VND5004CSP30-E [STMICROELECTRONICS]
Double 4mOhm high side driver with analog current sense for automotive applications;
| 型号： | VND5004CSP30-E |
| 厂家： | 
ST |
| 描述： | Double 4mOhm high side driver with analog current sense for automotive applications 驱动 接口集成电路 |
| 文件： | 总28页 (文件大小：363K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
VND5004CSP30
Double 4 mȍ high-side driver with analog CurrentSense for
automotive applications
Datasheet - production data
– Reverse battery protection with self switch-
on of the PowerMOS
– Electrostatic discharge protection
0XOWL3RZHU6ꢀꢁꢂꢀ
*$3*ꢀꢁꢂꢁꢂꢃꢂꢀꢄꢀ&)7
Applications
x
All types of resistive, inductive and capacitive
loads
Features
x
Suitable for power management applications
Max transient supply voltage
Operating voltage range
V
V
R
41 V
4.5 to 27 V
4 mȍ
CC
CC
ON
Description
Max On-State resistance (per ch.)
Current limitation (typ)
The device is a double channel high-side driver
manufactured using STMicroelectronics
proprietary VIPower M0-5 technology. It is
I
100 A
LIMH
®
(1)
Off state supply current
I
2 μA
S
intended for driving resistive or inductive loads
1. Typical value with all loads connected
with one side connected to ground. Active V
pin voltage clamp and load dump protection
CC
x
x
AEC-Q100 qualified
General
circuit protect the devices against transients on
the V pin.
CC
– Inrush current active management by
power limitation
The device integrates an analog current sense
which delivers a current proportional to the load
current (according to a known ratio) when
CS_DIS is driven low or left open. When CS_DIS
is driven high, the CURRENT SENSE pin is high
impedance.
– Very low stand-by current
– 3.0 V CMOS compatible input
– Optimized electromagnetic emission
– Very low electromagnetic susceptibility
Output current limitation protects the devices in
overload condition. In case of long duration
overload, the device limits the dissipated power to
a safe level up to thermal shutdown intervention.
Thermal shutdown with automatic restart allows
the device to recover normal operation as soon as
a fault condition disappears.
– In compliance with the 2002/95/EC
European directive
x
x
Diagnostic functions
– Proportional load current sense
– Current sense disable
– Thermal shutdown indication
Protection
– Undervoltage shutdown
– Overvoltage clamp
– Load current limitation
– Thermal shutdown
– Self limiting of fast thermal transients
– Protection against loss of ground and loss
of V
CC
January 2017
DocID027938 Rev 3
1/28
This is information on a product in full production.
www.st.com
Contents
VND5004CSP30
Contents
1
2
Block diagram and pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1
2.2
2.3
2.4
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.1
3.2
3.3
MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Maximum demagnetization energy (VCC = 13.5 V) . . . . . . . . . . . . . . . . . 19
4
5
Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 MultiPowerSO-30 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1
5.2
MultiPowerSO-30 package information . . . . . . . . . . . . . . . . . . . . . . . . . . 23
MultiPowerSO-30 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
6
7
Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2/28
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VND5004CSP30
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Suggested connections for unused and n.c. pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Switching (VCC = 13 V; Tj = 25 °C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Logic input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Protection and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
CurrentSense (8 V < V < 16 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
CC
Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Electrical transient requirements (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Electrical transient requirements (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Electrical transient requirements (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Thermal parameters for MultiPowerSO-30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
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3
List of figures
VND5004CSP30
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Configuration diagram (not to scale) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Off state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 10. Input low level. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 11. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 12. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 13. On state resistance vs. T
Figure 14. On state resistance vs. V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
case
CC
Figure 15. Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 16. Turn-On voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 17.
I
vs. T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
LIMH
case
Figure 18. Turn-Off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 19. CS_DIS high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 20. CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 21. CS_DIS low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 22. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 23. Maximum turn off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 24. MultiPowerSO-30 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 25. Rthj-amb vs. PCB copper area in open box free air condition (one channel ON). . . . . . . . 20
Figure 26. MultiPowerSO-30 thermal impedance junction ambient single pulse (one channel ON) . . 21
Figure 27. Thermal fitting model of a double channel HSD in MultiPowerSO-30 . . . . . . . . . . . . . . . . 21
Figure 28. MultiPowerSO-30 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 29. MultiPowerSO-30 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4/28
DocID027938 Rev 3
VND5004CSP30
Block diagram and pin configurations
1
Block diagram and pin configurations
Figure 1. Block diagram
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Table 1. Pin functions
Function
Name
VCC
Battery connection
Power output
OUTPUT1,2
GND
Ground connection
Voltage controlled input pin with hysteresis, CMOS compatible. Controls
output switch state
INPUT1,2
CURRENT SENSE1,2 Analog current sense pin, delivers a current proportional to the load current
CS_DIS Active high CMOS compatible pin, to disable the current sense pins
DocID027938 Rev 3
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27
Block diagram and pin configurations
VND5004CSP30
Figure 2. Configuration diagram (not to scale)
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Table 2. Suggested connections for unused and n.c. pins
Current
Connection /
pin
For test
only
N.C.
Output
Input
CS_DIS
Sense
(1)
Floating
N.R.
X
X
X
X
X
X
Through 1 k:ꢀ
Through10 k:ꢀ Through 10 k:ꢀ
resistor resistor
To ground
N.R.
N.R.
resistor
1. Not recommended.
6/28
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VND5004CSP30
Electrical specifications
2
Electrical specifications
Figure 3. Current and voltage conventions
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2.1
Absolute maximum ratings
Stressing the device above the ratings listed in Table 3 may cause permanent damage to
the device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the operating sections of this specification is not implied.
Exposure to the conditions in this section for extended periods may affect device reliability.
Table 3. Absolute maximum ratings
Symbol
Parameter
Value
Unit
V
DC supply voltage
27
V
V
CC
V
Transient supply voltage (T < 400 msꢁꢀR
Reverse DC supply voltage
DC output current
> 0.5 ȍꢂ
41
16
CCPK
load
-V
V
CC
I
Internally limited
70
A
OUT
-I
Reverse DC output current
DC input current
A
OUT
I
-1 to 10
-1 to 10
mA
mA
IN
I
DC current sense disable input current
CSD
Vcc-41
+Vcc
V
V
V
Current sense maximum voltage (V > 0 V)
CSENSE
CC
Maximum switching energy (single pulse)
E
342
mJ
(L = 0.3 mH; R = 0 ȍ; V = 13.5 V; T = 150 °C;
jstart
MAX
L
bat
I
= I (typ.))
OUT
limL
Electrostatic discharge (Human Body Model: R = 1.5 kȍꢃ
C = 100 pF)
V
V
2000
750
V
V
ESD
Charge device model (CDM-AEC-Q100-011)
ESD
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27
Electrical specifications
Symbol
VND5004CSP30
Table 3. Absolute maximum ratings (continued)
Parameter
Value
Unit
T
Junction operating temperature
Storage temperature
-40 to 150
-55 to 150
°C
°C
j
T
STG
2.2
Thermal data
Table 4. Thermal data
Parameter
Symbol
Max value
Unit
R
Thermal resistance junction-case (with one channel ON)
Thermal resistance junction-ambient
0.35
°C/W
°C/W
thj-case
(1)
R
58
thj-amb
1. PCB FR4 area 58 mmX58 mm, PCB thickness 2 mm, Cu thickness 35 Pm, minimum pad layout.
8/28
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VND5004CSP30
Electrical specifications
2.3
Electrical characteristics
Values specified in this section are for 8 V < V < 24 V, -40 °C < T < 150 °C, unless
CC
j
otherwise stated.
Table 5. Power section
Test conditions
Symbol
Parameter
Min. Typ. Max. Unit
Operating supply
voltage
V
4.5
13
3.5
0.5
27
V
V
V
CC
V
Undervoltage shutdown
4.5
USD
Undervoltageshut-down
hysteresis
V
USDhyst
I
I
I
= 15 A; T = 25 °C
4
8
6
mȍ
mȍ
mȍ
OUT
OUT
OUT
j
(1)
R
On-state resistance
= 15 A; T = 150 °C
j
ON
= 15 A; V = 5 V; T = 25 °C
CC
j
R
in reverse battery
dson
R
V
=-13V; I
=-15A; T =25°C
4
mȍ
V
ON REV
CC
OUT
j
condition
V
V
clamp voltage
I
=20 mA; I =0A
OUT1,2
41
46
52
clamp
CC
CC
Off state; V = 13 V; T = 25 °C;
(2)
(2)
CC
j
2
5
μA
V
= V
= V
= V
= 0 V
IN
OUT
SENSE
CSD
I
Supply current
S
On state; V = 13 V; V = 5 V;
CC
IN
3.5
6
3
5
mA
μA
μA
I
= 0 A
OUT
V
= V
= 0 V; V = 13 V;
IN
OUT CC
0
0
0.01
T = 25 °C
j
Off-state output
current
I
(1)
L(off)
V
= V
= 0 V; V = 13 V;
IN
OUT CC
T = 125 °C
j
1. For each channel.
2. PowerMOS leakage included.
Table 6. Switching (V = 13 V; T = 25 °C)
CC
j
Symbol
Parameter
Test conditions
Min.
Typ.
Max. Unit
t
Turn-on delay time
Turn-on delay time
R = 0.87 ȍ (see Figure 5)
—
—
25
35
—
—
μs
μs
d(on)
L
t
R = 0.87 ȍ (see Figure 5)
L
d(off)
See
Figure 16
(dV
(dV
/dt)
Turn-on voltage slope R = 0.87 ȍ
—
—
—
—
—
—
—
—
Vꢄμs
Vꢄμs
mJ
OUT
on
off
L
See
Figure 16
/dt)
Turn-off voltage slope R = 0.87 ȍ
OUT
L
Switching energy
W
R = 0.87 ȍ (see Figure 5)
5.4
2.3
ON
L
losses during t
won
Switching energy
losses during t
W
R = 0.87 ȍ (see Figure 5)
mJ
OFF
L
woff
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27
Electrical specifications
Symbol
VND5004CSP30
Table 7. Logic input
Test conditions
Parameter
Min. Typ. Max. Unit
V
Input low level voltage
Low level input current
Input high level voltage
High level input current
Input hysteresis voltage
0.9
V
μA
V
IL1,2
I
V =0.9V
1
IL1,2
IN
V
2.1
IH1,2
IH1,2
I
V =2.1V
10
7
μA
V
IN
V
0.25
5.5
I(hyst)1,2
I
I
= 1 mA
V
IN
IN
V
Input clamp voltage
ICL1,2
= -1 mA
-0.7
V
V
CS_DIS low level voltage
Low level CS_DIS current
CS_DIS high level voltage
High level CS_DIS current
CS_DIS hysteresis voltage
0.9
V
CSDL
I
V
V
= 0.9 V
1
μA
V
CSDL
CSD
CSD
V
2.1
CSDH
CSDH
I
= 2.1 V
10
7
μA
V
V
0.25
5.5
CSD(hyst)
I
I
= 1 mA
V
CSD
CSD
V
CS_DIS clamp voltage
CSCL
= -1 mA
-0.7
V
Table 8. Protection and diagnostics
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
V
= 13 V
70
100
140
140
A
A
CC
I
Short circuit current
limH
5 V < V < 24 V
CC
Short circuit current
during thermal cycling
I
V
= 13 V; T < T < T
TSD
40
A
limL
CC
R
j
T
Shutdown temperature
Reset temperature
150
175
200
°C
°C
TSD
T
T
+1
T
+5
RS
R
RS
Thermal reset of
STATUS
T
135
°C
°C
V
RS
Thermal hysteresis
T
7
HYST
(T
-T )
TSD
R
Turn-off output voltage
clamp
I
= 2 A; V = 0;
OUT IN
V
V
-27
V
-30
V
-33
CC
DEMAG
CC
CC
L = 6 mH
Note:
To ensure long term reliability under heavy overload or short-circuit conditions, protection
and related diagnostic signals must be used together with a proper software strategy. If the
device is subjected to abnormal conditions, this software must limit the duration and number
of activation cycles.
10/28
DocID027938 Rev 3
VND5004CSP30
Symbol
Electrical specifications
Table 9. CurrentSense (8 V < V < 16 V)
CC
Parameter
Test conditions
Min.
Typ.
Max. Unit
I
= 15 A; V
= 4 V; V
= 0 V;
= 0 V;
OUT
SENSE
CSD
CSD
K
I
I
/I
T = -40 °C
11530 16000 19340
12730 16000 19270
1
2
OUT SENSE
j
T = 25 °C to 150 °C
j
I
= 30 A; V
SENSE
= 4 V; V
OUT
K
/I
T = -40 °C
13430 16150 17880
14500 16150 17880
OUT SENSE
j
T = 25 °C to 150 °C
j
I
V
= 0 A; V
= 0 V; V
CSD
= 5 V;
= 0 V;
OUT
SENSE
0
0
5
5
μA
μA
V
= 0 V; T = -40 °C to 150 °C
IN
j
I
Analog sense current
SENSE0
I
V
= 0 A; V
= 0 V; V
OUT
SENSE CSD
400
= 5 V; T = -40 °C to 150 °C
IN
j
Max analog sense output
voltage
I
R
= 45 A; V
= 0 V;
OUT
CSD
V
SENSE
= 3.9 kȍ
SENSE
Analog sense output
voltage in overtemperature
condition
V
V
= 13 V; R
= 3.9 kȍ
9
8
V
SENSEH
SENSEH
CC
SENSE
SENSE
Analog sense output
current in overtemperature
condition
I
V
= 13 V; V
= 5 V
mA
Ps
CC
V
I
< 4 V; 5 A < I
= 90% of I
< 30 A;
OUT
SENSE
Delay response time from
falling edge of CS_DIS pin
t
50
100
20
SENSE
SENSE max
DSENSE1H
(see Figure 4)
V
I
< 4 V; 5 A < I
= 10% of I
< 30 A;
SENSE
OUT
Delay response time from
rising edge of CS_DIS pin
t
t
5
Ps
Ps
Ps
SENSE
SENSE max
DSENSE1L
(see Figure 4)
V
I
< 4 V; 5 A < I
= 90% of I
< 30 A;
SENSE
OUT
Delay response time from
rising edge of INPUT pin
270
100
600
250
SENSE
SENSE max
DSENSE2H
(see Figure 4)
V
I
< 4 V; 5 A < I
= 10% of I
< 30 A;
SENSE
OUT
Delay response time from
falling edge of INPUT pin
t
SENSE
SENSE max
DSENSE2L
(see Figure 4)
Figure 4. Current sense delay characteristics
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DocID027938 Rev 3
11/28
27
Electrical specifications
VND5004CSP30
Table 10. Truth table
(1)
SENSEn(V
= 0V)
CSD
Conditions
INPUTn
OUTPUTn
(see Figure 3)
L
L
0
Normal operation
Overtemperature
Undervoltage
H
H
Nominal
L
L
L
0
H
V
SENSEH
L
L
L
0
0
H
L
H
H
L
L
L
0
Short circuit to GND
0 if T < T
j
TSD
(R d 10 mȍ)
SC
V
if T > T
SENSEH
j
TSD
L
H
H
0
Short circuit to V
CC
H
< Nominal
Negative output voltage clamp
L
L
0
1. If VCSD is high, the SENSE output is at a high impedance. Its potential depends on leakage currents and
the external circuit.
Figure 5. Switching characteristics
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12/28
DocID027938 Rev 3
VND5004CSP30
Electrical specifications
Table 11. Electrical transient requirements (part 1)
(1)
ISO 7637-2:
2004(E)
Test levels
Number of
pulses or
test times
Burst cycle/pulse
repetition time
Delays and
Impedance
III
IV
Test pulse
5000
pulses
1
-75 V
-100 V
+50 V
0.5 s
0.2 s
5 s
5 s
2 ms, 10 ȍ
50 μs, 2 ȍ
5000
pulses
2a
+37 V
3a
3b
4
-100 V
+75 V
-6 V
-150 V
+100 V
-7 V
1h
90 ms
90 ms
100 ms
100 ms
0.1 μs, 50 ȍ
0.1 μs, 50 ȍ
100 ms, 0.01 ȍ
400 ms, 2 ȍ
1h
1 pulse
1 pulse
(2)
5b
+65 V
+87 V
1. The above test levels must be considered referred to VCC = 13.5V except for pulse 5b.
2. Valid in case of external load dump clamp: 40V maximum referred to ground. The protection strategy
allows PowerMOS to be cyclically switched on during load dump, so distributing the load dump energy
along the time and to transfer a part of it to the load.
Table 12. Electrical transient requirements (part 2)
(1)
ISO 7637-2:
2004(E)
Test level results
III
IV
Test pulse
1
C
C
C
C
C
C
C
C
C
C
C
C
2a
3a
3b
4
(2) (3)
5b
1. The above test levels must be considered referred to VCC = 13.5V except for pulse 5b
2. Valid in case of external load dump clamp: 40V maximum referred to ground. The protection strategy
allows PowerMOS to be cyclically switched on during load dump, so distributing the load dump energy
along the time and to transfer a part of it to the load.
3. Suppressed load dump (pulse 5b) is withstood with a minimum load connected as specified in Table 3.:
Absolute maximum ratings.
Table 13. Electrical transient requirements (part 3)
Class
Contents
C
All functions of the device are performed as designed after exposure to disturbance.
One or more functions of the device are not performed as designed after exposure
to disturbance and cannot be returned to proper operation without replacing the
device.
E
DocID027938 Rev 3
13/28
27
Electrical specifications
VND5004CSP30
Figure 6. Waveforms
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14/28
DocID027938 Rev 3
VND5004CSP30
Electrical specifications
2.4
Electrical characteristics curves
Figure 7. Off state output current
Figure 8. High level input current
Iloff (uA)
Iih (uA)
5
4.5
4
6
5.4
4.8
4.2
3.6
3
Off State
Vcc=13V
Vin=Vout=0V
Vin=2.1V
3.5
3
2.5
2
2.4
1.8
1.2
0.6
0
1.5
1
0.5
0
-50
-25
0
25
50
75
100
125
150
175
175
175
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
Tc (°C)
Figure 9. Input clamp voltage
Figure 10. Input low level
Vicl (V)
7
Vil (V)
2
1.8
1.6
1.4
1.2
1
6.75
6.5
Iin=1mA
6.25
6
0.8
0.6
0.4
0.2
5.75
5.5
5.25
5
0
-50
-25
0
25
50
75
100
125
150
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
Tc (°C)
Figure 11. Input high level
Figure 12. Input hysteresis voltage
Vih (V)
4
Vihyst (V)
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
3.5
3
2.5
2
1.5
1
0.5
0
-50
-25
0
25
50
75
100
125
150
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
Tc (°C)
DocID027938 Rev 3
15/28
27
Electrical specifications
VND5004CSP30
Figure 13. On state resistance vs. T
Figure 14. On state resistance vs. V
CC
case
Ron (mOhm)
6
Ron (mOhm)
6
5.4
4.8
4.2
3.6
3
5.4
4.8
4.2
3.6
3
Iout=15A
Vcc=13V
Tc=150°C
Tc=125°C
Tc=25°C
Tc=-40°C
2.4
1.8
2.4
1.8
-50
-25
0
25
50
75
100
125
150
175
0
4
8
12
16
Vcc
20
24
28
Tc (°C)
Figure 15. Undervoltage shutdown
Figure 16. Turn-On voltage slope
(dVout/dt)on (V/ms)
500
Vusd (V)
16
450
14
12
10
8
Vcc=13V
RI=0.87Ohm
400
350
300
250
200
150
100
50
6
4
2
0
0
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
Tc (°C)
Figure 17. I
vs. T
Figure 18. Turn-Off voltage slope
LIMH
case
Ilimh (A)
150
(dVout/dt)off (V/ms)
500
140
130
120
110
100
90
450
Vcc=13V
Vcc=13V
RI=0.87Ohm
400
350
300
250
200
150
100
50
80
70
60
50
0
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
Tc (°C)
16/28
DocID027938 Rev 3
VND5004CSP30
Electrical specifications
Figure 19. CS_DIS high level voltage
Figure 20. CS_DIS clamp voltage
Vcsdh (V)
4
Vcsdcl (V)
8
7.5
7
3.5
3
2.5
2
6.5
6
1.5
1
5.5
5
0.5
0
4.5
4
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
Tc (°C)
Figure 21. CS_DIS low level voltage
Vcsdl (V)
4
3.5
3
2.5
2
1.5
1
0.5
0
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
DocID027938 Rev 3
17/28
27
Application information
VND5004CSP30
3
Application information
Figure 22. Application schematic
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3.1
MCUꢀI/Os protection
When negative transients are present on the V line, the control pins will be pulled
CC
negative to approximately -1.5V.
ST suggests the insertion of resistors (R ) in the lines to prevent the μC I/Os pins from
prot
latching up.
The values of these resistors provide a compromise between the leakage current of the μC,
the current required by the HSD I/Os (input levels compatibility) and the latch-up limit of the
μC I/Os.
-V
/I
d R
d (V
-V ) / I
OHμC IH IHmax
CCpeak latchup
prot
Calculation example:
For V = -1.5 V and I
t 20 mA; V t 4.5 V
OHμC
CCpeak
latchup
prot
75 ȍ d R
d 240 kȍ.
prot
Recommended values: R
= 10 kȍꢁꢀC
= 10 nF
EXT
3.2
Load dump protection
D is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the
ld
V
max rating. The same applies if the device will be subject to transients on the V
CCPK
CC
line that are greater than the ones shown in Table 11.
18/28
DocID027938 Rev 3
VND5004CSP30
Application information
3.3
Maximum demagnetization energy (VCC = 13.5 V)
Figure 23. Maximum turn off current versus inductance
100
10
1
A
B
C
1
L (mH)
10
100
A: T
= 150°C single pulse
jstart
B: T
C: T
= 100°C repetitive pulse
= 125°C repetitive pulse
jstart
jstart
V , I
IN
L
Demagnetization
Demagnetization
Demagnetization
t
Note:
Values are generated with R = 0 ȍꢅ
L
In case of repetitive pulses, T
(at the beginning of each demagnetization) of every pulse
jstart
must not exceed the temperature specified above for curves A and B.
DocID027938 Rev 3
19/28
27
Package and PC board thermal data
VND5004CSP30
4
Package and PC board thermal data
4.1
MultiPowerSO-30 thermal data
Figure 24. MultiPowerSO-30 PC board
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Note:
Layout condition of R and Z measurements (PCB: Double layer, Thermal Vias, FR4
th th
area = 58 mm x 58 mm, PCB thickness = 2 mm, Cu thickness = 35 μm (front and back
2
side), Copper areas: from minimum pad layout to 16 cm ).
Figure 25.
R
vs. PCB copper area in open box free air condition (one channel ON)
thj-amb
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20/28
DocID027938 Rev 3
VND5004CSP30
Package and PC board thermal data
Figure 26. MultiPowerSO-30 thermal impedance junction ambient single pulse (one
channel ON)
=7+ꢆꢃ&ꢄ:ꢅ
ꢉꢀꢀꢀ
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ꢉꢀꢀ
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7LPHꢆꢃVꢅ
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Figure 27. Thermal fitting model of a double channel HSD in MultiPowerSO-30
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Note:
The fitting model is a simplified thermal tool and is valid for transient evolutions where the
embedded protections (power limitation or thermal cycling during thermal shutdown) are not
triggered.
DocID027938 Rev 3
21/28
27
Package and PC board thermal data
VND5004CSP30
Equation 1: pulse calculation formula
Z
= R
G + Z
ꢆ1 – Gꢂ
THG
TH
G = t e T
THtp
where
p
Table 14. Thermal parameters for MultiPowerSO-30
2
Area/island (cm )
Footprint
4
R1 (°C/W)
R2 (°C/W)
R3 (°C/W)
R4 (°C/W)
R5 (°C/W)
R6 (°C/W)
R7 (°C/W)
R8 (°C/W)
C1 (W.s/°C)
C2 (W.s/°C)
C3 (W.s/°C)
C4 (W.s/°C)
C5 (W.s/°C)
C6 (W.s/°C)
C7 (W.s/°C)
C8 (W.s/°C)
0.05
0.3
0.5
1.3
14
44.7
0.05
0.3
23.7
0.005
0.008
0.01
0.3
0.6
5
11
0.005
0.008
22/28
DocID027938 Rev 3
VND5004CSP30
Package information
5
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
5.1
MultiPowerSO-30 package information
Figure 28. MultiPowerSO-30 package outline
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Table 15. MultiPowerSO-30 mechanical data
Millimeters
Symbol
Min.
Typ.
Max.
A
A2
A3
B
2.35
2.25
0.1
1.85
0
0.42
0.23
17.1
18.85
15.9
0.58
0.32
17.3
19.15
16.1
C
D
17.2
16
E
E1
DocID027938 Rev 3
23/28
27
Package information
VND5004CSP30
Table 15. MultiPowerSO-30 mechanical data (continued)
Millimeters
Typ.
Symbol
Min.
Max.
“e”
F6
F7
F8
L
1
14.3
5.45
0.73
0.8
1.15
10 Deg
7 Deg
N
S
0 Deg
5.2
MultiPowerSO-30 packing information
The devices are packed in tape and reel shipments (see Table 16: Device summary on
page 26).
24/28
DocID027938 Rev 3
VND5004CSP30
Package information
Figure 29. MultiPowerSO-30 tape and reel shipment (suffix “TR”)
Reel dimension
Dimension
mm
1000
Base Q.ty
Bulk Q.ty
A (max)
B (min)
1000
330
1.5
C (± 0.2)
D (min)
13
20.2
32
G (+ 2 / -0)
N (min)
100
38.4
T (max)
Tape dimensions
According to Electronic Industries Association (EIA)
Standard 481 rev. A, Feb 1986
Description
Dimension
mm
Tape width
W
32
4
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
P0 (± 0.1)
P
24
1.5
2
D (± 0.1/-0)
D1 (min)
F (± 0.1)
K (max)
P1 (± 0.1)
14.2
2.2
2
Compartment Depth
Hole Spacing
End
Start
Top
cover
tape
No components
500 mm min
Components
No components
500 mm min
Empty components pockets
User direction of feed
DocID027938 Rev 3
25/28
27
Order codes
VND5004CSP30
6
Order codes
Table 16. Device summary
Order codes
Tape and reel
Package
MultiPowerSO-30
VND5004CSP30TR-E
26/28
DocID027938 Rev 3
VND5004CSP30
Revision history
7
Revision history
Table 17. Document revision history
Changes
Date
Revision
09-Jun-2015
02-Nov-2015
1
2
Initial release.
Updated Table 16: Device summary
– Removed all information relative to tube packing of the product
– Modified Section 5: Package information.
11-Jan-2017
3
– Added AEC-Q100 qualified in the Features section
– Minor text edits throughout the document
DocID027938 Rev 3
27/28
27
VND5004CSP30
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2017 STMicroelectronics – All rights reserved
28/28
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STMICROELECTR
VND5025B1KTR-E
2 CHANNEL, BUF OR INV BASED PRPHL DRVR, PDSO24, ROHS COMPLIANT, SSOP-24
STMICROELECTR
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