USB6B1RL [STMICROELECTRONICS]

DATA LINES PROTECTION; 数据线保护
USB6B1RL
型号: USB6B1RL
厂家: ST    ST
描述:

DATA LINES PROTECTION
数据线保护

文件: 总9页 (文件大小:102K)
中文:  中文翻译
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USB6Bx  
®
Application Specific Discretes  
A.S.D.  
DATA LINES PROTECTION  
APPLICATIONS  
Where transient overvoltage protection in sensi-  
tive equipment is required, such as:  
- Universal Serial Bus ports  
- RS-423 interfaces  
- RS-485 interfaces  
- ISDN equipment  
- T1/E1 line cards  
- HDSL / ASDL interfaces  
SO8  
FEATURES  
Full diode bridge with integrated clamping protection  
Breakdown voltage : VBR = 6V min.  
Peak pulse power dissipation : PPP = 500W (8/20µs)  
Very low capacitance, compatible with high debit  
data or signal rates.  
DESCRIPTION  
In order to prevent fast transients from leading  
to severe damages in a high speed data sys-  
tem, a specific protection has been developed  
by STMicroelectronics.  
The USB6Bx protects the two input lines  
against overvoltage. Besides, this device also  
keeps the power rails in a safe limit thanks to  
the integrated Transil diode.  
DIL8  
BENEFITS  
Provides protection for each line and between  
the supply voltage and GND : 25A , 8/20µs.  
High ESD protection level : up to level 3 per  
MIL STD 883C-Method 3015-6  
Separated inputs and outputs (so-called 4-point  
structure) to improve ESD susceptibility.  
FUNCTIONAL DIAGRAM  
Comprehensive package pin-out for immediate  
implementation.  
Vcc  
I/01  
I/02  
GND  
Vcc  
I/01  
I/02  
GND  
COMPLIES WITH THE FOLLOWING STANDARDS:  
MIL STD 883C - Method 3015-6  
class 3  
C = 100 pF  
R = 1500 Ω  
3 positive strikes and 3 negative strikes (F = 1 Hz)  
IEC-1000-4-2 level 4  
15 kV (air discharge)  
8 kV (contact discharge)  
TM: ASD and TRANSIL are trademarks of ST Microelectronics.  
August 1999 Ed : 5A  
1/9  
USB6Bx  
TECHNICAL INFORMATION  
SURGE PROTECTION  
The USB6Bx is particularly optimized to perform  
surge protection based on the rail to rail topology.  
The clamping voltage VCL can be estimated as follow:  
VCL+ =Vcc + VF for positive surges  
VCL - = - VF  
for negative surges  
with: VF = Vt + rd.Ip  
(VF forward drop voltage) / (Vt forward drop  
threshold voltage)  
Note: the estimations do not take into account  
phenomena due to parasitic inductances.  
Fig. A1 :  
Lw  
di  
ESD  
SURGE  
+Vcc  
Lw  
Vf  
dt  
I/O  
di  
dt  
surge >0  
surge <0  
Vcc+Vf+ Lw  
di  
Vcl+ =  
VI/O  
Lw  
Vcl- = -Vf-  
di  
dt  
dt  
Lw  
GND  
tr=1ns  
Vcl+  
t
-Vf  
di  
di  
dt  
Lw  
POSITIVE  
SURGE  
NEGATIVE  
SURGE  
-Lw  
dt  
Vcc+Vf  
t
Vcl-  
tr=1ns  
2/9  
USB6Bx  
Fig. A2: ESD behavior: optimized layout and add  
of a capacitance of 100nF.  
HOW TO ENSURE A GOOD ESD PROTECTION  
While the USB6Bx provides a high immunity to  
ESD surge, an efficient protection depends on the  
layout of the board. In the same way, with the rail to  
rail topology, the track from the VCC pin to the  
power supply and from the GND pin to GND volt-  
age must be as short as possible to avoid  
overvoltages due to parasitic phenomena (see Fig  
A1).  
Lw  
ESD  
SURGE  
REF2=+Vcc  
C=100nF  
I/O  
Vcc+Vf  
Vcl+ =  
surge >0  
surge <0  
VI/O  
It’s often harder to connect the power supply near  
to the USB6Bx unlike the ground thanks to the  
ground plane that allows a short connection.  
Vcl- = -Vf  
REF1=GND  
To ensure the same efficiency for positive surges  
when the connections can’t be short enough, we  
recommend to put close to the USB6Bx between  
VCC and ground, a capacitance of 100nF to pre-  
vent from these kinds of overvoltage disturbances  
(see Fig. A2 ).  
Vcl+  
t
NEGATIVE  
SURGE  
POSITIVE  
SURGE  
t
Vcl-  
The add of this capacitance will allow a better pro-  
tection by providing during surge a constant volt-  
age.  
IMPORTANT:  
Fig. A3 shows the improvement of the ESD pro-  
tection according to the recommendations de-  
scribed above.  
A main precaution to take is to put the protection  
device closer to the disturbance source (generally  
the connection).  
3/9  
USB6Bx  
TECHNICAL INFORMATION  
Universal Serial Bus.  
downstream can also be transmitted on two sepa-  
rate conductors within the same cable.  
The new data transmission standard, Universal  
Serial Bus (USB) is being driven by market leaders  
in the world of Computer and Telecommunica-  
tions, including Compaq, DEC, IBM, Intel,  
Microsoft, NEC and Nortel, and will become the  
leading transmission protocol within the next few  
years.  
Protection to support USB.  
Designers dealing with the USB chips are con-  
cerned about electrostatic discharge sensitivity  
(ESD) of their USB controller ICs.  
The USB controller is more than just a driver /  
receiver; it acts as a microcontroller which  
manages power and direct signal traffic. This  
complexity increases its cost over conven-  
tional devices. Therefore, a failure of a USB  
port could result in costly computer failure.  
This standard mainly provides simplified  
interconnectivity. Specialized ports on the back of  
the present PC will largely be replaced by USB  
ports. Many peripherals such as printers, key-  
boards, monitors and joysticks will also host USB  
ports.  
In order to prevent these fast transients from  
leading to severe damages in a system, a  
specific protection has been developed by  
STMicroelectronics. The USB6Bx protects  
not only the two wires of data transmission,  
but also keep the power rails in a safe limit.  
The USB offers high speed communication rates  
up to 12 Mbit/s. Only two wires (D+, D-) are re-  
quired for data transfer. Additionally, limited  
amount of power for USB devices located on the  
Fig. A3: recommended configuration for USB port protection.  
1
Vbus  
D+  
USB  
IC  
D-  
GND  
USB output  
connector  
The capacitance between the I/O transmission  
wires provides no significant signal distortion at the  
12 Mbit/s data rate, thus allowing full compatibility  
with USB standard.  
Available either in a compact SO8 or in a  
through-hole DIL8 package, this protective ele-  
ment requires minimal board space and eases the  
PCB layout thanks to its direct compatibility with  
the USB connector pin-out.  
4/9  
USB6Bx  
TELECOM AND DATACOM APPLICATIONS  
ISDN U interface protection.  
3* SMP100  
USB6Bx  
LT  
DC Power  
Source  
T1 / E1 Line Card Protection.  
USB6B1  
SMP75-8 or SMP100-8  
RTIP  
RRING  
TTIP  
TRING  
SMP75-8 or SMP100-8  
USB6B1  
High Speed Line Driver / Receiver Protection.  
+5V  
+5V  
SM6T6V8A  
SM6T6V8A  
INPUT  
OUTPUT  
DRIVER  
RECEIVER  
USB6B1  
USB6B1  
5/9  
USB6Bx  
ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C)  
Symbol  
Parameter  
IEC1000-4-2 contact discharge  
Value  
Unit  
VPP  
Peak pulse voltage  
8
15  
4
kV  
IEC1000-4-2 air discharge  
MIL STD883C-Method 3015-6  
PPP  
IPP  
Peak pulse power  
Peak pulse current  
8/20 µs  
8/20 µs  
500  
25  
W
A
Tstg  
Tj  
Storage temperature range  
Maximum junction temperature  
- 55 to + 150  
+ 150  
°C  
°C  
TL  
Lead solder temperature (10s duration)  
260  
°C  
ELECTRICAL CHARACTERISTICS (Tamb = 25°C)  
Value  
Symbol  
Parameter  
Unit  
min. typ. max.  
VBR  
Breakdown voltage between Vbus and  
GND  
IR=1mA  
6
V
IRM  
C
Leakage current  
VRM=5.25V  
10  
µA  
Capacitance between pins D+ and D-  
VCC  
not connected  
15  
pF  
V
OSC =30mV, F=1MHz, VR=0V  
Capacitance between pins D+ (or D-) and GND  
VCC=5V  
25  
pF  
VOSC =30mV, F=1MHz, VR=5V  
6/9  
USB6Bx  
Fig 1: Peak power dissipation versus initial junc-  
tion temperature.  
Fig 2: Relative variation of leakage current versus  
junction temperature (typical values).  
IR[Tj] / IR[Tj=25°C]  
Ppp[Tj initial]/Ppp[Tj initial=25°C]  
10.0  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
1.0  
0.1  
Tj(°C)  
Tj initial(°C)  
0.0  
0.1  
-40 -20  
0
20 40 60 80 100 120 140 160  
-40 -20  
0
20 40 60 80 100 120 140  
Fig 3: Relative variation of breakdown voltage ver-  
sus junction temperature (typical values).  
VBR[Tj] / VBR[Tj=25°C]  
1.10  
1.05  
1.00  
0.95  
Tj(°C)  
0.90  
-40 -20  
0
20 40 60 80 100 120 140  
7/9  
USB6Bx  
ORDER CODE  
USB 6 B1 RL  
PACKAGING:  
RL = tape and reel.(SO8 only)  
= tube  
PACKAGE:  
1 = SO8  
2 = DIL8  
VBR min  
PACKAGE MECHANICAL DATA.  
SO8 Plastic  
DIMENSIONS  
REF.  
Millimetres  
Inches  
Min. Typ. Max. Min. Typ. Max.  
A
a1  
a2  
a3  
b
1.75  
0.069  
0.010  
0.065  
0.033  
0.019  
0.010  
0.020  
L
c1  
0.1  
0.25 0.004  
1.65  
C
a3  
A
a2  
0.65  
0.35  
0.19  
0.85 0.025  
0.48 0.014  
0.25 0.007  
b
1
a1  
e
b
E
e3  
b1  
C
D
0.25 0.50 0.50 0.010  
45° (typ)  
M
c1  
D
4.8  
5.8  
5.0 0.189  
6.2 0.228  
0.197  
0.244  
5
8
E
F
e
1.27  
3.81  
0.050  
0.150  
1
4
e3  
F
3.8  
0.4  
4.0 0.15  
1.27 0.016  
0.6  
0.157  
0.050  
0.024  
L
M
S
8 (max)  
8/9  
USB6Bx  
PACKAGE MECHANICAL DATA.  
DIL8 Plastic  
DIMENSIONS  
Millimetres Inches  
Min. Typ. Max. Min. Typ. Max.  
REF.  
I
a1 0.51  
0.020  
b1  
a1  
L
B
b
0.85  
1.40 0.033  
0.055  
F
E
0.5  
0.020  
e
B
b1 0.38  
D
0.50 0.015  
10.15  
0.020  
0.399  
b
Z
e3  
D
Z
E
e
8.10 8.80 9.40 0.319 0.346 0.370  
2.54  
7.62  
0.100  
0.300  
8
1
5
4
e3  
F
I
7.1  
5.1  
0.280  
0.200  
L
3.3  
0.130  
Z
1.50  
0.063  
MARKING  
ORDER  
CODE  
Types  
Package  
Weight  
Marking  
Base Qty  
100 pcs (tube)  
USB6B1  
SO8  
0.077g  
USB62  
USB6B1  
USB6B1RL  
USB6B2  
2500 pcs (tape and reel)  
50 pcs (tube)  
USB6B2  
DIL8  
0.59g  
USB62  
- Epoxy meets UL94, V0  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of  
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by  
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to  
change without notice. This publication supersedes and replaces all information previously supplied.  
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-  
proval of STMicroelectronics.  
The ST logo is a registered trademark of STMicroelectronics  
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia  
Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.  
http://www.st.com  
9/9  

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