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VN330SP13TR-E [STMICROELECTRONICS]

4 CHANNEL, BUF OR INV BASED PRPHL DRVR, PDSO10, LEAD FREE, SOP-10;
VN330SP13TR-E
型号： VN330SP13TR-E
厂家： ST    ST
描述：

4 CHANNEL, BUF OR INV BASED PRPHL DRVR, PDSO10, LEAD FREE, SOP-10

外围驱动器 驱动程序和接口 接口集成电路 继电器 固态继电器 光电二极管
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VN330SP  
QUAD HIGH SIDE SMART  
POWER SOLID STATE RELAY  
TYPE  
Vdemag  
*
RDS(on)  
*
IOUT  
*
VCC  
VN330SP VCC-55V 0.32 Ω**  
0.7 A  
36 V  
* per Channel  
** at TJ = 85 oC  
■
■
OUTPUT CURRENT: 0.7A PER CHANNEL  
DIGITAL INPUTS CLAMPED AT 32V  
MINIMUM VOLTAGE  
10  
■
SHORTED LOAD AND  
1
OVERTEMPERATURE PROTECTIONS  
BUILT-IN CURRENT LIMITER  
UNDER VOLTAGE SHUT DOWN  
OPEN DRAIN DIAGNOSTIC OUTPUT  
Power SO-10 TM  
■
■
■
■
FAST DEMAGNETIZATION OF INDUCTIVE  
LOADS  
Active current limitation avoids dropping the  
system powersupply in case of shorted load.  
DESCRIPTION  
The VN330SP is a monolithic device made using  
Built-in thermal shut-down protects the chip from  
over temperature and short circuit.  
The open drain diagnostic output indicates short  
circuit and overtemperatureconditions.  
STMicroelectronics  
VIPower  
Technology,  
intended for driving four indipendent resistive or  
inductive loads with one side connected to  
ground.  
BLOCK DIAGRAM  
1/9  
February 1999  
VN330SP  
ABSOLUTE MAXIMUM RATING  
Symbol  
Parameter  
Value  
Unit  
V
VCC  
-VCC  
IOUT  
IR  
Power Supply Voltage  
Reverse Supply Voltage  
Output Current (cont.)  
45  
-0.3  
V
Internally Limited  
A
Reverse Output Current (per channel)  
Input Current (per channel)  
-6  
A
IIN  
±10  
±10  
2000  
400  
mA  
mA  
V
IDIAG  
VESD  
EAS  
DIAG Pin Current  
Electrostatic Discharge (1.5 kΩ, 100 pF)  
Single Pulse Avalanche Energy per Channel Not  
Symultaneously (see figure 1)  
mJ  
o
Ptot  
Tj  
Power Dissipation at Tc ≤ 25 C  
Internally Limited  
Internally Limited  
-55 to 150  
W
oC  
oC  
Junction Operating Temperature  
Storage Temperature  
Tstg  
CONNECTION DIAGRAM  
CURRENT AND VOLTAGE CONVENTIONS  
2/9  
VN330SP  
THERMAL DATA  
Rthj-case Thermal Resistance Junction-case (1)  
Max  
Max  
2
50  
oC/W  
oC/W  
Rthj-amb  
Thermal Resistance Junction-ambient ($)  
(1) All channels ON  
($) When mounted using minimum recommended pad size on FR-4 board  
ELECTRICAL CHARACTERISTICS (10 V < VCC < 36 V; -25 oC < TJ < 125 oC unless otherwise  
specified)  
POWER  
Symbol  
VCC  
Parameter  
Supply Voltage  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
10  
36  
V
o
Ron  
On State Resistance  
IOUT = 0.5 A  
IOUT = 0.5 A  
TJ = 125 C  
0.4  
0.32  
Ω
Ω
o
TJ = 85 C  
IS  
Supply Current  
All Channels Off  
1
10  
mA  
mA  
On State (Tj =125oC) Iout1 .. Iout4 =0  
Iout = 0.5A LLOAD = 1 mH  
Vdemag  
Output Voltage at  
Turn-Off  
VCC-65 VCC-55 VCC-45  
V
SWITCHING (VCC = 24 V)  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
td(on)  
Turn-on Delay Time Of IOUT = 0.5 A Resistive Load  
Output Current  
Input Rise Time < 0.1 µs  
o
Tj = 25 C  
30  
40  
60  
µs  
µs  
Tj = 125 oC  
tr  
td(off)  
tf  
Rise Time Of Output  
Current  
IOUT = 0.5 A Resistive Load  
Input Rise Time < 0.1 µs  
o
Tj = 25 C  
50  
20  
8
100  
115  
µs  
µs  
Tj = 125 oC  
Turn-off Delay Time Of IOUT = 0.5 A Resistive Load  
Output Current  
Input Rise Time < 0.1 µs  
o
Tj = 25 C  
30  
40  
µs  
µs  
Tj = 125 oC  
Fall Time Of Output  
Current  
IOUT = 0.5 A Resistive Load  
Input Rise Time < 0.1 µs  
o
Tj = 25 C  
15  
20  
µs  
µs  
Tj = 125 oC  
(di/dt)on Turn-on Current Slope IOUT = 0.5 A  
IOUT = Ilim  
0.5  
2
A/µs  
A/µs  
o
Tj = 25 C  
(di/dt)off Turn-off Current Slope IOUT = 0.5 A  
IOUT = Ilim  
2
4
A/µs  
A/µs  
o
Tj = 25 C  
3/9  
VN330SP  
ELECTRICAL CHARACTERISTICS (continued)  
LOGIC INPUT (Each Channel)  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
VIL  
Input Low Level  
Voltage  
2
V
VIH  
Input High Level  
Voltage (see note 1)  
3.5  
V
V
VI(hyst.) Input Hysteresis  
Voltage  
0.5  
IIN  
Input Current  
VIN = 0 to 30 V  
VIN = 0 to 2 V  
600  
25  
µA  
µA  
25  
32  
ILGND  
VICL  
Output Current in  
VCC = VINX = GND = DIAG = 24 V  
mA  
Ground Disconnection TJ = 25 oC  
Input Clamp Voltage  
(see note 1)  
IIN = 1 mA  
IIN = -1 mA  
36  
-0.7  
V
V
note 1 : The input voltage is internally clamped at 32V minimum, it is possible to connect the input pins to an higher voltage via an external  
resistor calculate to not exceed 10 mA.  
PROTECTION AND DIAGNOSTICS  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
VSTAT (• ) Status Voltage Output ISTAT = 5 mA  
1
V
Low  
(Fault Condition)  
VSCL (• ) Status Clamp Voltage  
ISTAT = 1 mA  
ISTAT = -1 mA  
32  
5
36  
-0.7  
V
V
VUSD  
Under Voltage Shut  
Down  
8
V
VOL  
ILIM  
Low State Out Voltage VIN = VILj RLOAD ≥ 10 MΩ  
1.5  
2.5  
V
A
DC Short Circuit  
Current  
VCC = 24 V  
RLOAD < 10 mΩ  
0.7  
IOVPK  
IDIAGH  
ILOAD  
tSC  
Peak Short Circuit  
Current  
VCC = 24 V Vin =30V  
RLOAD < 10 mΩ (see figure 2)  
4
A
Leakage on diag pin in VDIAG = 24 V  
high state  
100  
50  
µA  
µA  
µs  
oC  
oC  
Output Leakage  
Current  
VCC = 10 to 36V VIN = VIL  
Delay Time of Current  
Limiter  
100  
TTSD  
Thermal Shut-down  
Temperature  
150  
135  
170  
155  
TR  
Reset Temperature  
(•) Status determination > 100 µs after the switching edge.  
Note: If INPUTn pin is left floating the corresponding channel will automatically switch off. If GND pin isdisconnetted, all channels will switch  
off provided VCC does not exceed 36V  
4/9  
VN330SP  
FIGURE 1: AvalancheEnergy Test Circit  
FIGURE 2: Peak Short Circuit Current Test Circit  
5/9  
VN330SP  
TRUTH TABLE  
INPUTn  
OUTPUTn  
DIAGNOSTIC  
Normal Operation  
Over-temperature  
Under-voltage  
L
H
L
H
H
H
L
H
L
L
H
L
L
H
L
L
H
H
Shorted Load  
(current limitation)  
L
H
L
H
H
H
FIGURE 3: Switching Waveforms  
6/9  
VN330SP  
SWITCHING PARAMETERS TEST CONDITIONS  
DRIVING CIRCUIT  
7/9  
VN330SP  
PowerSO-10 MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
3.35  
0.00  
0.40  
0.35  
9.40  
7.40  
9.30  
7.20  
7.20  
6.10  
5.90  
TYP.  
MAX.  
3.65  
0.10  
0.60  
0.55  
9.60  
7.60  
9.50  
7.40  
7.60  
6.35  
6.10  
MIN.  
0.132  
0.000  
0.016  
0.013  
0.370  
0.291  
0.366  
0.283  
0.283  
0.240  
0.232  
MAX.  
0.144  
0.004  
0.024  
0.022  
0.378  
0.300  
0.374  
0.291  
0.300  
0.250  
0.240  
A
A1  
B
c
D
D1  
E
E1  
E2  
E3  
E4  
e
1.27  
0.050  
F
1.25  
1.35  
0.049  
0.543  
0.053  
0.567  
H
13.80  
14.40  
h
0.50  
1.70  
0.002  
0.067  
L
1.20  
0o  
1.80  
8o  
0.047  
0.071  
q
α
B
0.10  
A
B
10  
6
H
E
E3 E1  
E2  
E4  
1
5
SEATING  
PLANE  
DETAIL”A”  
e
B
A
C
M
0.25  
Q
D
=
=
=
=
h
D1  
SEATING  
PLANE  
A
F
A1  
L
A1  
DETAIL”A”  
α
0068039-C  
8/9  
VN330SP  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is  
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are  
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products  
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is a trademark of STMicroelectronics  
1999 STMicroelectronics – Printed in Italy – All Rights Reserved  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil -Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands -  
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.  
http://www.st.com  
.
9/9  

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