TDA7297SA [STMICROELECTRONICS]
10W+10W DUAL BRIDGE AMPLIFIER; 10W + 10W双桥式放大器
| 型号： | TDA7297SA |
| 厂家： | 
ST |
| 描述： | 10W+10W DUAL BRIDGE AMPLIFIER |
| 文件： | 总11页 (文件大小：497K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TDA7297SA
10W+10W DUAL BRIDGE AMPLIFIER
■ WIDE SUPPLY VOLTAGE RANGE (6V-18V)
TECHNOLOGY BI20II
■ MINIMUM EXTERNAL COMPONENTS
– NO SWR CAPACITOR
– NO BOOTSTRAP
– NO BOUCHEROT CELLS
– INTERNALLY FIXED GAIN
■ STAND-BY & MUTE FUNCTIONS
■ SHORT CIRCUIT PROTECTION
■ THERMAL OVERLOAD PROTECTION
CLIPWATT15
ORDERING NUMBER: TDA7297SA
DESCRIPTION
Pin to pin compatible with: TDA7297, TDA7266B,
TDA7266SA, TDA7266M, TDA7266MA, TDA7266,
& TDA7266S.
The TDA7297SA is a dual bridge amplifier specially
designed for TV and Portable Radio applications.
BLOCK AND APPLICATION DIAGRAM
V
CC
470µF
100nF
3
13
0.22µF
4
IN1
+
-
1
OUT1+
ST-BY
7
S-GND
9
-
2
OUT1-
OUT2+
Vref
+
0.22µF
12
IN2
+
-
15
MUTE
6
-
14
OUT2-
PW-GND
8
+
D94AU175B
September 2003
1/11
TDA7297SA
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
20
Unit
V
V
s
Supply Voltage
Output Peak Current (internally limited)
I
O
2
A
Ptot
Total power dissipation (T
Operating Temperature
= 70°C)
30
W
case
T
op
0 to 70
-40 to 150
°C
°C
T
T
Storage and Junction Temperature
stg,
j
THERMAL DATA
Symbol
Parameter
Value
Typ. = 1.8; Max. = 2.5
48
Unit
°C/W
°C/W
R
Thermal Resistance Junction-case
Thermal Resistance Junction to ambient
th j-case
R
th j-amb
PIN CONNECTION (Top view)
15
14
13
12
11
10
9
OUT2+
OUT2-
VCC
IN2
N.C.
N.C.
S-GND
PW-GND
ST-BY
MUTE
N.C.
8
7
6
5
4
IN1
3
V
CC
2
OUT1-
OUT1+
1
D03AU1463
ELECTRICAL CHARACTERISTCS
(V = 13V, R = 8
Ω
, f = 1KHz, T = 25°C unless otherwise specified)
amb
CC
L
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
18
Unit
V
V
Supply Range
6.5
CC
I
Total Quiescent Current
Output Offset Voltage
Output Power
R = ∞
50
65
mA
mV
W
q
L
V
OS
120
P
THD 10%
8.3
10
O
THD
Total Harmonic Distortion
P
P
= 1W
0.1
0.3
1
%
O
= 0.1W to 2W
%
O
f = 100Hz to 15KHz
SVR
CT
Supply Voltage Rejection
Crosstalk
f = 100Hz, V =0.5V
40
46
60
56
60
dB
dB
dB
°C
dB
dB
R
A
Mute Attenuation
80
MUTE
T
w
Thermal Threshold
Closed Loop Voltage Gain
Voltage Gain Matching
150
32
G
31
33
V
∆G
0.5
V
2/11
TDA7297SA
ELECTRICAL CHARACTERISTCS (continued)
(V = 13V, R = 8
Ω
, f = 1KHz, T = 25°C unless otherwise specified)
amb
CC
L
Symbol
Parameter
Test Condition
Min.
25
Typ.
30
Max.
Unit
KΩ
V
R
Input Resistance
i
VT
VT
Mute Threshold
Vo = -30dB
2.3
0.8
2.9
1.3
4.1
1.8
100
MUTE
ST-BY
ST-BY
St-by Threshold
V
I
St-by Current V6 = GND
Total Output Voltage
µA
e
N
A Curve;
150
220
µV
µV
f = 20Hz to 20KHz
500
APPLICATION SUGGESTION
STAND-BY AND MUTE FUNCTIONS
(A) Microprocessor Application
In order to avoid annoying "Pop-Noise" during Turn-On/Off transients, it is necessary to guarantee the right St-
by and mute signals sequence. It is quite simple to obtain this function using a microprocessor (Fig. 1 and 2).
At first St-by signal (from µP) goes high and the voltage across the St-by terminal (Pin 7) starts to increase ex-
ponentially. The external RC network is intended to turn-on slowly the biasing circuits of the amplifier, this to
avoid "POP" and "CLICK" on the outputs.
When this voltage reaches the St-by threshold level, the amplifier is switched-on and the external capacitors in
series to the input terminals (C3, C5) start to charge.
It's necessary to mantain the mute signal low until the capacitors are fully charged, this to avoid that the device
goes in play mode causing a loud "Pop Noise" on the speakers.
A delay of 100-200ms between St-by and mute signals is suitable for a proper operation.
Figure 1. Microprocessor Application
V
CC
C5
470µF
C6
100nF
C1 0.22µF
3
13
4
7
IN1
+
-
1
OUT1+
R1 10K
ST-BY
C2
10µF
S-GND
µP
9
-
2
OUT1-
OUT2+
Vref
+
C3 0.22µF
12
IN2
+
-
15
R2 10K
MUTE
6
C4
1µF
-
14
OUT2-
PW-GND
8
+
D95AU258A
3/11
TDA7297SA
Figure 2. Microprocessor Driving Signals
+VS(V)
VIN
(mV)
VST-BY
pin 7
1.8
1.3
0.8
VMUTE
pin 6
4.1
2.9
2.3
Iq
(mA)
VOUT
(V)
OFF
PLAY
MUTE
ST-BY
OFF
D96AU259/mod
ST-BY
MUTE
B) Low Cost Application
In low cost applications where the µP is not present, the suggested circuit is shown in fig.3.
The St-by and mute terminals are tied together and they are connected to the supply line via an external voltage
divider.
The device is switched-on/off from the supply line and the external capacitor C4 is intended to delay the St-by
and mute threshold exceeding, avoiding "Popping" problems.
4/11
TDA7297SA
Figure 3. Stand-alone low-cost Application
V
CC
C1
470µF
C2
100nF
C3 0.22µF
3
13
4
R1
IN1
+
-
1
OUT1+
47K
ST-BY
7
R2
47K
C4
10µF
S-GND
9
-
2
OUT1-
OUT2+
Vref
+
C5 0.22µF
12
+
-
15
IN2
MUTE
6
-
14
OUT2-
PW-GND
8
+
D95AU260A
Figure 4. Distortion vs Output Power.
Figure 5. Distortion vs Frequency
THD(%)
10
THD(%)
10
Vcc = 12 V
Rl = 8 ohm
Vcc = 16.5V
Rl = 8 ohm
1
1
f = 15KHz
Pout = 100mW
f = 5KHz
0.1
0.1
f = 1KHz
Pout = 5W
0.010
100
0.010
0.1
1k
10k
20k
1
10
frequency (Hz)
Pout (W)
5/11
TDA7297SA
Figure 6. Frequency Response
Figure 9. Mute Attenuation vs Vpin 6
Level(dBr)
5.0000
Attenuation (dB)
10
4.0000
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
3.0000
2.0000
1.0000
0.0
Vcc = 16.5V
Rl = 8 ohm
Pout = 1W
-1.000
-2.000
-3.000
-4.000
-5.000
1
1.5
2
2.5
3
3.5
4
4.5
5
10
100
1k
frequency (Hz)
10k
100k
Vpin.6(V)
Figure 7. Output Power vs Supply Voltage
Figure 10. Stand-By attenuation vs Vpin 7
D99AU1080
Po
(W)
Rf=8Ω
f=1KHz
Attenuation (dB)
10
0
-10
10
-20
-30
-40
-50
-60
-70
-80
-90
8
6
4
2
0
d=10%
d=1%
-100
-110
-120
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
2.2 2.4
6
7
8
9
10
11
12 Vs(V)
Vpin.7 (V)
Figure 11. Quiescent Current vs Supply
Voltage
Figure 8. Ptot & Efficiency vs Ouput Power
Ptot(W)
µ (%)
10
80
60
40
20
0
Iq (mA)
70
Ptot
8
65
60
55
50
45
40
35
30
µ
6
Vcc = 12V
4
Ω
RL = 8 (both
channel)
f = 1KHz
2
0
0
0.5
1
2
3
4
5
6
7
8
9
10 11
2 x Pout (W)
6
7
8
9
10
11
12
13
14
15
16
17 18
Vsupply(V)
6/11
TDA7297SA
Figure 12. PC Board Component Layout
Figure 13. Evaluation Board Top Layer Layout
Figure 14. Evaluation Board Bottom Layer Layout
7/11
TDA7297SA
HEAT SINK DIMENSIONING:
In order to avoid the thermal protection intervention, that is placed approximatively at T = 150°C, it is important
j
the dimensioning of the Heat Sinker R (°C/W).
Th
The parameters that influence the dimensioning are:
– Maximum dissipated power for the device (P
)
dmax
– Max thermal resistance Junction to case (R
)
Th j-c
– Max. ambient temperature T
amb max
– Quiescent current I (mA)
q
Example:
V
= 13V, R
= 8ohm, R
= 2.5 °C/W , T = 50°C
amb max
CC
load
Th j-c
2
V
cc
P
dmax
= (N° channels) · -------------------------- + I
V
cc
q
R
2
load
--------------
Π
2
P
dmax
= 2 · ( 4.28 ) + 0.5 = 9 W
150 – T
150 – 50
amb max
(Heat Sinker)
R
= ---------------------------------------- – R
= ---------------------- – 2.5 = 8.6°C/W
Th j-c
Th c-a
P
9
d max
In figure 15 is shown the Power derating curve for the device.
Figure 15. Power derating curve
35
30
25
a)
b)
c)
d)
Infinite Heatsink
3.5 °C/ W
(a)
20
5.0 °C/ W
(c)
(d)
(b)
7.0 °C/ W
15
10
5
0
0
40
80
Tamb (°C)
120
160
8/11
TDA7297SA
Clipwatt Assembling Suggestions
The suggested mounting method of Clipwatt on external heat sink, requires the use of a clip placed as much
as possible in the plastic body center, as indicated in the example of figure 16.
A thermal grease can be used in order to reduce the additional thermal resistance of the contact between pack-
age and heatsink.
A pressing force of 7 - 10 Kg gives a good contact and the clip must be designed in order to avoid a maximum
contact pressure of 15 Kg/mm2 between it and the plastic body case.
As example , if a 15Kg force is applied by the clip on the package , the clip must have a contact area of 1mm2
at least.
Figure 16. Example of right placement of the clip
9/11
TDA7297SA
mm
inch
DIM.
MIN.
OUTLINE AND
MECHANICAL DATA
TYP. MAX. MIN.
TYP. MAX.
0.126
A
B
C
D
3.2
1.05
0.041
0.15
0.006
Weight: 1.92gr
1.55
0.061
E
F
0.49
0.67
1.14
0.55 0.019
0.73 0.026
0.022
0.029
G
1.27
1.4
0.045 0.050 0.055
G1
H1
H2
H3
L
17.57 17.78 17.91 0.692 0.700 0.705
12
0.480
0.732
18.6
19.85
10.7
0.781
17.95
14.45
11
0.707
0.569
L1
L2
L3
M
11.2 0.421 0.433 0.441
5.5
0.217
0.100
0.100
Clipwatt15
2.54
2.54
M1
0044538
10/11
TDA7297SA
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2003 STMicroelectronics - All rights reserved
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11/11
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