VNH7100AS [STMICROELECTRONICS]
Automotive fully integrated H-bridge motor driver;型号: | VNH7100AS |
厂家: | ST |
描述: | Automotive fully integrated H-bridge motor driver |
文件: | 总38页 (文件大小:1772K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
VNH7100AS
Automotive fully integrated H-bridge motor driver
Datasheet
-
production data
Description
The device is a full bridge motor driver intended
for a wide range of automotive applications. The
device incorporates a dual monolithic high-side
driver and two low-side switches.
SO-16N
GAPGCFT00648
Both switches are designed using
Features
STMicroelectronics’ well known and proven
proprietary VIPower® M0 technology that allows
to efficiently integrate on the same die a true
Power MOSFET with an intelligent
Type
RDS(on)
Iout VCCmax
signal/protection circuitry. The three dies are
assembled in SO-16N package on electrically
isolated leadframes.
100 mΩ typ
(per leg)
VNH7100AS
12 A
41 V
Moreover, its fully symmetrical mechanical design
allows superior manufacturability at board level.
The input signals INA and INB can directly
interface the microcontroller to select the motor
direction and the brake condition. A SEL0 pin is
available to address the information available on
the MultiSense to the microcontroller. The
MultiSense pin allows to monitor the motor
current by delivering a current proportional to the
motor current value.
• Automotive qualified
• Output current: 15 A
• 3 V CMOS-compatible inputs
• Undervoltage shutdown
• Overvoltage clamp
• Thermal shutdown
• Cross-conduction protection
• Current and power limitation
The PWM, up to 20 kHz, allows to control the
speed of the motor in all possible conditions. In all
cases, a low level state on the PWM pin turns off
both the LSA and LSB switches.
• Very low standby power consumption
• Protection against loss of ground and loss of
VCC
• PWM operation up to 20 kHz
Table 1. Device summary
• MultiSense diagnostic functions
– Analog motor current feedback
– Output short to ground detection
– Thermal shutdown indication
– OFF-state open-load detection
– Output short to VCC detection
Order codes
Package
Tube
Tape and reel
SO-16N
—
VNH7100ASTR
• Output protected against short to ground and
short to VCC
• Standby Mode
• Half Bridge Operation
• Package: ECOPACK®
October 2015
DocID028092 Rev 4
1/38
This is information on a product in full production.
www.st.com
Contents
VNH7100AS
Contents
1
2
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1
2.2
2.3
2.4
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3
4
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.1
3.2
3.3
3.4
Reverse battery protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
OFF-state open-load detection – External circuitry dimensioning . . . . . . 23
Immunity against transient electrical disturbances . . . . . . . . . . . . . . . . . . 24
Device configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.1
4.2
SO16-N thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Package thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.2.1
4.2.2
Thermal characterization in steady state conditions . . . . . . . . . . . . . . . 28
Thermal characterization during transients . . . . . . . . . . . . . . . . . . . . . . 29
5
6
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.1
5.2
5.3
SO-16N mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
SO-16N packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
SO-16N marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
2/38
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VNH7100AS
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Block description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin definitions and functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Logic inputs (INA, INB, PWM) (VCC = 7 V up to 28 V; -40°C < Tj < 150°C) . . . . . . . . . . . . 10
Switching (VCC = 13 V; RLOAD = 5.2 Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Protections and diagnostics (VCC = 7 V up to 18 V; -40°C < Tj < 150°C). . . . . . . . . . . . . . 11
CS (7 V < VCC < 18 V; -40 °C < Tj < 150 °C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Operative condition - truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
On-state fault conditions - truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Off-state - truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
ISO 7637-2 - electrical transient conduction along supply line . . . . . . . . . . . . . . . . . . . . . . 24
Thermal model for junction temperature calculation in steady-state conditions\ . . . . . . . . 29
Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
SO-16N mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Reel dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
SO-16N carrier tape dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
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3
List of figures
VNH7100AS
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
T
DSTKON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Definition of the low-side switching times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Definition of the high-side switching times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Low-side turn-on delay time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Time to shutdown for the low-side driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Input reset time for HSD - fault unlatch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 10. Input reset time for LSD - fault unlatch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 11. OFF-state diagnostic delay time from rising edge of VOUT (tD_VOL). . . . . . . . . . . . . . . . . . 17
Figure 12. Normal operative conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 13. OUT shorted to ground and short clearing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 14. OUT shorted to Vcc and short clearing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 15. Application schematic with reverse battery protection connected to Vbatt. . . . . . . . . . . . . 22
Figure 16. Application schematic with reverse battery protection connected to GND . . . . . . . . . . . . . 22
Figure 17. Suggested PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 18. Half-bridge configuration (case a). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 19. Half-bridge configuration (case b). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 20. Multi-motors configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 21. PCB layout (top and bottom): footprint, 2+2+2 cm2, 8+8+8 cm2 . . . . . . . . . . . . . . . . . . . . 27
Figure 22. PCB 4 layer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 23. Chipset configuration configuration in steady state conditions . . . . . . . . . . . . . . . . . . . . . . 28
Figure 24. Auto and mutual Rthj-amb vs. PCB heat-sink area in open box free air condition . . . . . . . . 29
Figure 25. HSD thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 26. LSD thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 27. Electrical equivalent model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 28. SO-16N package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 29. SO-16N reel 13” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 30. SO-16N carrier tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 31. SO-16N schematic drawing of leader and trailer tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 32. SO-16N marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
4/38
DocID028092 Rev 4
VNH7100AS
Block diagram and pin description
1
Block diagram and pin description
Figure 1. Block diagram
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Table 2. Block description
Description
Name
Allows the turn-on and the turn-off of the high-side and the
low-side switches according to the truth table.
Logic control
Undervoltage
Shuts down the device for battery voltage lower than 4 V.
Protect the high-side and the low-side switches from the
high voltage on the battery line.
High-side and low-side clamp voltage
Drive the gate of the concerned switch to allow a proper
Ron for the leg of the bridge.
High-side and low-side driver
Current limitation
Limits the motor current in case of short circuit.
In case of short-circuit with the increase of the junction
temperature, it shuts down the concerned driver to prevent
degradation and to protect the die.
High-side and low-side overtemperature
protection
Detects when low side current exceeds shutdown current
and latches off the concerned Low side.
Low-side overload detector
DocID028092 Rev 4
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37
Block diagram and pin description
VNH7100AS
Table 2. Block description (continued)
Description
Name
Signalizes the abnormal behavior of the switch through
MultiSense pin.
Fault detection
Limits the power dissipation of the high-side driver inside
safe range in case of short to ground condition.
Power limitation
Figure 2. Configuration diagram (top view)
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Table 3. Pin definitions and functions
Function
Pin N°
Symbol
1, 16
2, 15
3
GNDA
OUTA
INA
Source of low-side switch A
Source of high-side switch A / drain of low-side switch A
Clockwise input
4, 5, 12
6
VCC
Power supply voltage
INB
Counter clockwise input
7, 10
8, 9
OUTB
GNDB
Source of high-side switch B / drain of low-side switch B
Source of low-side switch B
Voltage controlled input pin with hysteresis, CMOS compatible. Gates
of low-side FETS get modulated by the PWM signal during their on
phase allowing speed control of the motor. Active high.
11
13
14
PWM
CS
Multiplexed analog sense output pin; it delivers a current proportional
to the motor current.
Active high compatible with 3 V and 5 V CMOS outputs pin; in
combination with INA, INB, it addresses the CurrentSense information
delivered to the micro according to the operative truth table.
SEL0
6/38
DocID028092 Rev 4
VNH7100AS
Electrical specifications
2
Electrical specifications
Figure 3. Current and voltage conventions
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2.1
Absolute maximum ratings
Stressing the device above the rating listed in Table 4: Absolute maximum ratings may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
Table 4. Absolute maximum ratings
Symbol
Parameter
Value
Unit
VCC
-VCC
Imax
IR
Supply voltage
38
V
V
A
A
Reverse DC Supply Voltage
0.3
Internally limited
-15
Maximum output current (continuous)
Reverse output current (continuous)
Maximum transient supply voltage (ISO 16750-2:2010
Test B clamped to 40 V; RL = 4 Ω)
VCCPK
VCCJS
40
28
V
V
Maximum jump start voltage for single pulse short circuit
protection
IIN
Input current (INA and INB pins)
-1 to 10
-1 to 10
-1 to 10
10
mA
mA
mA
ISEL0
IPWM
SEL0 DC input current
PWM input current
CS pin DC output current (VGND = VCC and VSENSE < 0 V)
CS pin DC output current in reverse (VCC < 0 V)
ISENSE
mA
-20
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37
Electrical specifications
Symbol
VNH7100AS
Unit
Table 4. Absolute maximum ratings (continued)
Parameter
Value
Electrostatic discharge
(Human body model: R = 1.5 kΩ; C = 100 pF)
– INA,INB, PWM
2
2
2
4
4
VESD
– SEL0
kV
– CS
– VCC
– Output
VESD
Tc
Charge device model (CDM-AEC-Q100-011)
Junction operating temperature
Storage temperature
750
V
-40 to 150
-55 to 150
°C
°C
TSTG
2.2
Thermal data
Table 5. Thermal data
Parameter
Symbol
Max. value
Unit
HSD
LSD
32
45
°C/W
°C/W
Rthj-pin Thermal resistance junction-pin
Rthj-amb Thermal resistance junction-ambient (JEDEC JESD 51-2)(1)
Rthj-amb Thermal resistance junction-ambient (JEDEC JESD 51-2)(2)
See Figure 24 °C/W
HSD
LSD
40.7
55.4
°C/W
°C/W
1. Device mounted on two-layers 2s0p PCB.
2. Device mounted on four-layers 2s2p PCB.
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VNH7100AS
Electrical specifications
2.3
Electrical characteristics
Values specified in this section are for VCC = 7 V up to 28 V; -40°C < Tj < 150°C, unless
otherwise specified.
Table 6. Power section
Symbol
Parameter
Test conditions
Min. Typ. Max. Unit
Operating supply
voltage
VCC
4
28
1
V
Off-state (standby)
µA
INA = INB = 0; SEL0 = 0;
PWM = 0; Tj = 25 °C; VCC = 13 V;
Off-state (standby)
INA = INB = 0; SEL0 = 0;
PWM = 0; VCC = 13 V; Tj = 85°C
1
3
µA
µA
Off-state (standby)
INA = INB = 0; SEL0 = 0;
PWM = 0; VCC = 13 V; Tj = 125 °C
IS
Supply current
Off-state (no standby)
2
4
6
mA
mA
INA = INB = 0; SEL0 = 5 V;
PWM= 0
On-state: INA or INB = 5 V;
PWM = 0 or PWM = 5; SEL0 = X
3.5
V
CC = 13 V;
Standby mode blanking
time
(1)
tD_STBY
INA = INB = PMW = 0 V;
VSEL0 from 5 V to 0 V
0.2
1
1.8
ms
I
OUT = 2.5 A; Tj = 25°C
60
mΩ
Static high-side
resistance
RONHS
IOUT = 2.5 A; Tj = -40 to 150°C
IOUT = 2.5 A; Tj = 25°C
120 mΩ
mΩ
40
Static low-side
resistance
RONLS
I
OUT = 2.5 A; Tj = -40°C to 150°C
80
mΩ
Free-wheeling diode
forward voltage
Vf
IOUT = -2.5 A; Tj = 150°C
0.7
0.9
V
INA = INB = 0; PWM = 0;
0
0
0.5
3
µA
µA
V
CC = 13 V; Tj = 25 °C
Off-state output current
of one leg
IL(off)
INA = INB = 0; PWM = 0;
VCC = 13 V; Tj = 125 °C
Off-state output current
IL(off_h) of one leg with other
HSD on
INA = 0; INB = 5 V; PWM = 0;
VCC = 13 V
20
60
µA
1. To power on the device from the standby, it is recommended to:
— toggle INA or INB from 0 to 1 first to come out from STBY mode
— toggle PWM from 0 to 1 with a delay of 20 µs
this avoids any over-stress on the device in case of existing short-to-battery.
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37
Electrical specifications
VNH7100AS
Table 7. Logic inputs (INA, INB, PWM) (VCC = 7 V up to 28 V; -40°C < Tj < 150°C)
Symbol
Parameter
Test conditions
Min. Typ. Max. Unit
VIL
VIH
Input low level voltage
Input high level voltage
Input hysteresis voltage
0.9
V
V
2.1
0.2
5.3
VIHYST
V
IIN = 1 mA
7.2
V
VICL
Input clamp voltage
IIN = -1 mA
VIN = 0.9 V
VIN = 2.1 V
-0.7
V
IINL
IINH
Input current
Input current
1
µA
µA
10
SEL0 (VCC = 7 V up to 18 V; -40°C < Tj < 150°C)
VSELL
ISELL
VSELH
ISELH
Input low level voltage
Low level input current
Input high level voltage
High level input current
0.9
V
µA
V
VSEL = 0.9 V
VSEL = 2.1 V
1
2.1
10
µA
V
VSEL(hyst) Input hysteresis voltage
0.2
5.3
I
SEL = 1 mA
ISEL = -1 mA
PWM (VCC= 7 V up to 28 V; -40°C < Tj < 150°C)
7.5
V
VSELCL
Input clamp voltage
-0.8
V
VPWM
IPWM
VPWM
IPWMH
Input low level voltage
Low level input current
Input high level voltage
High level input current
0.9
V
µA
V
VPWM = 0.9 V
VPWM = 2.1 V
1
2.1
10
µA
V
VPWM(hyst) Input hysteresis voltage
0.2
5.3
I
PWM = 1 mA
PWM = -1 mA
7.2
V
VPMWCL Input clamp voltage
I
-0.7
V
Table 8. Switching (VCC = 13 V; RLOAD = 5.2 Ω)
Symbol
Parameter
Test conditions
Min. Typ. Max. Unit
f(1)
td(on)
td(off)
tr
PWM frequency
Turn-on delay time
Turn-off delay time
Rise time
0
20
kHz
µs
Input rise time < 1µs (see Figure 6)
Input rise time < 1µs (see Figure 6)
See Figure 5
20
13
1
µs
2
2
µs
tf
Fall time
See Figure 5
1
µs
Low-side turn-on delay
time
tcross
Input rise time < 1 µs (see Figure 7) 40 150 350
µs
1. Parameter guaranteed by design and characterization; not subjected to production test.
10/38
DocID028092 Rev 4
VNH7100AS
Electrical specifications
Table 9. Protections and diagnostics (VCC = 7 V up to 18 V; -40°C < Tj < 150°C)
Symbol
Parameter
Test conditions
Min. Typ. Max. Unit
VUSD
Undervoltage shutdown
4
5
V
V
Undervoltage shutdown
reset
VUSDreset
VUSDHyst
Undervolatge shutdown
Hysteresis
0.4
V
High-side current
limitation
ILIM_H
ISD_LS
tSD_LS
12
14
18
22
5
24
30
A
A
Shutdown LS current
Time to shutdown for the VINA = VINB = 0 V;
low-side
µs
PWM = 5 V (see Figure 8)
High-side clamp voltage
(VCC to OUTA = 0 or
OUTB = 0)
IOUT = 100 mA;
tCLAMP = 1 ms
VCL_HSD
38
38
46
46
V
V
Low-side clamp voltage
(OUTA = VCC or
OUTB = VCC to GND)
IOUT = 100 mA;
tCLAMP = 1 ms
VCL_LSD
High-side thermal
shutdown temperature
TTSD_HS
TTR_HS
INx = 2.1 V
150 175 200 °C
High-side thermal reset
temperature
135
°C
°C
High-side thermal
THYST_HS
hysteresis (TSD_HS
TR_HS
-
7
)
Low-side thermal
shutdown temperature
TTSD_LS
VCL
INx = 0 V
OUT = 100 mA;
150 175 200 °C
Total clamp voltage
(VCC to GND)
I
38
2
46
3
52
4
V
V
tCLAMP = 1 ms
INA = INB = 0; PWM = 0;
OFF-state open-load
voltage detection
threshold
V
SEL0 = 5 V for CHA;
VOL
VSEL0 = 0 V and within
tD_STBY for CHB
INA = INB = 0; VOUTx = VOL
;
OFF-state output sink
current
PWM = 0 V; VSEL0 = 5 V for
CHA; VSEL0 = 0 V and within
IL(off2)
-100
40
-15
µA
tD_STBY for CHB
OFF-state diagnostic
delay time from falling
edge of INPUT (see
Figure 4)
INA = 5 V to 0 V; INB = 0 V;
VSEL0 = 5 V; IOUT = 0 A;
tDSTKON
150 350 µs
VOUTA = 4 V; PWM = 0 V
INA = INB = 0 V; PWM = 0 V;
OUTx = 0 V to 4 V;
VSEL0 = 5 V for CHA;
VSEL0 = 0 V and within
OFF-state diagnostic
delay time from rising
edge of VOUT (see
Figure 11)
V
(1)
tD_VOL
5
30
µs
tD_STBY for CHB
DocID028092 Rev 4
11/38
37
Electrical specifications
VNH7100AS
Table 9. Protections and diagnostics (VCC = 7 V up to 18 V; -40°C < Tj < 150°C)
Symbol
Parameter
Test conditions
Min. Typ. Max. Unit
Input reset time for high-
side fault unlatch (see
Figure 9)
V
INx = 5 V to 0 V; HSDx
(1)
tLatch_RST_HD
3
3
10
10
20
20
µs
µs
faulting
Input reset time for low-
side fault unlatch (see
Figure 10)
V
INx = 0 V to 5 V; LSDx
(1)
tLatch_RST_LS
faulting
1. Parameter guaranteed by design and characterization; not subjected to production test.
Table 10. CS (7 V < VCC < 18 V; -40 °C < Tj < 150 °C)
Symbol
Parameter
Test conditions
Min. Typ. Max. Unit
VCC = 18 V; ISENSE = -5 mA
11
V
V
MultiSense clamp
voltage
VSENSE_CL
VCC = 18 V; ISENSE = 5 mA
-13
-9
IOUT = 0.05 A; VSENSE = 0.5 V;
Tj = -40°C to 150°C
K0
K1
K2
K3
IOUT SENSE
IOUT/ISENSE
IOUT/ISENSE
IOUT/ISENSE
/I
420
IOUT = 0.2 A; VSENSE = 0.5 V;
Tj = -40°C to 150°C
710 1190 1670
980 1120 1247
990 1120 1235
IOUT = 2.5 A; VSENSE = 4 V;
Tj = -40°C to 150°C
IOUT = 4 A; VSENSE = 4 V;
Tj = -40°C to 150°C
Analog sense current IOUT = 0.05 A; VSENSE = 0.5 V;
drift Tj = -40°C to 150°C
(1)(2)
dK0/K0
-25
-21
-5
25
21
5
%
%
%
%
Analog sense current IOUT = 0.2 A; VSENSE = 0.5 V;
drift Tj = -40°C to 150°C
(1)(2)
dK1/K1
Analog sense current IOUT = 2.5 A; VSENSE = 4 V;
drift Tj = -40°C to 150°C
(1)(2)
dK2/K2
Analog sense current IOUT = 4 A; VSENSE = 4 V;
(1)(2)
dK3/K3
-4
4
drift
Tj = -40°C to 150°C
V
CC = 7 V; RSENSE = 10 kΩ;
Max analog sense
output voltage
VSENSE_SAT
VSEL0 = 5 V; IOUTA = 4 A;
INA = 5 V; PWM = 0; Tj = 150 °C
5
0
V
V
IOUT = 0 A; VSENSE = 0 V;
INx = 0 V; SEL0 = 0;
Tj = -40°C to 150°C (standby)
0.5 µA
0.5 µA
MultiSense leakage IOUT = 0 A; VSENSE = 0 V;
ISENSE0
current
INx = 0 V; SEL0 = 5 V;
Tj = -40°C to 150°C (no standby)
0
0
INx = 5 V; PWM = 5 V:
Tj = -40°C to 150°C; IOUT = 0 A
5
µA
12/38
DocID028092 Rev 4
VNH7100AS
Electrical specifications
Table 10. CS (7 V < VCC < 18 V; -40 °C < Tj < 150 °C) (continued)
Symbol
Parameter
Test conditions
Min. Typ. Max. Unit
VCC = 13 V; RSENSE = 1 kΩ
MultiSense output
voltage in fault
condition
– E.g: OUTA in open-load
INA = 0 V; IOUTA = 0 A;
VOUTA = 4 V; VSEL0 = 5 V
VSENSEH
5
7
V
VINA = 5 V; VINB = 0 V;
VSEL0 = 5 V; RSENSE = 2.7 kΩ
IOUT = 2.5 A
Output Voltage for
MultiSense shutdown
(2)
VOUT_MSD
5
V
mA
A
VCC = 13 V; VSENSE = 4 V;
VINA = 5 V; VINB = 0 V;
VSEL0 = 5 V; Tj = 150 °C
MultiSense
saturation current
(2)
ISENSE_SAT
5.8
7
VCC = 13 V; VSENSE = 4 V;
VINA = 5 V; VINB = 0 V;
VSEL0 = 5 V; IOUT = 7 A; Tj = 150°C
Output saturation
current
(2)
IOUT_SAT
MultiSense output
voltage in fault
condition
ISENSEH
VCC = 13 V; VSENSE = VSENSEH
7
20
30 mA
1. Analog sense current drift is deviation of factor K for a given device over (-40 °C to 150 °C and
9 V < V < 18 V) with respect to its value measured at T = 25 °C, V = 13 V.
CC
j
CC
2. Parameter guaranteed by design and characterization; not subjected to production test.
Figure 4. TDSTKON
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DocID028092 Rev 4
13/38
37
Electrical specifications
VNH7100AS
Figure 5. Definition of the low-side switching times
PWM
t
VOUTA, B
90%
80%
t
f
t
t
10%
20%
r
Figure 6. Definition of the high-side switching times
VINA
tD(on)
tD(off)
t
VOUTA
90%
10%
t
14/38
DocID028092 Rev 4
VNH7100AS
Electrical specifications
Figure 7. Low-side turn-on delay time
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DocID028092 Rev 4
15/38
37
Electrical specifications
VNH7100AS
Figure 9. Input reset time for HSD - fault unlatch
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DocID028092 Rev 4
VNH7100AS
Electrical specifications
Figure 11. OFF-state diagnostic delay time from rising edge of VOUT (tD_VOL
)
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DocID028092 Rev 4
17/38
37
Electrical specifications
VNH7100AS
Table 11. Operative condition - truth table
Pin status HSDs and LDSs Status
INA
INB
SEL0
PWM
CS
HSDA
LSDA
HSDB
LSDB
Current
Monitoring
HSDA
1
1
1
x
On
Off
On
Off
Current
Monitoring
0
1
HSDB
1
0
Current
Monitoring
HSDA
On
On
Off
Off
Off
Off
On
Off
1
0
1
0
1
0
1
On
On
Off
Off
Off
Off
Off
On
Off
On
Off
Off
On
On
On
On
Off
Off
Off
Off
1
0
0
1
0
1
Hi-Z
Hi-Z
Current
Monitoring
0
1
0
0
1
Off
Off
Off
On
On
Off
Off
On
HSDB
Hi-Z
1
0
0
0
0
0
1
Off
Off
Off
Off
Off
Off
Off
Off
0
x(1)
0(2)
1. Refer to Table 13: Off-state - truth table
2. For IN =IN =SEL = PWM = 0, the device enters in standby after t
D_STBY
A
B
0
Table 12. On-state fault conditions - truth table
INA
INB
SEL0
PWM
OutA
OutB
CS
Fault description
On state diagnostic
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1
1
X
H
X
H
H
L
H
X
L
VSENSEH
VSENSEH
VSENSEH
VSENSEH
VSENSEH
VSENSEH
VSENSEH
VSENSEH
Short to VBATT on Leg B
Short to VBATT on Leg A
Out B short to GND
Out A short to VCC
X
1
H
H
L
1
Out B short to VCC
X
X
X
Out A short to GND
Short to GND on Leg B
Short to GND on Leg A
X
L
L
X
18/38
DocID028092 Rev 4
VNH7100AS
Electrical specifications
Description
Table 13. Off-state - truth table
INA
INB
SEL0
PWM
OutA
OutB
CS
Off-state diagnostic
Case 1. OutA shorted to VCC if no
pull-up is applied
Case 2. No open-load in full bridge
configuration with an external pull-
up on OutB
VoutA>VOL
x
VSENSEH
Case 3. open-load in half bridge
configuration with an external pull-
up on OutA(motor connected
between OutA and Ground)
1
Case 1. Open-load in full Bridge
configuration with an external pull-
up on OutB
VoutA<VOL
x
Hi-Z
VSENSEH
Hi-Z
Case 2. No open-load in half Bridge
configuration with external pull-up
on OutA (motor connected between
OutA and Ground)
0
0
0
Case 1. OutB shorted to VCC if
no pull-up is applied
Case 2. No open-load in full
bridge configuration with
external pull-up on OutA
Case 3. Open-load in half bridge
configuration with external pull-up
on OutB (motor connected between
OutB and Ground)
X
VoutB>VOL
0(1)(2)
Case1. Open-load in full Bridge
configuration with an external pull-
up on OutA
X
VoutB<VOL
Case 2. No open-load in half Bridge
configuration with external pull-up
on OutB (motor connected between
OutB and Ground)
1. The device enters standby mode after t
D_STBY
2. To power on the device from the standby, it is recommended to toggle IN or IN from 0 to 1 first and then PWM from 0 to 1
A
B
to avoid any over-stress on the device in case of short-to-battery.
DocID028092 Rev 4
19/38
37
Electrical specifications
VNH7100AS
2.4
Waveforms
Figure 12. Normal operative conditions
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20/38
DocID028092 Rev 4
VNH7100AS
Electrical specifications
Figure 14. OUT shorted to Vcc and short clearing
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DocID028092 Rev 4
21/38
37
Application information
VNH7100AS
3
Application information
Here following there is the typical application schematic suggested for a proper operation of
the device in DC or PWM conditions.
Figure 15. Application schematic with reverse battery protection connected to Vbatt
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Figure 16. Application schematic with reverse battery protection connected to GND
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22/38
DocID028092 Rev 4
VNH7100AS
Application information
Figure 17. Suggested PCB layout
Note:
PCB layout recommendation:
Optimized connection (short) between Drain LSD and Source HSD
Optimized GNDa and GNDb connection (symmetric connection)
3.1
Reverse battery protection
Three possible solutions can be considered:
•
A Schottky diode D connected to VCC pin
•
•
An N-channel MOSFET connected to the GND pin
A P-channel MOSFET connected to the VCC pin
In case the reverse battery protection is not present, the device sustains no more than -15 A
because of the two Body diodes of the Power MOSFETs. Additionally, in reverse battery
condition the I/Os of the device is pulled down to the VCC line (approximately -1.5 V).
Series resistor must be inserted to limit the current sunk from the microcontroller I/Os. If
IRmax is the maximum target reverse current through microcontroller I/Os, series resistor is:
V
– V
CC
IOs
R = ------------------------------
I
Rmax
3.2
OFF-state open-load detection – External circuitry
dimensioning
The detection of an open-load in off state requires an external circuitry to be connected
between Output and VBATT
.
For the detection it is necessary to put one network on each leg in case of Half Bridge
operation or one network on one of the output in case of full bridge (see Table 13: Off-state -
truth table).
The external circuitry is made up by an external pull-up resistor Rpull_up connecting the
output to a positive supply voltage VPU (VBatt).
DocID028092 Rev 4
23/38
37
Application information
VNH7100AS
It is preferable to switch-off VPU by using an external pull_up switch to reduce the overall
standby current during he module standby mode.
R
pull_up must be dimensioned to ensure that in normal operative conditions VOUT > VOLmax
.
To satisfy this condition the Rpull_up must be selected according to:
•
•
if the device is used in half bridge configuration, the equation is:
V
– V
OLmax
BATTmin
R
< -------------------------------------------------------
pull_up
I
L(off2)min[@VOLmax]
if the device is used in H-bridge configuration, the equation is:
V
– V
OLmax
BATTmin
R
< -------------------------------------------------------------
pull_up
2 × I
L(off2)min[@VOLmax]
3.3
Immunity against transient electrical disturbances
The immunity of the device against transient electrical emissions, conducted along the
supply lines and injected into the VCC pin, is tested in accordance with ISO7637-2:2011 (E)
and ISO 16750-2:2010.
The related function performance status classification is shown in Table 14.
Test pulses are applied directly to DUT (Device Under Test) both in ON and OFF-state and
in accordance to ISO 7637-2:2011(E), chapter 4. The DUT is intended as the present device
only, without components and accessed through VCC and GND terminals.
Status II is defined in ISO 7637-1 Function Performance Status Classification (FPSC) as
follows: “The function does not perform as designed during the test but returns automatically
to normal operation after the test”.
Table 14. ISO 7637-2 - electrical transient conduction along supply line
Test pulse severity
Test
Pulse
Minimum
number of
pulses or test
time
level with Status II
functionalperformance
status
Burst cycle / pulse
repetition time
Pulse duration and
pulse generator
internal impedance
2011(E)
(1)
Level
US
min
max
1
III
III
IV
IV
IV
-112 V
+55 V
-220 V
+150 V
-7 V
500 pulses
500 pulses
1h
0,5 s
0,2 s
2ms, 10 Ω
50µs, 2 Ω
2a
3a
3b
4(2)
5 s
90 ms
90 ms
100 ms
100 ms
0.1µs, 50 Ω
0.1µs, 50 Ω
100ms, 0.0 1Ω
1h
1 pulse
Load dump according to ISO 16750-2:2010
Test B(3)
40 V
5 pulse
1 min
400 ms, 2 Ω
1.
U
is the peak amplitude as defined for each test pulse in ISO 7637-2:2011(E), chapter 5.6.
S
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VNH7100AS
Application information
2. Test pulse from ISO 7637-2:2004(E).
3. With 40 V external suppressor referred to ground (-40°C < T < 150°C).
j
3.4
Device configurations
Figure 18. Half-bridge configuration (case a)
9FF
,1%
,1$
3:0
6(/ꢃ
&6
2XWꢀ$
2XWꢀ%
0
0
*1'
*1'
*1'
("1(ꢆꢃꢀꢃꢁꢉꢁꢆꢀꢂ$'5
Note:
The VNH7100AS can be used in half bridge configuration as the two legs can be
independently driven. The SEL0 pin can be used to address the diagnostic on the CS
according to the operative truth table.
Figure 19. Half-bridge configuration (case b)
9FF
,1$
,1%
,1$
,1%
6(/ꢃ
&6
3:0
2XWꢀ%
3:0
2XWꢀ%
6(/ꢃ
&6
0
2XWꢀ$
2XWꢀ$
*1'
*1'
("1(ꢊꢀꢀꢃꢁꢉꢁꢌꢀꢇ$'5
Note:
The VNH7100AS can be used in applications where an half-bridge with a resistance of
50 mΩ per leg is needed.
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37
Application information
VNH7100AS
Figure 20. Multi-motors configuration
9FF
,1$
3:0
6(/ꢃ
&6
,1%
,1$
3:0
6(/ꢃ
&6
,1%
0
2XWꢀ$
2XWꢀ%
2XWꢀ%
2XWꢀ$
*1'
*1'
0
0
("1(ꢊꢀꢀꢃꢁꢉꢁꢌꢁꢀ$'5
Note:
The VNH7100AS can easily be designed in multi motor driving configuration in the
applications where only one motor at a time must be activated. The SEL0 pin can be used to
read the diagnostic on the CS according to the operative truth table.
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VNH7100AS
Package and PCB thermal data
4
Package and PCB thermal data
4.1
SO16-N thermal data
Figure 21. PCB layout (top and bottom): footprint, 2+2+2 cm2, 8+8+8 cm2
DocID028092 Rev 4
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37
Package and PCB thermal data
VNH7100AS
Figure 22. PCB 4 layer
Note:
Board finish thickness 1.6 mm +/- 10%; Board double layer and four layers; Board
dimension 77x86 mm; Board Material FR4; Cu thickness 0.070mm (outer layers); Cu
thickness 0.035mm (inner layers); Thermal vias separation 1.2 mm; Thermal via diameter
0.3 mm +/- 0.08 mm; Cu thickness on vias 0.025 mm.
4.2
Package thermal data
4.2.1
Thermal characterization in steady state conditions
Figure 23. Chipset configuration configuration in steady state conditions
$IJQꢀꢁ
3UI#
3UI"#
$IJQꢀꢂ
3UI"
3UI"$
3UI#$
$IJQꢀꢃ
3UI$
("1(ꢆꢃꢀꢃꢁꢉꢀꢃꢁꢂ$'5
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VNH7100AS
Package and PCB thermal data
Figure 24. Auto and mutual Rthj-amb vs. PCB heat-sink area in open box free air
condition
ꢅꢁꢀ
5WK$
5WK%ꢆ ꢆ5WK&
ꢅꢀꢀ
5WK$%ꢆ ꢆ5WK$&
5WK%&
ꢄꢀ
ꢃꢀ
ꢂꢀ
ꢁꢀ
ꢀ
ꢀ
ꢁ
ꢂ
ꢃ
ꢄ
ꢅꢀ
FPꢁ RIꢃ&Xꢃ$UHDꢃꢅUHIHUꢃWRꢃ3&%ꢃꢁ/D\HUꢃOD\RXWꢆ
("1(ꢆꢃꢀꢃꢁꢉꢀꢃꢆꢌ$'5
Table 15. Thermal model for junction temperature calculation in steady-state
conditions\
Chip 1 Chip 2 Chip 3
Tjchip1
Tjchip2
Tjchip3
Pdchip1 • RthA + Pdchip3 Pdchip1 • RthAB + Pdchip3 Pdchip1 • RthAC + Pdchip3
ON
OFF
ON
• RthAC + Tamb • RthBC + Tamb • RthC + Tamb
Pdchip1 • RthA + Pdchip2 Pdchip1 • RthAB + Pdchip2 Pdchip1 • RthAC + Pdchip2
ON
ON
ON
OFF
OFF
• RthAB + Tamb
• RthB + Tamb
• RthBC + Tamb
OFF
Pdchip1 • RthA+ Tamb
Pdchip1 • RthAB + Tamb
Pdchip1 • RthAC + Tamb
P
dchip1 • RthA + (Pdchip2 Pdchip2 • RthB + Pdchip1 • Pdchip1 • RthAB + Pdchip2
ON
ON
ON
+ Pdchip3) • RthAB
Tamb
+
RthAB + Pdchip3 • RthBC • RthBC + Pdchip3 • RthC
+ Tamb + Tamb
4.2.2
Thermal characterization during transients
Ths= Pdhs • Zhs + Zhsls • (PdlsA + PdlsB) + Tamb
TlsA= PdlsA • Zls + Pdhs • Zhsls + PdlsB • Zlsls + Tamb
TlsB= PdlsB • Zls + Pdhs • Zhsls + PdlsA • Zlsls + Tamb
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Package and PCB thermal data
VNH7100AS
Figure 25. HSD thermal impedance junction ambient single pulse
=7+ꢆꢋꢆ+6'ꢆ#ꢆFXꢆDUHD
&ꢈ:
ꢅꢀꢀ
+6'ꢋIRRWSULQW
+6'ꢋꢁꢆFPAꢁꢆ&X
+6'ꢋꢄꢆFPAꢁꢆ&X
+6'ꢋꢂ/D\HU
+V/V'ꢋIRRWSULQW
+V/V'ꢋꢁꢆFPAꢁꢆ&X
+V/V'ꢋꢄꢆFPAꢁꢆ&X
+V/V'ꢋꢂ/D\HU
=
KV
ꢅꢀ
ꢅ
ꢀꢇꢅ
=
KVOV
ꢀꢇꢀꢅ
ꢀꢇꢀꢀꢀꢅ
ꢀꢇꢀꢀꢅ
ꢀꢇꢀꢅ
ꢀꢇꢅ
ꢅ
ꢅꢀ
ꢅꢀꢀ
ꢅꢀꢀꢀ
WLPHꢆꢉVHFꢊ
("1(ꢆꢃꢀꢃꢁꢉꢁꢀꢀꢁ$'5
Figure 26. LSD thermal impedance junction ambient single pulse
=7+ꢆꢋ/6'ꢆ#ꢆFXꢆDUHD
&ꢈ:
ꢅꢀꢀ
/6'ꢋIRRWSULQW
/6'ꢋꢁꢆFPAꢁꢆ&X
/6'ꢋꢄꢆFPAꢁꢆ&X
/6'ꢋꢂ/D\HU
/V/V'ꢋIRRWSULQW
/V/V'ꢋꢁꢆFPAꢁꢆ&X
/V/V'ꢋꢄꢆFPAꢁꢆ&X
/V/V'ꢋꢂ/D\HU
=
OV
ꢅꢀ
ꢅ
ꢀꢇꢅ
=
OVOV
ꢀꢇꢀꢅ
ꢀꢇꢀꢀꢀꢅ
ꢀꢇꢀꢀꢅ
ꢀꢇꢀꢅ
ꢀꢇꢅ
ꢅ
ꢅꢀ
ꢅꢀꢀ
ꢅꢀꢀꢀ
WLPHꢆꢉVHFꢊ
("1(ꢆꢃꢀꢃꢁꢉꢁꢀꢀꢂ$'5
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VNH7100AS
Package and PCB thermal data
Figure 27. Electrical equivalent model
Table 16. Thermal parameters
2
Area/island (cm2)
FP
8
4L
R1 (°C/W)
R2 (°C/W)
R3 (°C/W)
R4 (°C/W)
R5 (°C/W)
R6 (°C/W)
R7 (°C/W)
R8 (°C/W)
R9 (°C/W)
R10 (°C/W)
R11 (°C/W)
R12 (°C/W)
R13 (°C/W)
R14 (°C/W)
R15 (°C/W)
R16 (°C/W)
R17 (°C/W)
R18 (°C/W)
R19 (°C/W)
R20 (°C/W)
5.3
12
5.3
12
5.3
12
5.3
12
30
25
25
30
42
12
12
2
85
45
30
17
5.3
5.1
12
5.3
5.1
12
5.3
5.1
12
5.3
5.1
12
30
30
30
42
68
52
48
10
75
80
60
26
5.1
12
5.1
12
5.1
12
5.1
12
30
30
30
42
68
52
48
10
75
80
60
26
120
120
180
180
100
100
170
170
100
100
170
170
100
100
170
170
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37
Package and PCB thermal data
Area/island (cm2)
VNH7100AS
4L
Table 16. Thermal parameters (continued)
FP
2
8
C1 (W·s/°C)
C2 (W·s/°C)
C3 (W·s/°C)
C4 (W·s/°C)
C5 (W·s/°C)
C6 (W·s/°C)
C7 (W·s/°C)
C8 (W·s/°C)
C9 (W·s/°C)
C10 (W·s/°C)
C11 (W·s/°C)
C12 (W·s/°C)
C13 (W·s/°C)
C14 (W·s/°C)
C15 (W·s/°C)
C16 (W·s/°C)
0.00065
0.018
0.08
0.2
0.00065
0.018
0.1
0.00065
0.018
0.1
0.00065
0.018
0.1
0.5
1
2
1.5
2
6
12
0.00065
0.001
0.02
0.06
0.08
1
0.00065
0.001
0.02
0.06
0.1
0.00065
0.001
0.02
0.06
0.2
0.00065
0.001
0.02
0.06
0.5
2.5
3
6
0.00065
0.02
0.06
0.08
1
0.00065
0.02
0.06
0.1
0.00065
0.02
0.06
0.2
0.00065
0.02
0.06
0.5
2.5
3
6
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VNH7100AS
Package and packing information
5
Package and packing information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
5.1
SO-16N mechanical data
Figure 28. SO-16N package dimensions
("1($'5ꢀꢀꢂꢁꢂ
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37
Package and packing information
VNH7100AS
Table 17. SO-16N mechanical data
Millimeters
Symbol
Min.
Typ.
Max.
1.75
0.25
A
A1
A2
b
0.10
1.25
0.31
0.17
9.80
5.80
3.80
0.51
0.25
10.00
6.20
4.00
c
D
9.90
6.00
3.90
1.27
E
E1
e
h
0.25
0.40
0
0.50
1.27
8
L
k
ccc
0.10
5.2
SO-16N packing information
Figure 29. SO-16N reel 13”
"DDFTTꢅ)PMFꢅBU
4MPUꢅ-PDBUJPO
ꢍꢅꢅꢅꢅꢇꢀꢅNNꢅNJOꢎꢏ
8ꢆ
/
%
"
$
8ꢁ
*GꢅQSFTFOUꢐ
UBQFꢅTMPUꢅJOꢅDPSF
GPSꢅUBQFꢅTUBSUꢑ
ꢆꢎꢉꢅNNꢅNJOꢎꢅXJEUIꢅY
ꢁꢀꢎꢀꢅNNꢅNJOꢎꢅEFQUI
#
5"1(ꢆꢀꢀꢇꢁꢉꢁꢌꢉꢉ$'5
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VNH7100AS
Package and packing information
Table 18. Reel dimensions
Description
Value(1)
Base quantity
2500
Bulk quantity
A (max)
2500
330
1.5
B (min)
C (+0.5, -0.2)
D (min)
13
20.2
100
16.4
22.4
N
W1 (+2 /-0)
W2 (max)
1. All dimensions are in mm.
Figure 30. SO-16N carrier tape
("1(ꢀꢂꢀꢈꢁꢉꢁꢆꢆꢃ$'5
Table 19. SO-16N carrier tape dimensions
Description
Value
A
0
6.55 ± 0.1
10.38 ± 0.1
2.10 ± 0.1
1.80 ± 0.1
7.50 ± 0.1
B
0
K
0
1
K
F
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37
Package and packing information
VNH7100AS
Table 19. SO-16N carrier tape dimensions (continued)
Description
Value
P
1
8.00 ± 0.1
W
16.00 ± 0.3
Figure 31. SO-16N schematic drawing of leader and trailer tape
5.3
SO-16N marking information
Figure 32. SO-16N marking information
.BSLJOHꢅBSFB
ꢁ
ꢆ
ꢊ
ꢇ
ꢉ
ꢌ
ꢈ
ꢂ
ꢃ ꢁꢀ ꢁꢁ ꢁꢆ
4QFDJBMꢀGVODUJPOꢀEJHJU
ꢄ&4ꢑꢅ&OHJOFFSJOHꢅTBNQMF
ꢒCMBOLꢓꢑꢅ$PNNFSDJBMꢅTBNQMF
40ꢄꢁꢌ/ꢅ501ꢅ7*&8ꢅ
ꢍOPUꢅJOꢅTDBMFꢏ
("1(ꢀꢂꢀꢈꢁꢉꢁꢉꢉꢂ$'5
Note:
Engineering Samples: these samples can be clearly identified by a dedicated special
symbol in the marking of each unit. These samples are intended to be used for electrical
compatibility evaluation only; usage for any other purpose may be agreed only upon written
authorization by ST. ST is not liable for any customer usage in production and/or in reliability
qualification trials.
Commercial Samples: fully qualified parts from ST standard production with no usage
restrictions.
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VNH7100AS
Revision history
6
Revision history
Table 20. Document revision history
Changes
Date
Revision
16-Jul-2015
1
Initial release.
Table 8: Switching (VCC = 13 V; RLOAD = 5.2 Ω):
– tcross: updated values
Table 9: Protections and diagnostics (VCC = 7 V up to 18 V; -40°C < Tj
< 150°C):
01-Sep-2015
04-Sep-2015
2
3
– ISD_LS, tDSTKON: updated values
Table 10: CS (7 V < VCC < 18 V; -40 °C < Tj < 150 °C):
– K2, K3, ISENSE_SAT: updated values
Table 4: Absolute maximum ratings:
– IR: updated value
Table 4: Absolute maximum ratings:
– -IGND: removed row
Updated Table 5: Thermal data
Table 6: Power section:
– Vf: updated parameter
07-Oct-2015
4
Updated Figure 9: Input reset time for HSD - fault unlatch and
Figure 10: Input reset time for LSD - fault unlatch
Added Section 2.4: Waveforms and Chapter 4: Package and PCB
thermal data
Updated Chapter 3: Application information
DocID028092 Rev 4
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37
VNH7100AS
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2015 STMicroelectronics – All rights reserved
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