  
The FDmesh™ II series belongs to the second  
generation of MDmesh™ technology. This  
revolutionary Power MOSFET associates a new  
vertical structure to the company's strip layout  
and associates all advantages of reduced on-  
resistance and fast switching with an intrinsic fast-  
recovery body diode.  
3ꢅꢈꢇ  
!-ꢀꢁꢂꢃꢄVꢁ  
It is therefore strongly recommended for bridge  
topologies, in particular ZVS phase-shift  
converters.  
Table 1.  
Device summary  
Order codes  
Marking  
Package  
Packaging  
STB30NM60ND  
STI30NM60ND  
STF30NM60ND  
STP30NM60ND  
STW30NM60ND  
30NM60ND  
30NM60ND  
30NM60ND  
30NM60ND  
30NM60ND  
PAK  
PAK  
Tape and reel  
Tube  
TO-220FP  
TO-220  
TO-247  
Tube  
Tube  
Tube  
November 2008  
Rev 2  
1/18  
www.st.com  
18  
Contents  
STx30NM60ND  
Contents  
1
2
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
2.1  
Electrical characteristics (curves)  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3
4
5
6
Test circuits  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Packing mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
2/18  
STx30NM60ND  
Electrical ratings  
1
Electrical ratings  
Table 2.  
Absolute maximum ratings  
Value  
Symbol  
Parameter  
Unit  
TO-220/D2PAK  
TO-220FP  
I2PAK / TO-247  
600  
25  
VDS  
VGS  
ID  
Drain-source voltage (VGS = 0)  
Gate- source voltage  
V
V
Drain current (continuous) at TC = 25 °C  
Drain current (continuous) at TC = 100 °C  
Drain current (pulsed)  
25  
25(1)  
15.8(1)  
100(1)  
40  
A
A
ID  
15.8  
100  
190  
(2)  
IDM  
A
PTOT  
Total dissipation at TC = 25 °C  
Peak diode recovery voltage slope  
W
dv/dt(3)  
40  
V/ns  
Insulation withstand voltage (RMS) from  
all three leads to external heat sink  
VISO  
--  
2500  
V
(t = 1 s; TC = 25 °C)  
Tstg  
TJ  
Storage temperature  
– 55 to 150  
150  
°C  
Max. operating junction temperature  
1. Limited only by maximum temperature allowed  
2. Pulse width limited by safe operating area  
3. ISD 25 A, di/dt 600 A/µs, VDD = 80% V(BR)DSS  
Table 3.  
Thermal data  
Parameter  
Symbol  
TO-220 I²PAK  
TO-247 D²PAK TO-220FP Unit  
Thermal resistance  
junction-case max  
Rthj-case  
Rthj-amb  
Rthj-pcb  
Tl  
0.66  
3.1  
62.5  
--  
°C/W  
°C/W  
°C/W  
°C  
Thermal resistance  
junction-ambient max  
62.5  
50  
--  
--  
Thermal resistance  
junction-pcb max  
--  
--  
30  
Maximum lead temperature  
for soldering purpose  
300  
Table 4.  
Avalanche characteristics  
Symbol  
Parameter  
Max value  
Unit  
Avalanche current, repetitive or not-  
repetitive (pulse width limited by TJ max)  
IAR  
12  
A
Single pulse avalanche energy  
EAS  
900  
mJ  
(starting TJ = 25 °C, ID = IAR, VDD = 50 V)  
3/18  
Electrical characteristics  
STx30NM60ND  
2
Electrical characteristics  
(T  
= 25 °C unless otherwise specified)  
CASE  
Table 5.  
On/off states  
Parameter  
Value  
Symbol  
Test conditions  
Unit  
Min.  
Typ. Max.  
Drain-source  
V(BR)DSS  
ID = 1 mA, VGS = 0  
600  
V
breakdown voltage  
V
DD= 480 V, ID= 25 A,  
dv/dt(1) Drain source voltage slope  
48  
V/ns  
VGS= 10 V  
Zero gate voltage  
IDSS  
V
DS = Max rating  
1
µA  
µA  
drain current (VGS = 0)  
VDS = Max rating @125 °C  
100  
Gate-body leakage  
IGSS  
VGS  
VDS = VGS, ID = 250 µA  
GS = 10 V, ID = 12.5 A  
=
20 V  
100  
nA  
V
current (VDS = 0)  
VGS(th) Gate threshold voltage  
3
4
5
Static drain-source on  
resistance  
RDS(on)  
V
0.11  
0.13  
1. Characteristic value at turn off on inductive load  
Table 6.  
Dynamic  
Parameter  
Symbol  
Test conditions  
Min. Typ. Max.  
Unit  
(1)  
gfs  
Forward transconductance VDS = 15 V I = 12.5 A  
25  
S
, D  
pF  
pF  
pF  
Input capacitance  
Ciss  
Coss  
Crss  
2800  
200  
24  
VDS = 50 V, f = 1 MHz,  
VGS = 0  
Output capacitance  
Reverse transfer  
capacitance  
Equivalent output  
capacitance  
(2)  
Coss eq.  
VGS = 0, VDS = 0 to 480 V  
125  
pF  
td(on)  
tr  
td(off)  
tf  
Turn-on delay time  
Rise time  
VDD =300 V, ID = 12.5 A  
G = 4.7 Ω, VGS = 10 V  
(see Figure 23),  
(see Figure 18)  
20  
50  
ns  
ns  
ns  
ns  
R
Turn-off delay time  
Fall time  
110  
75  
Qg  
Qgs  
Qgd  
Total gate charge  
Gate-source charge  
Gate-drain charge  
VDD = 480 V, ID = 25 A,  
VGS = 10 V,  
100  
16  
nC  
nC  
nC  
(see Figure 19)  
54  
f=1MHz Gate DC Bias=0  
Test signal level=20 mV  
Open drain  
Rg  
Gate input resistance  
3.0  
1. Pulsed: pulse duration=300 µs, duty cycle 1.5%  
2. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS  
increases from 0 to 80% VDSS  
4/18  
STx30NM60ND  
Electrical characteristics  
Table 7.  
Source drain diode  
Symbol  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
ISD  
Source-drain current  
25  
A
A
(1)  
ISDM  
Source-drain current (pulsed)  
100  
(2)  
VSD  
Forward on voltage  
ISD = 25 A, VGS = 0  
1.6  
V
trr  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
170  
1.2  
15  
ns  
µC  
A
ISD = 25 A, VDD = 60 V  
di/dt=100 A/µs  
Qrr  
(see Figure 20)  
IRRM  
ISD = 25 A,VDD = 60 V  
di/dt=100 A/µs,  
trr  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
250  
2.5  
20  
ns  
µC  
A
Qrr  
TJ = 150 °C  
IRRM  
(see Figure 20)  
1. Pulse width limited by safe operating area  
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%.  
5/18  
Electrical characteristics  
STx30NM60ND  
2.1  
Electrical characteristics (curves)  
Figure 2. Safe operating area for TO-220 /  
D²PAK / I²PAK  
Figure 3. Thermal impedance for TO-220 /  
D²PAK / I²PAK  
Figure 4. Safe operating area for TO-220FP  
Figure 6. Safe operating area for TO-247  
6/18  
Figure 5. Thermal impedance for TO-220FP  
Figure 7. Thermal impedance for TO-247  
STx30NM60ND  
Electrical characteristics  
Figure 8. Output characteristics  
Figure 9. Transfer characteristics  
AM00052v1  
AM00051v1  
ID(A)  
ID(A)  
VGS=10V  
30  
5
4
3
2
1
0
25  
5V  
20  
15  
10  
5
4V  
0
0
5
10  
15  
20  
25  
30 VSD(V)  
VGS(V)  
0
2
4
6
8
Figure 10. Transconductance  
Figure 11. Static drain-source on resistance  
AM00046v1  
AM00048v1  
RDS(on)  
(Ω)  
Gfs(S)  
30.5  
0.135  
TJ=-50°C  
25°C  
0.115  
0.095  
25.5  
20.5  
15.5  
10.5  
5.5  
150°C  
VGS=10V  
0.075  
ID=12.5A  
0.055  
0.035  
0.5  
0.015  
0
5
10  
15  
20  
25  
D(A)  
0
5
10  
15  
20  
25  
ID(A)  
I
Figure 12. Gate charge vs gate-source voltage Figure 13. Capacitance variations  
AM00044v1  
AM00045v1  
C(pF)  
10000  
VGS(V)  
VDD=480V  
ID=25A  
12  
10  
8
Ciss  
1000  
100  
10  
6
Coss  
Crss  
4
2
0
0
20  
40  
60  
80  
100  
Qg(nC)  
1
VGS(V)  
0.1  
1
10  
100  
7/18  
Electrical characteristics  
STx30NM60ND  
Figure 14. Normalized gate threshold voltage Figure 15. Normalized on resistance vs  
vs temperature temperature  
AM00043v1  
AM00047v1  
VGS(th)  
(norm)  
RDS(on)  
(norm)  
1.1  
1.05  
1
2.1  
1.9  
1.7  
1.5  
1.3  
1.1  
0.9  
0.7  
0.5  
ID=250µA  
0.95  
0.9  
0.85  
0.8  
0.75  
0.7  
TJ(°C)  
-50  
-25  
0
25  
50  
75  
100  
125  
-50 -25  
0
25  
50  
75 100 125
TJ(°C)  
Figure 16. Source-drain diode forward  
characteristics  
Figure 17. Normalized B  
vs temperature  
VDSS  
AM00049v1  
AM00050v1  
25°C  
BVDSS  
V
SD(V)  
(norm)  
1.07  
1.05  
1.03  
1.01  
0.99  
0.97  
0.95  
0.93  
TJ=-50°C  
1
150°C  
0.8  
0.6  
0.4  
0.2  
0
-50  
-25  
0
25  
50  
75  
100  
125 TJ(°C)  
0
10  
20  
ISD(A)  
8/18  
STx30NM60ND  
Test circuits  
3
Test circuits  
Figure 18. Switching times test circuit for  
resistive load  
Figure 19. Gate charge test circuit  
Figure 20. Test circuit for inductive load  
switching and diode recovery times  
Figure 21. Unclamped Inductive load test  
circuit  
Figure 22. Unclamped inductive waveform  
Figure 23. Switching time waveform  
9/18  
Package mechanical data  
STx30NM60ND  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in ECOPACK®  
packages. These packages have a lead-free second level interconnect. The category of  
second level interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label. ECOPACK is an ST trademark.  
ECOPACK specifications are available at: www.st.com  
10/18  
STx30NM60ND  
Package mechanical data  
TO-220 mechanical data  
mm  
inch  
Dim  
Min  
Typ  
Max  
Min  
Typ  
Max  
A
b
4.40  
0.61  
1.14  
0.48  
15.25  
4.60  
0.88  
1.70  
0.70  
15.75  
0.173  
0.024  
0.044  
0.019  
0.6  
0.181  
0.034  
0.066  
0.027  
0.62  
b1  
c
D
D1  
E
1.27  
0.050  
10  
10.40  
2.70  
5.15  
1.32  
6.60  
2.72  
14  
0.393  
0.094  
0.194  
0.048  
0.244  
0.094  
0.511  
0.137  
0.409  
0.106  
0.202  
0.051  
0.256  
0.107  
0.551  
0.154  
e
2.40  
4.95  
1.23  
6.20  
2.40  
13  
e1  
F
H1  
J1  
L
L1  
L20  
L30  
P  
Q
3.50  
3.93  
16.40  
0.645  
28.90  
1.137  
3.75  
3.85  
2.95  
0.147  
0.104  
0.151  
0.116  
2.65  
11/18  
Package mechanical data  
STx30NM60ND  
TO-220FP mechanical data  
mm.  
inch  
Typ.  
DIM.  
Min.  
4.4  
Typ.  
Max.  
4.6  
2.7  
2.75  
0.7  
1
Min.  
0.173  
0.098  
0.098  
0.017  
0.030  
0.045  
0.045  
0.195  
0.094  
0.393  
Max.  
0.181  
0.106  
0.108  
0.027  
0.039  
0.067  
0.067  
0.204  
0.106  
0.409  
A
B
2.5  
D
2.5  
E
0.45  
0.75  
1.15  
1.15  
4.95  
2.4  
F
F1  
F2  
G
1.7  
1.7  
5.2  
2.7  
10.4  
G1  
H
10  
L2  
L3  
L4  
L5  
L6  
L7  
Ø
16  
0.630  
28.6  
9.8  
2.9  
15.9  
9
30.6  
10.6  
3.6  
1.126  
.0385  
0.114  
0.626  
0.354  
0.118  
1.204  
0.417  
0.141  
0.645  
0.366  
0.126  
16.4  
9.3  
3
3.2  
L3  
L6  
L7  
1
2 3  
L5  
L2  
L4  
12/18  
STx30NM60ND  
Package mechanical data  
TO-262 (I2PAK) mechanical data  
mm.  
Typ.  
inch  
Typ.  
DIM.  
Min.  
4.40  
2.40  
0.61  
1.14  
0.49  
1.23  
8.95  
2.40  
4.95  
10  
Max.  
4.60  
2.72  
0.88  
1.70  
0.70  
1.32  
9.35  
2.70  
5.15  
10.40  
14  
Min.  
0.173  
0.094  
0.024  
0.044  
0.019  
0.048  
0.352  
0.094  
0.194  
0.393  
0.511  
0.137  
0.050  
Max.  
0.181  
0.107  
0.034  
0.066  
0.027  
0.052  
0.368  
0.106  
0.202  
0.410  
0.551  
0.154  
0.055  
A
A1  
b
b1  
c
c2  
D
e
e1  
E
L
13  
L1  
L2  
3.50  
1.27  
3.93  
1.40  
13/18  
Package mechanical data  
STx30NM60ND  
PAK (TO-263) mechanical data  
mm  
inch  
Typ  
Dim  
Min  
Typ  
Max  
Min  
Max  
A
A1  
b
4.40  
0.03  
0.70  
1.14  
0.45  
1.23  
8.95  
7.50  
10  
4.60  
0.23  
0.93  
1.70  
0.60  
1.36  
9.35  
0.173  
0.001  
0.027  
0.045  
0.017  
0.048  
0.352  
0.295  
0.394  
0.334  
0.181  
0.009  
0.037  
0.067  
0.024  
0.053  
0.368  
b2  
c
c2  
D
D1  
E
10.40  
0.409  
E1  
e
8.50  
2.54  
0.1  
e1  
H
4.88  
15  
5.28  
15.85  
2.69  
2.79  
1.40  
1.75  
0.192  
0.590  
0.099  
0.090  
0.05  
0.208  
0.624  
0.106  
0.110  
0.055  
0.069  
J1  
L
2.49  
2.29  
1.27  
1.30  
L1  
L2  
R
0.051  
0.4  
0.016  
V2  
0°  
8°  
0°  
8°  
0079457_M  
14/18  
STx30NM60ND  
Package mechanical data  
TO-247 Mechanical data  
mm.  
Typ  
Dim.  
Min.  
Max.  
A
A1  
b
4.85  
5.15  
2.20  
1.0  
2.60  
1.40  
2.40  
3.40  
b1  
b2  
c
2.0  
3.0  
0.40  
19.85  
15.45  
0.80  
D
20.15  
15.75  
E
e
5.45  
18.50  
5.50  
L
14.20  
14.80  
4.30  
L1  
L2  
øP  
øR  
S
3.70  
3.55  
3.65  
4.50  
5.50  
15/18  
Packing mechanical data  
STx30NM60ND  
5
Packing mechanical data  
2
D PAK FOOTPRINT  
TAPE AND REEL SHIPMENT  
REEL MECHANICAL DATA  
mm  
MIN. MAX. MIN. MAX.  
330 12.992  
inch  
DIM.  
A
B
C
D
G
N
T
1.5  
12.8  
20.2  
24.4  
100  
0.059  
13.2 0.504 0.520  
0795  
26.4 0.960 1.039  
3.937  
30.4  
1.197  
BASE QTY  
BULK QTY  
1000  
TAPE MECHANICAL DATA  
1000  
mm  
inch  
DIM.  
MIN. MAX. MIN. MAX.  
10.5 10.7 0.413 0.421  
15.7 15.9 0.618 0.626  
A0  
B0  
D
1.5  
1.6 0.059 0.063  
D1  
E
1.59 1.61 0.062 0.063  
1.65 1.85 0.065 0.073  
F
11.4  
4.8  
3.9  
11.9  
1.9  
50  
11.6 0.449 0.456  
5.0 0.189 0.197  
4.1 0.153 0.161  
12.1 0.468 0.476  
2.1 0.075 0.082  
1.574  
K0  
P0  
P1  
P2  
R
T
0.25 0.35 0.0098 0.0137  
23.7 24.3 0.933 0.956  
W
* on sales type  
16/18  
STx30NM60ND  
Revision history  
6
Revision history  
Table 8.  
Date  
Document revision history  
Revision  
Changes  
29-Nov-2007  
11-Nov-2008  
1
2
initial release  
Document status promoted from preliminary data to datasheet.  
17/18  
STx30NM60ND  
Please Read Carefully:  
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the  
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any  
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