T1620-600W [STMICROELECTRONICS]

SNUBBERLESS TRIAC; 无缓冲器TRIAC
T1620-600W
型号: T1620-600W
厂家: ST    ST
描述:

SNUBBERLESS TRIAC
无缓冲器TRIAC

三端双向交流开关
文件: 总5页 (文件大小:65K)
中文:  中文翻译
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T1620W  
T1630W  
SNUBBERLESS TRIAC  
FEATURES  
A2  
A1  
ITRMS = 16 A  
VDRM = VRRM = 400V to 700V  
EXCELLENT SWITCHING PERFORMANCES  
INSULATING VOLTAGE = 1500V(RMS)  
U.L. RECOGNIZED : E81734  
G
DESCRIPTION  
The T1620/1630W triacs use high performance  
glass passivated chip technology,housedin a fully  
molded plastic ISOWATT220AB package.  
The SNUBBERLESSTM concept offers suppres-  
sion of R-C network, and is suitable for applica-  
tions such as phase control and static switch on  
inductive and resistive loads.  
A1  
A2  
G
ISOWATT220AB  
(Plastic)  
ABSOLUTE RATINGS (limiting values)  
Symbol  
Parameter  
Value  
Unit  
IT(RMS)  
RMS on-state current  
(360° conductionangle)  
Tc= 75°C  
16  
A
ITSM  
Non repetitivesurge peak on-state current  
(Tj initial = 25°C )  
tp = 16.7 ms  
(1 cycle, 60 Hz)  
165  
195  
A
tp = 10 ms  
(1/2 cycle, 50 Hz)  
I2t  
I2t Value (half-cycle, 50 Hz)  
tp = 10 ms  
190  
20  
A2s  
dI/dt  
Critical rate of rise of on-state current  
Gate supply : IG = 500 mA  
Repetitive  
F = 50 Hz  
A/µs  
dIG /dt = 1 A/µs.  
Non Repetitive  
100  
Tstg  
Tj  
Storage temperature range  
- 40 to + 150  
- 40 to + 125  
°C  
°C  
Operating junction temperature range  
Tl  
Maximum lead temperature for soldering during 10s at 4.5 mm  
from case  
260  
T1620 / 1630-xxxW  
Symbol  
Parameter  
Unit  
400  
600  
700  
Repetitive peak off-state voltage  
Tj = 125°C  
VDRM  
VRRM  
400  
600  
700  
V
April 1995  
1/5  
T1620W / 1630W  
THERMAL RESISTANCES  
Symbol  
Parameter  
Value  
50  
Unit  
°C/W  
°C/W  
Rth(j-a)  
Rth(j-c)  
Junction to ambient  
Junction to case for A.C (360°conduction angle)  
2.5  
GATE CHARACTERISTICS (maximum values)  
PG (AV)= 1 W PGM = 10 W (tp = 20 µs)  
IGM = 4 A (tp = 20 µs)  
ELECTRICAL CHARACTERISTICS  
Symbol  
IGT  
Test Conditions  
Quadrant  
I-II-III  
T1620  
T1630  
Unit  
mA  
V
VD=12V (DC) RL=33Ω  
VD=12V (DC) RL=33Ω  
VD=VDRM RL=3.3kΩ  
Tj= 25°C  
Tj= 25°C  
Tj= 125°C  
Tj= 25°C  
MAX  
MAX  
MIN  
20  
30  
VGT  
I-II-III  
1.5  
0.2  
2
VGD  
tgt  
I-II-III  
V
VD=VDRM IG = 500mA  
dlG/dt= 3Aµs  
I-II-III  
TYP  
µs  
IH *  
IT= 250mA  
Gate open  
Tj= 25°C  
Tj= 25°C  
Tj= 25°C  
Tj= 125°C  
Tj= 125°C  
MAX  
MAX  
MAX  
MAX  
MIN  
35  
50  
VTM  
*
ITM= 22.5A tp= 380µs  
1.5  
10  
2
V
IDRM  
IRRM  
VDRM rated  
VRRM rated  
µA  
mA  
V/µs  
dV/dt *  
Linear slope up to  
VD=67%VDRM  
200  
10  
300  
20  
Gate open  
(dV/dt)c * (dI/dt)c = 9 A/ms (see note) Tj= 125°C  
MIN  
V/µs  
* For either polarity of electrode A2 voltage with reference to electrode A1.  
Note : Inusual applications where (dI/dt)c is below 9 A/ms, the (dV/dt)c is always lower than 10V/µs, and, therefore, it is unnecessary to use a  
snuber R-C network accross T1620W / T1630W triacs.  
2/5  
T1620W / 1630W  
Fig.1 : Maximum power dissipation versus RMS  
on-state current.  
Fig.2 : Correlation between maximum power dissi-  
pation and maximum allowable temperature  
(Tamb and Tcase) for different thermal resistances  
heatsink + contact.  
Tcase (oC)  
P (W)  
P(W)  
25  
25  
20  
15  
10  
5
-60  
Rth = 0 o C/W  
1o C/W  
180 O  
= 180o  
2o C/W  
-70  
= 120o  
= 90o  
4o C/W  
20  
15  
-80  
= 60o  
-90  
= 30o  
10  
-100  
-110  
-120  
5
I
(A)  
Tamb (oC)  
20  
T(RMS)  
9 10 11 12 13 14 15 16  
0
0
0
1
2
3
4
5
6
7
8
0
40  
60  
80  
100 120 140  
Fig.3 : RMSon-state current versuscase tempera-  
ture.  
Fig.4 : Thermal transient impedance junction to  
case and junction to ambient versus pulse dura-  
tion.  
Zth/Rth  
1
I
(A)  
T(RMS)  
20  
15  
10  
5
Zth(j-c)  
0.1  
= 180o  
Zth(j-a)  
0.01  
Tcase(oC)  
10 20 30 40 50 60 70 80 90 100 110 120 130  
tp(s)  
1E+2 5E+2  
0
1E-3  
1E+1  
0
1E-2  
1E-1  
1E+0  
Fig.5 : Relative variation of gate trigger current and  
holding current versus junction temperature.  
Fig.6 : Non repetitive surge peak on-state current  
versus number of cycles.  
Igt[Tj]  
Ih[Tj]  
I
(A)  
TSM  
Igt[Tj=25 o C] Ih[Tj=25 o C]  
200  
Tj initial = 25oC  
2.6  
2.4  
2.2  
2.0  
150  
100  
50  
Igt  
1.8  
1.6  
1.4  
1.2  
1.0  
Ih  
0.8  
0.6  
0.4  
Number of cycles  
10  
Tj(oC)  
0
-40 -20  
0
20  
40  
60  
80 100 120 140  
1
100  
1000  
3/5  
T1620W / 1630W  
Fig.7 : Non repetitive surge peak on-state current  
for a sinusoidal pulse with width : tp 10ms, and  
correspondingvalue of I2t.  
Fig.8 : On-statecharacteristics(maximum values).  
2
2
I
(A). I t (A s)  
I
(A)  
TSM  
TM  
1000  
100  
10  
1000  
100  
10  
Tj initial = 25oC  
I
TSM  
Tj initial  
25oC  
2
I
t
Tj max  
Tj max  
Vto =0.9V  
Rt =0.024  
tp(ms)  
V
(V)  
TM  
1
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
1
10  
4/5  
T1620W / 1630W  
PACKAGE MECHANICAL DATA  
ISOWATT220AB  
DIMENSIONS  
Millimeters Inches  
REF.  
Min.  
10  
15.9  
9.8  
Max.  
10.4  
16.4  
10.6  
30.6  
Min.  
Max.  
0.409  
0.645  
0.417  
1.204  
A
B
0.393  
0.626  
0.385  
1.126  
B1  
C
D
E
28.6  
16 typ  
0.630 typ  
9
9.3  
4.6  
3.2  
2.7  
0.7  
2.75  
5.2  
2.7  
1.7  
1
0.354  
0.173  
0.118  
0.098  
0.015  
0.098  
0.195  
0.094  
0.045  
0.030  
0.366  
0.181  
0.126  
0.106  
0.027  
0.108  
0.204  
0.106  
0.067  
0.039  
H
I
4.4  
3
J
L
2.5  
0.4  
2.5  
4.95  
2.4  
1.15  
0.75  
M
N
N1  
O
P
Cooling method : C  
Marking : Type number  
Weight : 2.1g  
Recommended torque value : 0.55 m.N.  
Maximum torque value : 0.70 m.N.  
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the  
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No  
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned  
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.  
SGS-THOMSON Microelectronics products are not authorized foruse as critical components in life support devices or systems without express  
written approval of SGS-THOMSON Microelectronics.  
1995 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved.  
SGS-THOMSON Microelectronics GROUP OF COMPANIES  
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands -  
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.  
5/5  

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