TPA [STMICROELECTRONICS]
Trisil for telecom equipment protection; TRISIL电信设备保护
| 型号： | TPA |
| 厂家： | 
ST |
| 描述： | Trisil for telecom equipment protection |
| 文件： | 总11页 (文件大小：129K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SMP50 / SMTPA / TPA
Trisil™ for telecom equipment protection
Features
■ Bidirectional crowbar protection
■ Voltage range from 62 V to 320 V
■ Low capacitance from 12 pF to 20 pF @ 50 V
■ Low leakage current : I = 2 µA max
R
SMB
(JEDEC DO-214AA)
SMTPA
SMA
(JEDEC DO-214AC)
SMP50
■ Holding current: I = 150 mA min
H
■ Repetitive peak pulse current :
I
= 50 A (10/1000 µs)
PP
Main applications
Telecommunication equipment such as:
■ Analog and digital line cards (xDSL, T1/E1,
DO-15
TPA
ISDN, ...)
■ Terminals (phone, fax, modem, ...) and central
office equipment
Order codes
Description
Part Number
Marking
These Trisil series have been designed to protect
telecommunication equipment against lightning
and transient induced by AC power lines.
SMP50-xxx
TPAxxx
See Ordering Information
on page 9
They are available in SMA, SMB and DO-15
packages.
SMTPAxxx
Schematic Diagram
Benefits
Trisils are not subject to ageing and provide a fail
safe mode in short circuit for a better protection.
They are used to help equipment to meet various
standards such as UL1950, IEC950 / CSA C22.2,
UL1459 and FCC part 68.
Trisils have UL94 V0 approved resin.
SMA and SMB packages are JEDEC registered
(DO-214AC and DO-214AA).
Trisils are UL497B approved (file: E136224).
TM: TRISIL is a trademark of STMicroelectronics
June 2007
Rev 3
1/11
www.st.com
11
Characteristics
SMP50 / SMTPA / TPA
1
Characteristics
Table 1.
Compliant with the following standards
PeakSurge
Voltage
(V)
Required
peak current
(A)
Minimum serial
resistor to meet
standard (Ω)
Waveform
Voltage
Current
waveform
Standard
GR-1089 Core
First level
2500
1000
2/10 µs
10/1000 µs
500
100
2/10 µs
10/1000 µs
20
10
GR-1089 Core
Second level
5000
1500
2/10 µs
2/10 µs
500
100
2/10 µs
2/10 µs
5/310 µs
40
0
GR-1089 Core
Intra-building
6000
1500
150
37.5
53
0
ITU-T-K20/K21
10/700 µs
1/60 ns
ITU-T-K20
(IEC61000-4-2)
8000
15000
ESD contact discharge
ESD air discharge
0
0
4000
2000
100
21.5
0
VDE0433
VDE0878
10/700 µs
1.2/50 µs
5/310 µs
50
4000
2000
100
0
0
1/20 µs
50
4000
4000
10/700 µs
1.2/50 µs
100
100
5/310 µs
8/20 µs
21.5
0
IEC61000-4-5
FCC Part 68, lightning
surge type A
1500
800
10/160 µs
10/560 µs
200
100
10/160 µs
10/560 µs
12.5
6.5
FCC Part 68, lightning
surge type B
1000
9/720 µs
25
5/320 µs
0
Table 2.
Symbol
Absolute ratings (T
= 25° C)
amb
Parameter
Value
Unit
10/1000 µs
8/20 µs
10/560 µs
5/310 µs
10/160 µs
1/20 µs
50
150
55
65
75
I
Repetitive peak pulse current (see Figure 1)
A
PP
100
100
2/10 µs
I
Fail-safe mode : maximum current(1)
8/20 µs
2.5
kA
A
FS
t = 0.2 s
t = 1 s
t = 2 s
16
11.5
10
Non repetitive surge peak on-state current
(sinusoidal)
I
TSM
I2t
t = 15 mn
3.5
t = 16.6 ms
t = 20 ms
6.2
6.5
I2t value for fusing
A2s
T
T
Storage temperature range
Maximum junction temperature
-55 to 150
150
stg
j
°C
°C
T
Maximum lead temperature for soldering during 10 s.
260
L
1. in fail safe mode, the device acts as a short circuit
2/11
SMP50 / SMTPA / TPA
Characteristics
Table 3.
Symbol
Thermal resistances
Parameter
Value
SMA
Unit
DO-15
SMB
Junction to ambient (with recommended footprint
R
100
60
120
30
100
20
°C/W
°C/W
th(j-a)
or with L
= 10 mm for DO-15)
lead
R
Junction to leads (L
= 10 mm for DO-15)
th(j-l)
lead
Table 4.
Symbol
Electrical characteristics - definitions (T
= 25°C)
amb
Parameter
V
Stand-off voltage
Breakdown voltage
Breakover voltage
Leakage current
RM
V
BR
BO
RM
V
I
I
I
Peak pulse current
Breakover current
Holding current
PP
BO
I
H
V
Continuous reverse voltage
R
I
Leakage current at V
Capacitance
R
R
C
3/11
Characteristics
SMP50 / SMTPA / TPA
Table 5.
Electrical characteristics - values (T
= 25°C)
amb
Dynamic
VBO
Static
VBO @ IBO
(1)
(4)
Types
IRM @ VRM
max.
IR @ VR
IH
C(5)
C(6)
(2)
(3)
max.
µA
max.
V
max. max. min.
typ.
pF
typ.
pF
µA
V
V
V
mA
mA
SMP50-62 / TPA62
SMTPA62
56
62
85
82
20
20
16
16
14
14
12
12
12
40
40
35
30
30
25
25
25
25
SMP50-68 / TPA68
SMTPA68
61
68
93
90
SMP50-100 / TPA100
SMTPA100
90
100
120
130
180
200
220
240
135
160
173
235
262
285
300
133
160
173
240
267
293
320
SMP50-120 / TPA120
SMTPA120
108
117
162
180
198
216
SMP50-130 / TPA130
SMTPA130
SMP50-180 / TPA180
SMTPA180
2
5
800
150
SMP50-200 / TPA200
SMTPA200
SMP50-220 / TPA220
SMTPA220
SMP50-240 / TPA240
SMTPA240
SMP50-270 / TPA270
SMTPA270
243
290
270
320
350
400
360
400
12
12
25
25
SMP50-320 / SMTPA320
1. IR measured at VR guarantee VBR min ≥ VR
2. See functional test circuit 1(Figure 9.)
3. See test circuit 2(Figure 10.)
4. See functional holding current test circuit 3(Figure 11.)
5. VR = 50 V bias, VRMS = 1 V, F = 1 MHz
6. VR = 2 V bias, VRMS = 1 V, F = 1 MHz
Figure 1.
% I
Pulse waveform (10/1000 µs)
Figure 2.
Non repetitive surge peak on-state
current versus overload duration
Repetitive peak pulse current
I
(A)
TSM
PP
30
25
20
15
10
5
tr = rise time (µs)
tp = pulse duration time (µs)
F=50Hz
100
50
0
t(s)
t
0
t
t
p
r
1E-2
1E-1
1E+0
1E+1
1E+2
1E+3
4/11
SMP50 / SMTPA / TPA
Characteristics
Figure 3.
On-state voltage versus on-state
current (typical values)
Figure 4.
Relative variation of holding
current versus junction
temperature
I (A)
T
I [T ] / I [T =25°C]
H
j
H
j
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
50
Tj=25°C
20
10
5
2
1
T (°C)
j
V (V)
T
0
1
2
3
4
5
6
7
8
9
10
-40
-20
0
20
40
60
80
100
120
Figure 5.
Relative variation of breakover
voltage versus junction
temperature
Figure 6.
Relative variation of leakage
current versus reverse voltage
applied (typical values)
V
[T ] / V [T =25°C]
j BO j
BO
I
[T ] / I [T =25°C]
RM
j
RM
j
1.10
1.05
1.00
0.95
0.90
2000
1000
V
=V
R
RM
100
10
270 V
62 V
T (°C)
j
T (°C)
j
1
25
50
75
100
125
-40
-20
0
20
40
60
80
100
Figure 7.
Variation of thermal impedance
junction to ambient versus pulse
Figure 8.
Relative variation of junction
capacitance versus reverse voltage
applied (typical values)
duration (Printed circuit board FR4,
= 35 µm, recommended pad
S
Cu
layout)
C[V ] / C[V =50V]
R
R
Z (°C/W)
th(j-a)
2.5
2.0
1.5
1.0
0.5
0.0
1E+2
1E+1
1E+0
1E-1
Tj=25°C
F=1MHz
VRMS=1V
SMTPA / TPA
SMP50
V (V)
R
t (s)
p
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
1
2
5
10
20
50
100
300
5/11
Characteristics
Figure 9.
SMP50 / SMTPA / TPA
Test circuit 1 for Dynamic I and V parameters
BO
BO
100 V / µs, di/dt < 10 A / µs, Ipp = 50A
2 Ω
45 Ω
83 Ω
0.36 nF
46 µH
10 µF
U
66 Ω
470 Ω
KeyTek 'System 2' generator with PN246I module
1 kV / µs, di/dt < 10 A / µs, Ipp = 10 A
46 µH
26 µH
60 µF
250 Ω
47 Ω
U
12 Ω
KeyTek 'System 2' generator with PN246I module
Figure 10. Test circuit 2 for I and V parameters
BO
BO
K
ton = 20ms
R1 = 140Ω
R2 = 240Ω
220V 50Hz
VBO
measurement
DUT
Vout
1/4
IBO
measurement
TEST PROCEDURE
Pulse test duration (tp = 20ms):
●
for Bidirectional devices = Switch K is closed
for Unidirectional devices = Switch K is open
●
V
●
●
selection:
OUT
Device with V > 200V ➔
V
V
= 250 V
= 480 V
, R1 = 140Ω
, R2 = 240Ω
BO
OUT
RMS
Device with V ≥ 200V ➔
BO
OUT
RMS
Figure 11. Test circuit 3 for dynamic I parameters
H
R
Surge generator
D.U.T
V
= - 48 V
BAT
This is a GO-NOGO test which allows to confirm the holding current (I ) level in a
H
functional test circuit.
TEST PROCEDURE
1/ Adjust the current level at the I value by short circuiting the AK of the D.U.T.
H
2/ Fire the D.U.T. with a surge current
➔
I
=
PP 10A, 10/1000µs.
3/ The D.U.T. will come back off-state within 50ms maximum.
6/11
SMP50 / SMTPA / TPA
Ordering information scheme
2
Ordering information scheme
SMP 50
-
xxx
Series
SMP = Trisil surface mount in SMA
SMTP = Trisil surface mount in SMB
TP = Trisil in DO-15
Repetitive Peak Pulse Current
A or 50 = 50 A
Voltage
62 = 62 V
3
Package information
●
Epoxy meets UL94, V0
Table 6.
SMA dimensions
Dimensions
Ref.
Millimeters
Inches
E1
Min.
Max.
Min.
Max.
A1
A2
b
1.90
0.05
1.25
0.15
2.25
4.80
3.95
0.75
2.45
0.20
1.65
0.40
2.90
5.35
4.60
1.50
0.075
0.002
0.049
0.006
0.089
0.189
0.156
0.030
0.094
0.008
0.065
0.016
0.114
0.211
0.181
0.059
D
E
c
D
A1
E
C
A2
L
b
E1
L
Figure 12. Footprint, dimensions in mm (inches)
2.63
1.4
1.4
(0.055)
(0.055)
(0.103)
1.64
(0.064)
5.43
(0.214)
7/11
Package information
Table 7.
SMP50 / SMTPA / TPA
Dimensions
SMB dimensions
Ref.
Millimeters
Inches
E1
Min.
Max.
Min.
Max.
A1
A2
b
1.90
0.05
1.95
0.15
5.10
4.05
3.30
0.75
2.45
0.20
2.20
0.40
5.60
4.60
3.95
1.50
0.075
0.002
0.077
0.006
0.201
0.159
0.130
0.030
0.096
0.008
0.087
0.016
0.220
0.181
0.156
0.059
D
E
c
A1
E
A2
E1
D
C
L
b
L
Figure 13. Footprint, dimensions in mm (inches)
1.62 2.60 1.62
(0.064) (0.102) (0.064)
2.18
(0.086)
5.84
(0.300)
Table 8.
DO-15 dimensions
Dimensions
Millimeters
C
A
C
Ref.
Inches
Min.
Max.
Min.
Max.
A
B
C
D
6.05
2.95
26
6.75
3.53
31
0.238
0.116
1.024
0.028
0.266
0.139
1.220
0.035
D
B
0.71
0.88
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
8/11
SMP50 / SMTPA / TPA
Ordering Information
4
Ordering Information
Part Number
Marking
Package
Weight
Base qty
Delivery mode
SMP50-62
SMP50-68
SMP50-100
SMP50-120
SMP50-130
SMP50-180
SMP50-200
SMP50-220
SMP50-240
SMP50-270
SMP50-320
SMTPA62
SMTPA68
SMTPA100
SMTPA120
SMTPA130
SMTPA180
SMTPA200
SMTPA220
SMTPA240
SMTPA270
SMTPA320
TPA62
V06
V07
V10
V12
V13
V18
V20
V22
V24
V27
V32
U01
U05
U13
U17
U19
U25
U27
U31
U35
U39
U47
SMA
0.068 g
5000
Tape & reel
SMB
0.11 g
2500
Tape & reel
1000
6000
1000
6000
1000
6000
1000
1000
6000
1000
6000
1000
6000
1000
6000
1000
6000
1000
6000
Ammopack
Tape & reel
Ammopack
Tape & reel
Ammopack
Tape & reel
Ammopack
Ammopack
Tape & reel
Ammopack
Tape & reel
Ammopack
Tape & reel
Ammopack
Tape & reel
Ammopack
Tape & reel
Ammopack
Tape & reel
TPA62
TPA68
TPA62RL
TPA68
TPA68RL
TPA100
TPA100
TPA120
TPA130
TPA100RL
TPA120
TPA130
TPA130RL
TPA180
DO-15
0.40 g
TPA180
TPA200
TPA220
TPA240
TPA270
TPA180RL
TPA200
TPA200RL
TPA220
TPA220RL
TPA240
TPA240RL
TPA270
TPA270RL
9/11
Revision History
SMP50 / SMTPA / TPA
5
Revision History
Date
Revision
Description of Changes
SMP50, SMTPA and TPA datasheets merge.
16-Nov-2004
1
Reformatted to current standards. Updated I value in
PP
Table 2 . Added part numbers SMP50-320 and
SMTPA320. Updated dimensions and footprint for SMA
and footprint for SMB.
30-Mar-2007
12-Jun-2007
2
3
Corrected typographical error in part number. Added
dimensions in inches to footprint illustrations.
10/11
SMP50 / SMTPA / TPA
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