TN12_07 [STMICROELECTRONICS]
Sensitive and Standard 12 A SCRS; 敏感和标准12一可控硅
| 型号： | TN12_07 |
| 厂家： | 
ST |
| 描述： | Sensitive and Standard 12 A SCRS |
| 文件： | 总12页 (文件大小：153K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TN12, TS12 and TYNx12 Series
Sensitive and Standard
12 A SCRS
A
Main features
Symbol
IT(RMS)
DRM/VRRM
IGT
Value
12
Unit
G
K
A
A
A
V
600 to 1000
0.2 to 15
V
K
A
K
A
G
G
mA
D2PAK
(TN12-G)
DPAK
(TN12-B / TS12-B)
Description
A
A
Available either in sensitive (TS12) or standard
(TN12 / TYN) gate triggering levels, the 12 A SCR
series is suitable to fit all modes of control, found
in applications such as overvoltage crowbar
protection, motor control circuits in power tools
and kitchen aids, inrush current limiting circuits,
capacitive discharge ignition and voltage
regulation circuits.
K
A
G
K
A
G
IPAK
TO-220AB
(TYNx12RG)
(TN12-H / TS12-H)
Order codes
Available in through-hole or surface-mount
packages, they provide an optimized performance
in a limited space area.
Part Numbers
Marking
TN1215-x00B
TN1215-x00B-TR
TN1215-x00G
TN1215-x00G-TR
TN1215-x00H
TS1220-x00B
TS1220-x00B-TR
TS1220-x00H
TYNx12RG
TN1215x00
TN1215x00
TN1215x00G
TN1215x00G
TN1215x00
TS1220x00
TS1220x00
TS1220x00
TYNx12
TYNx12TRG
TYNx12T
March 2007
Rev 6
1/12
www.st.com
12
Characteristics
TN12, TS12 and TYNx12 Series
1
Characteristics
Table 1.
Symbol
Absolute ratings (limiting values)
Parameter
Value
Unit
TN12-G
TYN12
TN12-B/H
TS12-B/H
IT(RMS) RMS on-state current (180° conduction angle)
Tc = 105° C
Tc = 105° C
12
8
A
A
IT(AV)
Average on-state current (180° conduction angle)
tp = 8.3 ms
145
140
98
115
110
60
Non repetitive surge peak on-state
current
ITSM
Tj = 25° C
A
tp = 10 ms
²
²
I t
I t Value for fusing
tp = 10 ms
F = 60 Hz
tp = 20 µs
Tj = 25° C
A2S
Critical rate of rise of on-state
current IG = 2 x IGT , tr ≤ 100 ns
dI/dt
IGM
Tj = 125° C
50
A/µs
Peak gate current
Tj = 125° C
Tj = 125° C
4
1
A
PG(AV) Average gate power dissipation
W
Tstg
Tj
Storage junction temperature range
Operating junction temperature range
- 40 to + 150
- 40 to + 125
° C
V
VRGM
Maximum peak reverse gate voltage (for TN12 and TYN12 only)
5
Table 2.
Symbol
Sentitive electrical characteristics (T = 25° C, unless otherwise specified)
j
Test Conditions
TS1220
Unit
IGT
VGT
VGD
VRG
IH
MAX.
MAX.
MIN.
200
0.8
0.1
8
µA
V
VD = 12 V
RL = 140 Ω
VD = VDRM RL = 3.3 kΩ RGK = 220 Ω
IRG = 10 µA
Tj = 125° C
V
MIN.
V
IT = 50 mA RGK = 1 kΩ
IG = 1 mA RGK = 1 kΩ
VD = 65 % VDRM RGK = 220 Ω
ITM = 24 A tp = 380 µs
Threshold voltage
MAX.
MAX.
MIN.
5
mA
mA
V/µs
V
IL
6
dV/dt
VTM
Vt0
Tj = 125° C
Tj = 25° C
Tj = 125° C
Tj = 125° C
Tj = 25° C
Tj = 125° C
5
MAX.
MAX.
MAX.
1.6
0.85
30
5
V
Rd
Dynamic resistance
mΩ
µA
mA
IDRM
IRRM
VDRM = VRRM
RGK = 220 Ω
MAX.
2
2/12
TN12, TS12 and TYNx12 Series
Characteristics
Table 3.
Symbol
Standard electrical characteristics (T = 25° C, unless otherwise specified)
j
TN1215
B / H
TYN
Test Conditions
Unit
G
x12T
x12
MIN.
MAX.
MAX.
MIN.
2
0.5
5
2
IGT
mA
VD = 12 V
RL = 33 Ω
15
15
VGT
VGD
IH
1.3
V
V
VD = VDRM RL = 3.3 kΩ
IT = 500 mA Gate open
IG = 1.2 IGT
Tj = 125° C
0.2
MAX.
MAX.
MIN.
40
80
30
60
15
30
40
30
60
mA
mA
V/µs
V
IL
dV/dt
VTM
Vt0
VD = 67 % VDRM Gate open
ITM = 24 A tp = 380 µs
Threshold voltage
Tj =125° C
Tj = 25° C
Tj = 125° C
Tj = 125° C
Tj = 25° C
Tj = 125° C
200
200
MAX.
MAX.
MAX.
1.6
0.85
30
5
V
Rd
Dynamic resistance
mΩ
µA
mA
IDRM
IRRM
VDRM = VRRM
MAX.
2
Table 4.
Symbol
Thermal resistance
Parameter
Value
Unit
Rth(j-c)
Junction to case (DC)
1.3
70
° C/W
²
S
(1) = 0.5 cm DPAK
²
S(1) = 1 cm
D2PAK
45
Rth(j-a)
Junction to ambient (DC)
° C/W
IPAK
100
60
TO-220AB
1. S = Copper surface under tab
Figure 1.
Maximum average power
dissipation versus average on-state
current
Figure 2.
Average and D.C. on-state current
versus case temperature
P(W)
I
(A)
T(AV)
12
14
12
10
8
D.C.
11
10
9
α = 180°
8
α = 180°
7
6
6
5
4
4
3
360°
2
2
1
T (°C)
case
I (A)
T(AV)
α
0
0
0
25
50
75
100
125
0
1
2
3
4
5
6
7
8
9
3/12
Characteristics
TN12, TS12 and TYNx12 Series
Figure 3.
Average and D.C. on-state current Figure 4.
Relative variation of thermal
impedance junction to case versus
pulse duration
versus ambient temperature
(device mounted on FR4 with
recommended pad layout) (DPAK)
I
(A)
T(AV)
K=[Z
/R
]
th(j-c) th(j-c)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.0
0.5
D.C.
D2PAK
α = 180°
DPAK
0.2
0.1
t (s)
p
T
amb
(°C)
1E-3
1E-2
1E-1
1E+0
0
25
50
75
100
125
Figure 5.
Relative variation of thermal
impedance junction to ambient
versus pulse duration
(recommended pad layout, FR4 PC
board for DPAK)
Figure 6.
Relative variation of gate trigger
current and holding current versus
junction temperature for TS12
series
K=[Z
/R
]
th(j-a) th(j-a)
I
,I ,I [T ] / I ,I ,I [T =25°C]
GT H L j GT H L j
1.00
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
IGT
DPAK
D2PAK
0.10
TO-220AB / IPAK
IH & IL
RGK = 1kΩ
T (°C)
j
t (s)
p
0.01
1E-2
-40
-20
0
20
40
60
80
100
120
140
1E-1
1E+0
1E+1
1E+2
5E+2
Figure 7.
Relative variation of gate trigger
current and holding current versus
junction temperature for TN12 and
TYNx12 series
Figure 8.
Relative variation of holding
current versus gate-cathode
resistance (typical values) for TS12
series
I [R ] / I [R =1kΩ]
H
GK
H
GK
I
,I ,I [T ] / I ,I ,I [T =25°C]
GT
H
L
j
GT
H
L
j
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Tj = 25°C
IGT
IH & IL
T (°C)
j
R
(kΩ)
GK
-40
-20
0
20
40
60
80
100
120
140
1E-2
1E-1
1E+0
1E+1
4/12
TN12, TS12 and TYNx12 Series
Characteristics
Figure 9.
Relative variation of dV/dt immunity Figure 10. Relative variation of dV/dt immunity
versus gate-cathode resistance
(typical values) for TS12 series
versus gate-cathode capacitance
(typical values) for TS12 series
dV/dt[C ] / dV/dt[R =220Ω]
GK
GK
dV/dt[R ] / dV/dt[R =220Ω]
GK
GK
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
10.0
VD = 0.67 x VDRM
Tj = 125°C
RGK = 220Ω
Tj = 125°C
VD = 0.67 x VDRM
1.0
R
(kΩ)
GK
C
(nF)
GK
0.1
0
200
400
600
800
1000
1200
0
25
50
75
100
125
150
Figure 11. Surge peak on-state current versus Figure 12. Non-repetitive surge peak on-state
number of cycles
current for a sinusoidal pulse with
width tp < 10 ms, and
corresponding values of I²t
I (A)
TSM
I
(A), I2t (A2s)
TSM
150
140
130
120
110
100
90
2000
1000
Tj initial = 25°C
ITSM
tp=10ms
One cycle
TN12 / TYN12
TN12 / TYN12
Non repetitive
Tj initial=25°C
TS12
dI/dt limitation
80
70
TS12
TN12 / TYN12
100
10
60
50
40
I2t
TS12
30
20
10
Repetitive
TC=105°C
Number of cycles
t (ms)
p
0
1
10
100
1000
0.01
0.10
1.00
10.00
Figure 13. On-state characteristics (maximum Figure 14. Thermal resistance junction to
values)
ambient versus copper surface
under tab (epoxy printed circuit
board FR4, copper thickness:
2
35 µm) (DPAK and D PAK)
R
(°C/W)
th(j-a)
I
(A)
TM
100
80
60
40
20
0
200
100
Tj max.:
Vt0=0.85V
Rd=30mΩ
Tj=max
DPAK
10
Tj=25°C
D2PAK
S(cm²)
V
(V)
TM
1
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
2
4
6
8
10
12
14
16
18
20
5/12
Ordering information scheme
TN12, TS12 and TYNx12 Series
2
Ordering information scheme
Figure 15. TN12 series
TN 12 15 - 600
B
(-TR)
(-TR)
RG
Standard SCR series
Current
12 = 12 A
Sensitivity
15 = 15 mA
Voltage
600 = 600 V
800 = 800 V
1000 = 1000 V
Package
B = DPAK
2
G = D PAK
H = IPAK
Packing mode
Blanck = Tube
-TR = Tape and Reel (DPAK and D PAK)
2
Figure 16. TS12 series
TS 12 20 - 600
B
Sensitive SCR series
Current
12 = 12 A
Sensitivity
20 = 200 µA
Voltage
600 = 600 V
700 = 700 V
Package
B = DPAK
H = IPAK
Packing mode
Blanck = Tube
-TR = Tape and Reel
Figure 17. TYNx12 series
TYN
6
12
T
Standard SCR series
Voltage
6 = 600 V
8 = 800 V
10 = 1000 V
Current
12 = 12 A
Sensitivity
Blanck = 15 mA
T = 5 mA
Packing mode
RG = Tube
6/12
TN12, TS12 and TYNx12 Series
Package information
Table 5.
Product selector
Voltage (xxx)
700 V 800 V
Part Numbers
Sensitivity
Package
600 V
1000 V
TN1215-xxxB
TN1215-xxxG
TN1215-xxxH
TS1220-xxxB
TS1220-xxxH
TYNx12
X
X
X
X
X
X
X
X
X
X
15 mA
15 mA
15 mA
0.2 mA
0.2 mA
15 mA
5 mA
DPAK
D2PAK
IPAK
X
DPAK
IPAK
X
X
X
X
TO-220AB
TO-220AB
TYNx12T
3
Package information
●
Epoxy meets UL94, V0
Table 6.
TO-220AB dimensions
Dimensions
Ref.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A
15.20
15.90 0.598
0.625
a1
3.75
0.147
C
B
a2 13.00
10.00
14.00 0.511
10.40 0.393
0.88 0.024
1.32 0.048
4.60 0.173
0.70 0.019
2.72 0.094
2.70 0.094
6.60 0.244
3.85 0.147
0.551
0.409
0.034
0.051
0.181
0.027
0.107
0.106
0.259
0.151
Ø I
b2
B
L
F
b1 0.61
b2 1.23
A
I4
C
4.40
l3
c1 0.49
c2 2.40
c2
a1
l2
a2
e
F
2.40
6.20
M
c1
ØI 3.75
b1
e
I4 15.80 16.40 16.80 0.622 0.646 0.661
L
2.65
1.14
1.14
2.95 0.104
1.70 0.044
1.70 0.044
0.116
0.066
0.066
l2
l3
M
2.60
0.102
7/12
Package information
Table 7.
TN12, TS12 and TYNx12 Series
Dimensions
IPAK dimensions
Ref.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A
2.20
2.40 0.086
1.10 0.035
1.30 0.027
0.90 0.025
5.40 0.204
0.95
0.094
0.043
0.051
0.035
0.212
0.037
A1 0.90
A3 0.70
B
0.64
A
E
B2 5.20
C2
B2
B3
B5
L2
0.30
0.035
D
C
0.45
0.60 0.017
0.60 0.019
6.20 0.236
6.60 0.252
0.023
0.023
0.244
0.260
C2 0.48
H
B3
L1
L
D
E
6
A1
B
V1
6.40
e
2.28
0.090
0.634
B5
C
e
G
H
4.40
4.60 0.173
0.181
A3
G
16.10
L
9
9.40 0.354
1.20 0.031
1
0.370
0.047
L1
L2
V1
0.8
0.80
10°
0.031 0.039
10°
8/12
TN12, TS12 and TYNx12 Series
Package information
Dimensions
Table 8.
DPAK dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
A1
A2
B
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
6.40
4.40
9.35
2.40
1.10
0.23
0.90
5.40
0.60
0.60
6.20
6.60
4.60
10.10
0.086
0.035
0.001
0.025
0.204
0.017
0.018
0.236
0.251
0.173
0.368
0.094
0.043
0.009
0.035
0.212
0.023
0.023
0.244
0.259
0.181
0.397
E
A
B2
C2
L2
B2
C
D
R
H
L4
C2
D
A1
R
B
G
C
E
A2
G
0.60 MIN.
H
V2
L2
L4
V2
0.80 typ.
0.031 typ.
0.60
0°
1.00
8°
0.023
0°
0.039
8°
Figure 18. DPAK footprint dimensions (in millimeters)
1.6
6.7
3
3
2.3
2.3
6.7
1.6
9/12
Package information
Table 9.
TN12, TS12 and TYNx12 Series
Dimensions
2
D PAK dimensions
Ref.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A
4.30
4.60 0.169
2.69 0.098
0.23 0.001
0.93 0.027
0.181
0.106
0.009
0.037
A
A1 2.49
A2 0.03
E
C2
L2
B
0.70
B2 1.25 1.40
0.45
C2 1.21
D
0.048 0.055
L
C
0.60 0.017
1.36 0.047
9.35 0.352
10.28 0.393
5.28 0.192
15.85 0.590
1.40 0.050
1.75 0.055
0.024
0.054
0.368
0.405
0.208
0.624
0.055
0.069
L3
A1
B2
B
R
C
D
E
G
L
8.95
10.00
4.88
G
A2
2mm min.
FLAT ZONE
15.00
L2 1.27
L3 1.40
R
V2
0.40
0.016
V2
0°
8°
0°
8°
2
Figure 19. D PAK footprint dimensions (in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available
at: www.st.com.
10/12
TN12, TS12 and TYNx12 Series
Ordering information
4
Ordering information
Ordering type(1)
Marking(1)
TN1215x00
Package
DPAK
Weight Base qty Delivery mode
TN1215-x00B
TN1215-x00B-TR
TN1215-x00G
TN1215-x00G-TR
TN1215-x00H
TS1220-x00B
TS1220-x00B-TR
TS1220-x00H
TYNx12RG
0.3 g
0.3 g
1.5 g
1.5 g
0.3 g
0.3 g
0.3 g
0.3 g
2.3 g
2.3 g
75
2500
50
Tube
Tape and reel
Tube
TN1215x00
TN1215x00G
TN1215x00G
TN1215x00
TS1220x00
TS1220x00
TS1220x00
TYNx12
DPAK
D2PAK
D2PAK
IPAK
1000
75
Tape and reel
Tube
DPAK
75
Tube
DPAK
2500
75
Tape and reel
Tube
IPAK
TO-220AB
TO-220AB
50
Tube
TYNx12TRG
TYNx12T
50
Tube
1. x (6, 7, 8, 10) depends upon voltage
5
Revision history
Date
Revision
Description of Changes
Sep-2000
3
4
Last update.
TO-220AB delivery mode changed from bulk to tube.
25-Mar-2005
Changed sensitivity values in Table 5 for TYNx12 (30 to 15 mA) and
TYNx12T ( 15 to 5 mA). Added ECOPACK statement.
14-Oct-2005
08-Mar-2007
5
6
Reformatted to current standard.
Figure 15: TN12 series product name corrected.
Figure 16: TS12 series product name corrected.
11/12
TN12, TS12 and TYNx12 Series
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12/12
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