TDA2270 [STMICROELECTRONICS]

TV VERTICAL DEFLECTION OUTPUT CIRCUIT; 电视垂直偏转输出电路


型号：	TDA2270
厂家：	ST
描述：	TV VERTICAL DEFLECTION OUTPUT CIRCUIT 电视垂直偏转输出电路电视输出元件
文件：	总7页 (文件大小：136K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TDA2270

TV VERTICAL DEFLECTION OUTPUT CIRCUIT

DRIVES VERTICAL DEFLECTION WIND-

INGS DIRECTLY

HIGH EFFICIENCY

INTERNAL FLYBACK GENERATOR

THERMAL PROTECTION

ON-CHIP VOLTAGE REFERENCE

HIGH OUTPUT CURRENT (2.2 A peak)

16-LEADPOWERDIP PLASTIC PACKAGE

DIP16

(Plastic package)

ORDER CODE : TDA2270

PIN CONNECTIONS

NON-INVERTING

INPUT

SUPPLY VOLTAGE

DESCRIPTION

FLYBACK

GENERATOR

INVERTING INPUT

The TDA2270 is a high efficiency monolithic output

stage for vertical deflection circuits in TVs and

monitors. Driving the vertical windings directly, the

device contains a power amplifier, flyback gener-

ator, voltage reference and thermal protection cir-

cuit.

The TDA2270 is supplied in a 16-pin DIP with the

four center pins connected together and used for

heatsinking.

GND

OUTPUT

GND

OUTPUT STAGE

SUPPLY

REFERENCE

VOLTAGE

BLOCK DIAGRAM

+V_S

FLYBACK

GENERATOR

POWER

AMP.

YOKE

REFERENCE

VOLTAGE

THERMAL

PROTECTION

12 13 10

1/7

September 1992

TDA2270

ABSOLUTE MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

V_s

Supply Voltage (pin 1)

Flyback Peak Voltage

Voltage at Pin 2

V₇, V₈

V₂

+ V_s

V₁₅, V₁₆

Amplifier Input Voltage

+ V_s, – 0.5

I_o

Output Peak Current (non repetitive, t = 2 ms)

Output Peak Current at f = 50 Hz, t ≤ 10 µs

Output Peak Current at f = 50 Hz, t > 10 µs

Pin 2 DC Current at V₇< V₁

2.2

1.2

I_o

I₂

Pin 2 Peak to Peak Flyback Current at f = 50 Hz, t_fly≤ 1.5 ms

P_tot

Total Power Dissipation at

_pins≤ 90 °C

4.3

T_amb= 70 °C

T_stg, T_j

Storage and Junction Temperature

– 40 to 150

°C

THERMAL DATA

Symbol

Parameter

Thermal Resistance Junction-case

Thermal Resistance Junction–ambient

Value

Unit

°C/W

R_{th j–case}

R_{th j–amb}

Max

* Obtained with the GND pins soldered to printed circuit with minimized copper area.

ELECTRICAL CHARACTERISTICS

(refer to the test circuits, V_S= 35 V, T_amb= 25^oC unless otherwise specified)

Symbol

Parameter

Pin 1 Quiescent Current

Test Conditions

I₂= o, I₇= 0, V₁₆= 3 V

I₂= 0, I₇= 0, V₁₆= 3 V

V₁₅= 1 V

Min. Typ. Max. Unit Fig.

I₁

I₈

µA

Pin 8 Quiescent Current

I₁₅

I₁₆

V_2L

V₇

Amplifier Input Bias Current

Pin 2 Saturation Voltage to GND

Quiescent Output Voltage

– 0.1 – 1

V₁₆= 1 V

I₂= 20 mA

V_s= 35 V, R_a= 39 kΩ

V_s= 15 V, R_a= 13 kΩ

7.5

V_7L

V_7H

V₉

Output Saturation Voltage to GND

Output Saturation Voltage to Supply

Reference Voltage

I₇= 0.7 A

0.7

1.3

2.2

– I₇= 0.7 A

I₉= 0

1.8

∆V₉

∆V_S

Reference Voltage Drift versus Supply

Voltage

V_s= 15 to 30 V

mV/V 1a

R₉

T_j

Reference Voltage Output Resistance

2.1

kΩ

°C

Junction Temperature for Thermal Shut

Down

140

2/7

TDA2270

Figure 1 : DC Test Circuits

Figure 1a : Measurement of I₁; I₈; I₁₅; I₁₆; V₉

∆V₉/∆V_S; R₉

;

Figure 1b : Measurement of V_7H

S1 : (a) I₁₅; (b) I₁₆, I₇and I₈.

S2 : (a) I₇and I₈; (b) I₁₆, (c) I₁₅

S3 : (a) I₁₅, I₁₆, I₇, I , I₉and V₉; (b) R₉

Figure 1c : Measurement of V_2L; V_7L

Figure 1d : Measurement of V₇

S1 : (a) V_2L; (b) V_7L

3/7

TDA2270

Figure 2 : Application Circuit

Figure 3 : PC Board and Component Layout (1 : 1 scale)

4/7

TDA2270

COMPONENTS LIST FOR TYPICAL APPLICATIONS (refer to the fig. 2)

B/W TV

10 Ω / 20 mH / 1 App

90° TVC

15 Ω / 30 mH / 0.82 App

Component

Unit

RT1

kΩ

Ω

5.6

6.8

5.6

330

Ω

1.5

Ω

1N 4001

0.1

1N 4001

0.1

–

µF

C2 el.

C3 el.

470/25 V

220/25 V

0.22

470/25 V

220/25 V

0.22

C5 el.

C6 el.

1000/25 V

10/16 V

1000/16 V

10/16 V

TYPICAL PERFORMANCE

B/W TV

10 Ω / 20 mH / 1 App

90° TVC

15 Ω / 30 mH

Parameter

Unit

V_s– Supply Voltage

145

0.75

1.8

125

0.7

2.05

I_s– Current

t_fly– Flyback Time

* P_tot– Power Dissipation

* R_{th c–a}– Heatsink

°C/W

°C

T_amb

T_{j max}

130

°C

t_o

Vpp

V_i

2.5

V₇– Flyback Voltage

5/7

TDA2270

MOUNTING INSTRUCTIONS

The R_{th j-amb}of the TDA 2270 can be reduced by

soldering the GND pins to a suitable copper area

of the printed circuit board (fig. 4) or to an external

heatsink (fig. 5).

a thickness of 35 µ (1.4 mils).

During soldering the pins temperature must not

exceed 260 °C and the soldering time must not be

longer than 12 seconds.

The diagram of figure 6 shows the maximum dissi-

pable power P_totand the R_{th j-amb}as a function of

the side”l” oftwoequalsquarecopper areas having

The externalheatsinkor printedcircuit copper area

must be connected to electrical ground.

Figure 4 : Example of P.C. Board Copper Area

Figure 5 : External Heatsink Mounting Example

which is Used as Heatsink

Figure 6 : Maximum Dissipable Power and Junc- Figure 7 : Maximum Allowable Power Dissipa-

tion to Ambient Thermal Resistance

versus Side ”l”

tion versus Ambient Temperature

6/7

TDA2270

PACKAGE MECHANICAL DATA

16 PINS - PLASTIC DIP

Millimeters

Typ.

Inches

Typ.

Dimensions

Min.

Max.

Min.

0.020

0.030

Max.

0.51

0.77

1.65

0.065

0.5

0.020

0.010

0.25

0.787

8.5

2.54

0.335

0.100

0.700

17.78

7.1

5.1

0.280

0.201

3.3

0.130

1.27

0.050

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility

for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result

from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.

Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all

information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life

support devices or systems without express written approval of SGS-THOMSON Microelectronics.

Purchase of I²C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips

I²C Patent. Rights to use these components in a I²C system, is granted provided that the system conforms to

the I²C Standard Specifications as defined by Philips.

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