VNS3NV04DTR-E [STMICROELECTRONICS]

OMNIFET II fully autoprotected Power MOSFET; OMNIFET II完全autoprotected功率MOSFET
VNS3NV04DTR-E
型号: VNS3NV04DTR-E
厂家: ST    ST
描述:

OMNIFET II fully autoprotected Power MOSFET
OMNIFET II完全autoprotected功率MOSFET

外围驱动器 驱动程序和接口 接口集成电路 光电二极管
文件: 总21页 (文件大小:358K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
VNS3NV04D-E  
OMNIFET II  
fully autoprotected Power MOSFET  
Features  
Max On-State resistance (per ch.)  
Current limitation (typ)  
RON  
ILIMH  
120m  
3.5A  
Drain-Source clamp voltage  
VCLAMP  
40V  
SO-8  
Linear current limitation  
Thermal shut down  
Short circuit protection  
Integrated clamp  
Description  
The VNS3NV04D-E is a device formed by two  
monolithic OMNIFET II chips housed in a  
standard SO-8 package. The OMNIFET II are  
designed in STMicroelectronics VIPower M0-3  
Technology: they are intended for replacement of  
standard Power MOSFETs from DC up to 50KHz  
applications. Built in thermal shutdown, linear  
current limitation and overvoltage clamp protects  
the chip in harsh environments.  
Low current drawn from input pin  
Diagnostic feedback through input pin  
Esd protection  
Direct access to the gate of the power mosfet  
(analog driving)  
Compatible with standard power mosfet  
Fault feedback can be detected by monitoring the  
voltage at the input pin.  
Table 1.  
Device summary  
Package  
Order codes  
Tube  
Tape and Reel  
SO-8  
VNS3NV04D-E  
VNS3NV04DTR-E  
July 2007  
Rev 2  
1/21  
www.st.com  
21  
Contents  
VNS3NV04D-E  
Contents  
1
2
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
2.1  
2.2  
2.3  
2.4  
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
3
Protection features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
3.1  
3.2  
3.3  
3.4  
Overvoltage clamp protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Linear current limiter circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Overtemperature and short circuit protection . . . . . . . . . . . . . . . . . . . . . . 16  
Status feedback . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
4
5
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
4.1  
4.2  
4.3  
ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
SO-8 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
SO-8 Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
2/21  
VNS3NV04D-E  
List of tables  
List of tables  
Table 1.  
Table 2.  
Table 3.  
Table 4.  
Table 5.  
Table 6.  
Table 7.  
Table 8.  
Table 9.  
Table 10.  
Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Off. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
On. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Source Drain diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Protections (-40°C < Tj < 150°C, unless otherwise specified) . . . . . . . . . . . . . . . . . . . . . . . 9  
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
3/21  
List of figures  
VNS3NV04D-E  
List of figures  
Figure 1.  
Figure 2.  
Figure 3.  
Figure 4.  
Figure 5.  
Figure 6.  
Figure 7.  
Figure 8.  
Figure 9.  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Switching time test circuit for resistive load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Test circuit for diode recovery times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Unclamped inductive load test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Input charge test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Unclamped inductive waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Source-Drain diode forward characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Figure 10. Static Drain-Source On resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Figure 11. Derating curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Figure 12. Static Drain-Source On resistance vs. Input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Figure 13. Static Drain-Source On resistance Vs. Input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Figure 14. Transconductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Figure 15. Static Drain-Source On resistance Vs. Id . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Figure 16. Transfer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Figure 17. Turn On current slope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Figure 18. Turn On current slope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Figure 19. Input voltage Vs. Input charge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Figure 20. Turn off Drain source voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Figure 21. Turn off Drain-Source voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Figure 22. Capacitance variations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Figure 23. Switching time resistive load. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Figure 24. Switching time resistive load. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Figure 25. Output characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Figure 26. Normalized On resistance Vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Figure 27. Normalized Input threshold voltage Vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Figure 28. Normalized current limit Vs. junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Figure 29. Step response current limit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Figure 30. SO-8 package mechanical data & package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Figure 31. SO-8 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Figure 32. SO-8 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
4/21  
VNS3NV04D-E  
Block diagram and pin description  
1
Block diagram and pin description  
Figure 1.  
Block diagram  
DRAIN2  
DRAIN1  
OVERVOLTAGE  
CLAMP  
OVERVOLTAGE  
CLAMP  
INPUT2  
GATE  
CONTROL  
INPUT1  
GATE  
CONTROL  
LINEAR  
LINEAR  
CURRENT  
CURRENT  
OVER  
TEMPERATURE  
OVER  
TEMPERATURE  
LIMITER  
LIMITER  
SOURCE2  
SOURCE1  
Figure 2.  
Configuration diagram (top view)  
1
DRAIN 1  
DRAIN 1  
DRAIN 2  
DRAIN 2  
SOURCE 1  
INPUT 1  
8
5
SOURCE 2  
INPUT 2  
4
5/21  
Electrical specifications  
VNS3NV04D-E  
2
Electrical specifications  
Figure 3.  
Current and voltage conventions  
RIN1  
I
I
IN1  
D1  
INPUT 1  
INPUT 2  
DRAIN 1  
I
RIN2  
I
IN2  
D2  
V
V
IN1  
DS1  
DRAIN 2  
V
IN2  
V
SOURCE 1  
SOURCE 2  
DS1  
2.1  
Absolute maximum ratings  
Stressing the device above the rating listed in the “Absolute maximum ratings” table may  
cause permanent damage to the device. These are stress ratings only and operation of the  
device at these or any other conditions above those indicated in the operating sections of  
this specification is not implied. Exposure to Absolute maximum rating conditions for  
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE  
program and other relevant quality document.  
Table 2.  
Symbol  
Absolute maximum ratings  
Parameter  
Value  
Unit  
VDSn  
VINn  
IINn  
Drain-Source Voltage (VINn=0V)  
Input voltage  
Internally clamped  
Internally clamped  
+/-20  
V
V
Input current  
mA  
RIN MINn Minimum input series impedance  
220  
IDn  
IRn  
Drain current  
Internally limited  
-5.5  
A
Reverse DC output current  
Electrostatic discharge (R=1.5K, C=100pF)  
A
VESD1  
4000  
V
Electrostatic discharge on output pins only (R=330,  
C=150pF)  
VESD2  
16500  
V
Ptot  
Tj  
Total dissipation at Tc=25°C  
Operating junction temperature  
Case operating temperature  
Storage temperature  
4
°C  
°C  
°C  
Internally limited  
Internally limited  
-55 to 150  
Tc  
Tstg  
6/21  
VNS3NV04D-E  
Electrical specifications  
2.2  
Thermal data  
Table 3.  
Symbol  
Thermal data  
Parameter  
Max value  
Unit  
Rthj-lead Thermal resistance junction-lead (per channel)  
Rthj-amb Thermal resistance junction-ambient  
30  
°C/W  
°C/W  
80(1)  
1. When mounted on a standard single-sided FR4 board with 50mm2 of Cu (at least 35 µm thick) connected  
to all DRAIN pins of the relative channel  
2.3  
Electrical characteristics  
Values specified in this section are for -40°C< Tj <150°C, unless otherwise stated.  
Table 4.  
Symbol  
Off  
Parameter  
Test Conditions  
VIN=0V; ID=1.5A  
Min  
Typ  
Max  
Unit  
Drain-Source clamp  
voltage  
VCLAMP  
VCLTH  
VINTH  
IISS  
40  
45  
55  
V
Drain-Source clamp  
threshold voltage  
VIN=0V; ID=2mA  
VDS=VIN; ID=1mA  
36  
V
V
Input threshold  
voltage  
0.5  
2.5  
Supply current from  
input pin  
VDS=0V; VIN=5V  
100  
6.8  
150  
µA  
V
Input-Source clamp  
voltage  
IIN=1mA  
IIN=-1mA  
6
8
VINCL  
-1.0  
-0.3  
Zero input voltage  
drain current  
(VIN=0V)  
VDS=13V; VIN=0V; Tj=25°C  
VDS=25V; VIN=0V  
30  
75  
IDSS  
µA  
Table 5.  
Symbol  
On  
Parameter  
Test conditions  
Min  
Typ  
Max  
Unit  
VIN=5V; ID=1.5A; Tj=25°C  
VIN=5V; ID=1.5A  
120  
240  
Static Drain-Source  
On resistance  
RDS(on)  
mΩ  
7/21  
Electrical specifications  
VNS3NV04D-E  
Electrical characteristics (continued) (T =25°C, unless otherwise specified)  
j
Table 6.  
Symbol  
Dynamic  
Parameter  
Forward  
Test conditions  
Min  
Typ  
Max  
Unit  
(1)  
gfs  
VDD=13V; ID=1.5A  
5.0  
S
transconductance  
COSS  
Output capacitance  
VDS=13V; f=1MHz; VIN=0V  
150  
pF  
Table 7.  
Symbol  
Switching  
Parameter  
Test conditions  
Min  
Typ  
Max Unit  
td(on)  
tr  
td(off)  
tf  
td(on)  
tr  
td(off)  
tf  
Turn-on delay time  
Rise Time  
90  
300  
750  
ns  
ns  
ns  
ns  
µs  
µs  
µs  
µs  
V
DD=15V; ID=1.5A  
250  
Vgen=5V; Rgen=RIN MIN=220Ω  
(see Figure 4)  
Turn-off delay time  
Fall time  
450 1350  
250 750  
0.45 1.35  
Turn-on delay time  
Rise time  
VDD=15V; ID=1.5A  
Vgen=5V; Rgen=2.2 KΩ  
(see Figure 4)  
2.5  
3.3  
2.0  
7.5  
10.0  
6.0  
Turn-off delay time  
Fall time  
V
DD=15V; ID=1.5A  
Vgen=5V; Rgen=RIN MIN=220Ω  
DD=12V; ID=1.5A; VIN=5V  
(dI/dt)on Turn-on current slope  
4.7  
8.5  
A/µs  
V
Qi  
Total input charge  
nC  
Igen=2.13mA (see Figure 7)  
Table 8.  
Symbol  
Source Drain diode  
Parameter  
Test Conditions  
Min  
Typ  
Max Unit  
(1)  
VSD  
Forward On voltage  
ISD=1.5A; VIN=0V  
0.8  
V
trr  
Reverse recovery time  
107  
ns  
ISD=1.5A; dI/dt=12A/µs  
VDD=30V; L=200µH  
(see Figure 5)  
Reverse recovery  
charge  
Qrr  
37  
µC  
Reverse recovery  
current  
IRRM  
0.7  
A
1. Pulsed: Pulse duration = 300µs, duty cycle 1.5%  
8/21  
VNS3NV04D-E  
Electrical specifications  
Table 9.  
Protections (-40°C < T < 150°C, unless otherwise specified)  
j
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max Unit  
Ilim  
Drain current limit  
VIN=5V; VDS=13V  
VIN=5V; VDS=13V  
3.5  
5
7
A
Step response current  
limit  
tdlim  
10  
µs  
Overtemperature  
shutdown  
Tjsh  
150  
175  
200  
20  
°C  
Tjrs  
Igf  
Overtemperature reset  
Fault sink current  
135  
10  
°C  
VIN=5V; VDS=13V; Tj=Tjsh  
Starting Tj=25°C; VDD=24V  
15  
mA  
Single pulse  
VIN=5V Rgen=RIN MIN=220;  
L=24mH  
Eas  
100  
mJ  
avalanche energy  
(see Figure 6 and Figure 8)  
Figure 4.  
Switching time test circuit for resistive load  
V
D
R
gen  
V
gen  
I
D
90%  
10%  
t
t
f
r
t
t
t
d(on)  
t
d(off)  
V
gen  
9/21  
Electrical specifications  
Figure 5.  
VNS3NV04D-E  
Test circuit for diode recovery times  
A
A
B
D
I
FAST  
DIODE  
L=100uH  
OMNIFET  
S
B
220  
D
S
VDD  
Rgen  
I
OMNIFET  
Vgen  
8.5  
Figure 6.  
Unclamped inductive load test circuits  
R
GEN  
V
IN  
P
W
10/21  
VNS3NV04D-E  
Figure 7.  
Electrical specifications  
Input charge test circuit  
GEN  
IN  
V
ND8003  
Figure 8.  
Unclamped inductive waveforms  
11/21  
Electrical specifications  
VNS3NV04D-E  
2.4  
Electrical characteristics curves  
Figure 9.  
Source-Drain diode forward Figure 10. Static Drain-Source On  
characteristics  
resistance  
Vsd (mV)  
1100  
Rds(on) (mohms)  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
Tj=-40ºC  
1050  
1000  
950  
900  
850  
800  
750  
700  
650  
Vin=0V  
Vin=2.5V  
Tj=25ºC  
Tj=150ºC  
600  
0
1
2
3
4
5
6
7
8
9
10 11 12  
0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55  
Id(A)  
Id (A)  
Figure 11. Derating curve  
Figure 12. Static Drain-Source On  
resistance vs. Input voltage  
Rds(on) (mohms)  
300  
275  
250  
225  
200  
175  
150  
125  
100  
75  
Tj=150ºC  
Id=3.5A  
Id=1A  
Tj=25ºC  
Tj=-40ºC  
Id =3.5A  
Id =1A  
Id=3.5A  
Id=1A  
50  
25  
0
3
3.5  
4
4.5  
Vin(V)  
5
5.5  
6
6.5  
Figure 13. Static Drain-Source On  
resistance Vs. Input voltage  
Figure 14. Transconductance  
Rds(on) (mohms)  
250  
Gfs (S)  
11  
225  
10  
Vds=13V  
Id=1.5A  
Tj=-40ºC  
Tj=25ºC  
9
200  
8
7
6
5
4
3
2
1
0
175  
Tj=150ºC  
Tj=150ºC  
150  
125  
100  
75  
Tj=25ºC  
50  
Tj=-40ºC  
25  
0
3
3.5  
4
4.5  
Vin(V)  
5
5.5  
6
6.5  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
Id (A)  
12/21  
VNS3NV04D-E  
Electrical specifications  
Figure 15. Static Drain-Source On  
resistance Vs. Id  
Figure 16. Transfer characteristics  
Idon (A)  
6
Rds(on) (mohms)  
250  
225  
200  
175  
150  
125  
100  
75  
5.5  
5
Vds=13.5V  
Tj=150ºC  
Vin=5V  
Tj=150ºC  
4.5  
4
3.5  
3
Tj=-40ºC  
Tj=25ºC  
2.5  
2
1.5  
1
Tj=25ºC  
50  
Tj=- 40ºC  
25  
0.5  
0
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
Id (A)  
Vin (V)  
Figure 17. Turn On current slope  
Figure 18. Turn On current slope  
di/dt(A/us)  
5
di/dt(A/usec)  
1.75  
4.5  
Vin=5V  
1.5  
4
3.5  
3
Vdd=15V  
Id=1.5A  
Vin=3.5V  
Vdd=15V  
Id=1.5A  
1.25  
1
2.5  
2
0.75  
0.5  
0.25  
0
1.5  
1
0.5  
0
0
250 500 750 1000 1250 1500 1750 2000 2250 2500  
Rg(ohm)  
0
250 500 750 1000 1250 1500 1750 2000 2250 2500  
Rg(ohm)  
Figure 19. Input voltage Vs. Input  
charge  
Figure 20. Turn off Drain source voltage  
slope  
Vin (V)  
9
dv/dt(V/usec)  
300  
275  
8
Vds=1V  
Id=1.5A  
Vin=5V  
Vdd=15V  
250  
7
225  
Id=1.5A  
200  
175  
150  
125  
100  
75  
6
5
4
3
2
1
0
50  
25  
0
0
500  
1000  
1500  
2000  
2500  
0
1
2
3
4
5
6
7
8
9
10  
11  
250  
750  
1250  
1750  
2250  
Qg (nC)  
Rg(ohm)  
13/21  
Electrical specifications  
VNS3NV04D-E  
Figure 21. Turn off Drain-Source voltage Figure 22. Capacitance variations  
slope  
dv/dt(V/usec)  
300  
C(pF)  
350  
275  
250  
225  
200  
175  
150  
125  
100  
75  
Vin=3.5V  
Vdd=15V  
Id=1.5A  
300  
250  
200  
150  
100  
50  
f=1MHz  
Vin=0V  
50  
25  
0
0
500  
750  
1000  
1500  
2000  
2500  
0
5
10  
15  
20  
25  
30  
35  
250  
1250  
1750  
2250  
Vds(V)  
Rg(ohm)  
Figure 23. Switching time resistive load Figure 24. Switching time resistive load  
t(usec)  
4
t(nsec)  
900  
800  
700  
600  
500  
400  
300  
200  
100  
3.5  
3
tr  
td(off)  
Vdd=15V  
Id=1.5A  
Rg=220ohm  
Vdd=15V  
Id =1.5A  
Vin=5V  
tr  
tf  
2.5  
2
td(off)  
1.5  
1
tf  
td(on)  
td(on)  
0.5  
0
0
0
3.25  
3.5  
3.75  
4
4.25  
4.5  
4.75  
5
5.25  
500  
1000  
1500  
2000  
2500  
250  
750  
1250  
1750  
2250  
Vin(V)  
Rg(ohm)  
Figure 25. Output characteristics  
Figure 26. Normalized On resistance Vs.  
temperature  
Id (A)  
5
Rds(on)(mOhm)  
4
Vin=5V  
4.5  
Vin=4V  
3.5  
4
Vin=5V  
Id=1.5A  
3
3.5  
Vin=3V  
3
2.5  
2
2.5  
2
1.5  
1
1.5  
1
0.5  
0
0.5  
-50  
-25  
0
25  
50  
75  
100 125 150 175  
0
1
2
3
4
5
6
7
8
9
10  
Tc )ºC)  
Vds (V)  
14/21  
VNS3NV04D-E  
Electrical specifications  
Figure 27. Normalized Input threshold  
Figure 28. Normalized current limit Vs.  
junction temperature  
voltage Vs. temperature  
Vinth (V)  
2
Ilim (A)  
10  
1.8  
1.6  
1.4  
1.2  
1
9
Vds=Vin  
Id=1mA  
Vin=5V  
Vds=13V  
8
7
6
5
4
3
2
1
0
0.8  
0.6  
0.4  
0.2  
0
-50  
-25  
0
25  
50  
75  
100 125 150 175  
-50  
-25  
0
25  
50  
75  
100  
125 150  
175  
Tc (ºC)  
Tc (ºC )  
Figure 29. Step response current limit  
Tdlim(usec)  
13  
12.5  
Vin=5V  
Rg=220ohm  
12  
11.5  
11  
10.5  
10  
9.5  
9
8.5  
8
7.5  
5
7.5 10 12.5 15 17.5 20 22.5 25 27.5 30 32.5  
Vdd(V)  
15/21  
Protection features  
VNS3NV04D-E  
3
Protection features  
During normal operation, the INPUT pin is electrically connected to the gate of the internal  
power MOSFET through a low impedance path.  
The device then behaves like a standard power MOSFET and can be used as a switch from  
DC up to 50KHz. The only difference from the user’s standpoint is that a small DC current  
I
(typ. 100µA) flows into the INPUT pin in order to supply the internal circuitry.  
ISS  
The device integrates:  
3.1  
3.2  
Overvoltage clamp protection  
Internally set at 45V, along with the rugged avalanche characteristics of the Power MOSFET  
stage give this device unrivalled ruggedness and energy handling capability. This feature is  
mainly important when driving inductive loads.  
Linear current limiter circuit  
Limits the drain current I to I whatever the INPUT pin voltages. When the current limiter  
D
lim  
is active, the device operates in the linear region, so power dissipation may exceed the  
capability of the heatsink. Both case and junction temperatures increase, and if this phase  
lasts long enough, junction temperature may reach the overtemperature threshold T  
jsh.  
3.3  
3.4  
Overtemperature and short circuit protection  
These are based on sensing the chip temperature and are not dependent on the input  
voltage. The location of the sensing element on the chip in the power stage area ensures  
fast, accurate detection of the junction temperature. Overtemperature cutout occurs in the  
range 150 to 190 °C, a typical value being 170 °C. The device is automatically restarted  
when the chip temperature falls of about 15°C below shut-down temperature.  
Status feedback  
In the case of an overtemperature fault condition (T > T ), the device tries to sink a  
j
jsh  
diagnostic current I through the INPUT pin in order to indicate fault condition. If driven from  
gf  
a low impedance source, this current may be used in order to warn the control circuit of a  
device shutdown. If the drive impedance is high enough so that the INPUT pin driver is not  
able to supply the current I , the INPUT pin will fall to 0V. This will not however affect the  
gf  
device operation: no requirement is put on the current capability of the INPUT pin  
driver except to be able to supply the normal operation drive current I  
.
ISS  
Additional features of this device are ESD protection according to the Human Body model  
and the ability to be driven from a TTL Logic circuit.  
16/21  
VNS3NV04D-E  
Package and packing information  
4
Package and packing information  
4.1  
ECOPACK® packages  
®
In order to meet environmental requirements, ST offers these devices in ECOPACK  
packages. These packages have a Lead-free second-level interconnect. The category of  
Second-Level Interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label.  
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.  
17/21  
Package and packing information  
VNS3NV04D-E  
4.2  
SO-8 Package mechanical data  
Figure 30. SO-8 package mechanical data & package outline  
mm  
inch  
DIM.  
OUTLINE AND  
MECHANICAL DATA  
MIN.  
TYP. MAX. MIN.  
1.750  
TYP. MAX.  
0.0689  
A
A1  
A2  
b
0.100  
1.250  
0.280  
0.170  
0.250 0.0039  
0.0492  
0.0098  
0.480 0.0110  
0.230 0.0067  
0.0189  
0.0091  
c
(1)  
D
4.800 4.900 5.000 0.1890 0.1929 0.1969  
E
5.800 6.000 6.200 0.2283 0.2362 0.2441  
3.800 3.900 4.000 0.1496 0.1535 0.1575  
(2)  
E1  
e
h
1.270  
0.0500  
0.250  
0.400  
0.500 0.0098  
1.270 0.0157  
0.0197  
0.0500  
L
L1  
k
1.040  
0.0409  
0˚  
8˚  
0˚  
8˚  
ccc  
0.100  
0.0039  
Notes: 1. Dimensions D does not include mold flash,  
protrusions or gate burrs.  
Mold flash, potrusions or gate burrs shall not  
exceed 0.15mm in total (both side).  
SO-8  
2. Dimension “E1” does not include interlead flash  
or protrusions. Interlead flash or protrusions shall  
not exceed 0.25mm per side.  
0016023 D  
18/21  
VNS3NV04D-E  
Package and packing information  
4.3  
SO-8 Packing information  
Figure 31. SO-8 tube shipment (no suffix)  
B
Base Q.ty  
Bulk Q.ty  
100  
2000  
C
Tube length ( 0.5)  
A
B
532  
3.2  
6
A
C ( 0.1)  
0.6  
All dimensions are in mm.  
Figure 32. SO-8 tape and reel shipment (suffix “TR”)  
REEL DIMENSIONS  
Base Q.ty  
Bulk Q.ty  
A (max)  
B (min)  
C ( 0.2)  
F
G (+ 2 / -0)  
N (min)  
T (max)  
2500  
2500  
330  
1.5  
13  
20.2  
12.4  
60  
18.4  
All dimensions are in mm.  
TAPE DIMENSIONS  
According to Electronic Industries Association  
(EIA) Standard 481 rev. A, Feb. 1986  
Tape width  
W
P0 ( 0.1)  
P
12  
4
Tape Hole Spacing  
Component Spacing  
Hole Diameter  
8
D ( 0.1/-0) 1.5  
Hole Diameter  
Hole Position  
Compartment Depth  
Hole Spacing  
D1 (min)  
F ( 0.05)  
K (max)  
1.5  
5.5  
4.5  
2
P1 ( 0.1)  
All dimensions are in mm.  
End  
Start  
Top  
No components  
500mm min  
Components  
No components  
500mm min  
cover  
tape  
Empty components pockets  
saled with cover tape.  
User direction of feed  
19/21  
Revision history  
VNS3NV04D-E  
5
Revision history  
Table 10. Document revision history  
Date  
Revision  
Changes  
28-Oct-2005  
1
Initial release.  
Document reformatted and converted into new ST template.  
02-Jul-2007  
2
Table 4: Off - IDSS unit corrected  
20/21  
VNS3NV04D-E  
Please Read Carefully:  
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the  
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any  
time, without notice.  
All ST products are sold pursuant to ST’s terms and conditions of sale.  
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no  
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this  
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products  
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such  
third party products or services or any intellectual property contained therein.  
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED  
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED  
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OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.  
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Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void  
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any  
liability of ST.  
ST and the ST logo are trademarks or registered trademarks of ST in various countries.  
Information in this document supersedes and replaces all information previously supplied.  
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.  
© 2007 STMicroelectronics - All rights reserved  
STMicroelectronics group of companies  
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21/21  

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