VG8640CB1M/1 [STMICROELECTRONICS]

CMOS Sensor, 60fps, Surface Mount;
VG8640CB1M/1
型号: VG8640CB1M/1
厂家: ST    ST
描述:

CMOS Sensor, 60fps, Surface Mount

传感器 换能器
文件: 总7页 (文件大小:102K)
中文:  中文翻译
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VG5640, VG6640, VG8640,  
VD5640, VD6640, VD8640  
1.3 megapixel high dynamic range image sensor  
Data brief  
Automotive Safety Integrity Level (ASIL) data  
included as part of each frame  
Automotive qualification: AEC-Q100 grade 2  
Operating junction temperature: -40oC to  
+125oC  
Description  
This is a high performance, high dynamic range  
1.3 megapixel image sensor. Designed for  
automotive, security and other demanding  
outdoor applications, the device offers supreme  
low light performance and numerous safety  
integrity features.  
An embedded Bayer data pre-processor  
integrates a wide range of image enhancement  
functions, designed to ensure high image quality.  
Features  
1.3 megapixel resolution sensor (1304 x 980)  
in 1/2.7 inch optical format  
An advanced synchronization facility allows multi-  
camera systems to work with minimal latency and  
motion temporal mismatch artifacts.  
High dynamic range (HDR) pixel architecture,  
up to 132 dB dynamic range  
Best in class FSI high pixel sensitivity with  
This sensor targets the market for mono and  
stereo forward facing, mirror replacement, multi  
purpose cameras in cars, parking assist and all  
round view camera systems and is a good match  
for the needs of HD security applications.  
3.75 µm pixel size  
45 frames per second at full resolution,  
60 frames per second at 720p resolution  
Small physical size of 9.0 mm x 9.3 mm in  
automotive qualified package Im2BGA  
Synchronization for multiple cameras  
Highly configurable HDR image pre-processing  
Table 1. Device variants  
Motion and flicker tolerant HDR options  
including flicker flag to denote affected pixels  
Device  
Color filter  
Package  
Comprehensive inline pixel defect correction  
VG5640  
VG6640  
VG8640  
VD5640  
VD6640  
VD8640  
CCCC  
RGB Bayer  
RCCC  
Im2BGA  
Im2BGA  
2
Fast+ I C control interface  
(a)  
MIPI CSI-2 version 1.01 serial and/or 12-bit  
Im2BGA  
parallel video data interface  
CCCC  
None(bare die)  
None(bare die)  
None(bare die)  
RGB Bayer  
RCCC  
a. Copyright© 2005-2010 MIPI Alliance, Inc. Standard  
for Camera Serial Interface 2 (CSI-2) version 1.01,  
limited to 1 Gbps per lane  
October 2015  
DocID026813 Rev 3  
1/7  
For further information contact your local STMicroelectronics sales office.  
www.st.com  
 
Technical specifications  
VG5640, VG6640, VG8640, VD5640, VD6640, VD8640  
Technical specifications  
Table 2. Technical specifications  
Detail  
Feature  
Pixel resolution  
1304 x 980  
Sensor technology  
Pixel size  
65 nm, CMOS imager process  
3.75 µm x 3.75 µm  
3 integration times with real-time data merging  
+13 dB (x5) maximum  
+12 dB (maximum)  
72 dB  
HDR characteristics  
Pixel gain  
Analog gain  
Dynamic range (linear mode)  
Dynamic range (in scene)  
132 dB  
Peak signal to noise ratio (on pixel)  
Minimum illumination (on pixel)  
Pixel sensitivity (without colour filter)  
Power consumption  
42 dB @ 12 lux  
1.0 mlux @ SNR 1 (no color filter, 30ms Integration)  
>=32V/lxsec @3200K  
400 mW @ 30 fps  
-40°C to +125°C functional  
Junction Temperature range (Tj)  
(-40°C to +105°C for acceptable images)  
Shutter  
Electrical rolling  
Peak quantum efficiency  
NIR cut-off wavelength  
Fixed pattern noise (FPN)  
Temporal read noise  
Image lag  
>60% @ 520 nm  
>=10% QE @ <900 nm  
<0.01% @ 20°C  
<0.025% @ full swing  
<0.1%  
Package option  
Exposed glass BGA 9.0 mm x 9.3 mm  
45 fps  
Frame rate at full resolution  
Frame rate at HD video (720p) resolution 60 fps  
Parallel interface data rate  
66 Mpixel/s (12 bits per pixel)  
CSI-2 serial interface data rate  
2 x 550 Mbit/s  
2.8V analog supply  
Supply voltages  
1.8V or 2.8V digital I/O supply  
1.2V digital core supply (on-board regulator available)  
Temperature sensor accuracy  
External clock frequency range  
Oscillator frequency range  
±3°C over the operating range  
12-50 MHz, AC or DC coupled  
12-27 MHz, quartz crystal  
±1 line through an I2C command or through dedicated  
signal  
Frame synchronization  
2/7  
DocID026813 Rev 3  
VG5640, VG6640, VG8640, VD5640, VD6640, VD8640  
Technical specifications  
Functional description  
The VG6640 block diagram is shown in Figure 1. The main blocks are as follows:  
Master controller  
clock and reset management  
I2C bus control interface and transaction routing  
safe control of system state changes from Standby to Streaming  
device reinitialization to default mode (software Reset)  
management of integration times across the three captures  
Non Volatile Memory (NVM) management  
Custom Analog Block (CAB)  
Video timing block  
HDR video pipe  
responsible for real time image data processing at pixel clock rate, Processes the  
RAW pixel data from the ADCs in the CAB. The HDR video pipe contains a set of  
defect correction and data coding blocks.  
Image data interfaces  
video data coders and transmitters for the serial (MIPI CSI-2) and parallel  
interfaces  
On chip regulators  
to supply the analog block and, optionally, the digital core  
Clock and PLL  
to provide all the clocks required for data capture through to output interfaces from  
a single frequency source  
Non volatile memory (NVM)  
to store production and part to part variance data  
Temperature sensors  
to allow the host application to monitor sensor temperature  
Figure 1. Block Diagram  
External sync.  
Power supply  
Image sensor  
Video timing  
1V2  
reg.  
Temp. Charge  
sensor pumps  
Custom analog block  
(CAB)  
MIPI  
HDR  
video pipe  
1304 x 980  
HDR pixels  
CSI-2 &  
parallel  
I/O  
Companion  
device  
Master  
controller  
Clock &  
PLL  
2
NVM  
I C  
External clock  
DocID026813 Rev 3  
3/7  
7
 
 
Technical specifications  
Interfaces  
VG5640, VG6640, VG8640, VD5640, VD6640, VD8640  
The VGx640 is ready to connect via one of two interfacing options. The sensor supports a  
12bit (ITU) parallel interface with frame and line sync signals and a pixel clock, or a dual  
lane MIPI CSI-2 serial interface. Before transmission the 22bit HDR image data is  
compressed down to 12bits using a piece wise linear (PWL) compression algorithm to  
minimize perceptible losses.  
The 12bit ITU parallel interface is capable of 66Mpixel/s.  
The dual lane MIPI CSI-2 serial interface supports 1.1Gbit/s and is the industry standard for  
low EMI and excellent EMC high speed interfacing.  
The sensor is configured and controlled via a I2C (Inter Integrated Circuit) interface  
operating in either Fast (up to 400KHz) or Fast+(up to 1MHz) modes.  
Power supplies  
Power supplies required by the sensor are:  
2.8V for the analogue blocks  
2.8V or 1.8V for the digital I/Os  
The digital core operates at 1.2V. This can be supplied via an internal regulator or from  
an external 1.2V supply.  
Clock  
An input clock is required which can be supplied from an external clock in the range of  
12MHz to 50MHz or from a quartz crystal of between 12MHz to 27MHz.  
Image enhancement, status and test features  
The device contains an embedded video processor and delivers uncolored images up to 60  
frames/s at 720p resolution, or 45 frames/s at 1304x980 resolution. The video processor  
integrates a wide range of image enhancements, designed to ensure a high image quality.  
These enhancements include:  
External frame synchronization  
Windowing/image cropping  
Subsampling  
Dark calibration  
Fixed pattern noise correction  
Frame cropping  
Defective pixel correction  
Test pattern generation  
Statistics generation  
Embedded sensor data  
HDR Merge modes  
The on chip video processor implements and manages one of five different merge schemes  
with each of the key parameters user configurable by the host to give a fully flexible HDR  
scheme to maximise in scene dynamic range and maximise SNR. There are also IP blocks  
included to manage and minimise ‘flicker’, such as indicators and PWM controlled lighting,  
and ‘ghosting’, caused by motion of sensor or in scene movement at the maximum frame  
4/7  
DocID026813 Rev 3  
VG5640, VG6640, VG8640, VD5640, VD6640, VD8640  
Ordering Information  
rates. Many of the configuration parameters for the HDR image capture are duplicated in a  
second register bank. These two banks can be toggled at the maximum frame rates to  
provide images from two distinct configurations to, for example, optimise for machine vision  
and for driver display.  
External frame synchronization  
The external frame synchronization offers two methods for control synchronization of the  
frame start of multiple cameras.  
A common Frame Sync signal from the host or a ‘principal’ camera.  
An I2C bus command sent by the host to set an offset to the current frame start.  
Using one of these techniques each camera sync can be corrected to an accuracy of less  
than 1 line period.  
Safety integrity  
A set of self diagnostic features allow the device to support the automotive safety integrity  
level (ASIL) system requirements. These include the following:  
Cyclic redundancy checking (CRC) on image data through the parallel or serial  
interface  
Error correction codes (ECC) for sensor critical memories  
Analog in line test information  
Digital in line test information  
Two temperature sensors  
Access to diagnostic information via embedded data lines in the image  
Ordering Information  
Table 3. Ordering information  
Ordering code(1)  
Color filter  
Device package  
Packing  
Tape & reel(2)  
VG5640xB1M/1  
VG6640xB1M/1  
VG8640xB1M/1  
VG5640xB1M  
CCCC  
RGB Bayer  
RCCC  
Im2BGA  
Im2BGA  
Tape & reel(2)  
Tape & reel(2)  
Tray(3)  
Im2BGA  
CCCC  
Im2BGA  
VG6640xB1M  
RGB Bayer  
RCCC  
Im2BGA  
Tray(3)  
VG8640xB1M  
Im2BGA  
Tray(3)  
VD5640xzSB/RW  
VD6640xzSB/RW  
VD8640xzSB/RW  
CCCC  
None (bare die)  
None (bare die)  
None (bare die)  
Reconstructed wafer  
Reconstructed wafer  
Reconstructed wafer  
RGB Bayer  
RCCC  
1. Substitute x with A for automotive grade; C for industrial grade parts. For bare die substitute z for wafer  
thickness.  
2. For volume orders.  
3. For sample orders.  
DocID026813 Rev 3  
5/7  
7
®
ECOPACK  
VG5640, VG6640, VG8640, VD5640, VD6640, VD8640  
®
ECOPACK  
In order to meet environmental requirements, ST offers these devices in different grades of  
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK  
specifications, grade definitions and product status are available at: www.st.com.  
®
ECOPACK is an ST trademark  
Revision history  
Table 4. Document revision history  
Date  
Revision  
Changes  
20-Aug-2014  
06-Nov-2014  
01-Oct-2015  
1
2
3
Initial version  
Update Features and Functional description sections  
Updated to align with v7 of the datasheet  
6/7  
DocID026813 Rev 3  
®
VG5640, VG6640, VG8640, VD5640, VD6640, VD8640  
ECOPACK  
IMPORTANT NOTICE – PLEASE READ CAREFULLY  
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and  
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information  
on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order  
acknowledgment.  
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or  
the design of Purchasers’ products.  
No license, express or implied, to any intellectual property right is granted by ST herein.  
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.  
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.  
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.  
© 2015 STMicroelectronics – All rights reserved  
DocID026813 Rev 3  
7/7  
7

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