LP0701 [SUPERTEX]

P-Channel Enhancement-Mode Lateral MOSFET; P沟道增强模式横向MOSFET
LP0701
型号: LP0701
厂家: Supertex, Inc    Supertex, Inc
描述:

P-Channel Enhancement-Mode Lateral MOSFET
P沟道增强模式横向MOSFET

文件: 总4页 (文件大小:32K)
中文:  中文翻译
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LP0701  
Low Threshold  
P-Channel Enhancement-Mode  
Lateral MOSFET  
Ordering Information  
Order Number / Package  
SO-8  
BVDSS  
BVDGS  
/
RDS(ON)  
(max)  
ID(ON)  
(min)  
VGS(th)  
(max)  
TO-92  
LP0701N3  
Die  
-16.5V  
1.5  
-1.25A  
-1.0V  
LP0701LG  
LP0701ND  
Advanced MOS Technology  
Features  
These enhancement-mode (normally-off) transistors utilize a lat-  
eral MOS structure and Supertex’s well-proven silicon-gate  
manufacturing process. This combination produces devices with  
the power handling capabilities of bipolar transistors and with the  
highinputimpedanceandnegativetemperaturecoefficientinher-  
ent in MOS devices. Characteristic of all MOS structures, these  
devices are free from thermal runaway and thermally-induced  
secondary breakdown. The low threshold voltage and low on-  
resistance characteristics are ideally suited for hand held battery  
operated applications.  
Ultra low threshold  
High input impedance  
Low input capacitance  
Fast switching speeds  
Low on resistance  
Freedom from secondary breakdown  
Low input and output leakage  
Complementary N- and P-channel devices  
Applications  
Logic level interfaces  
Package Options  
(Note 1)  
Solid state relays  
Battery operated systems  
Photo voltaic drives  
Analog switches  
General purpose line drivers  
S G D  
TO-92  
Absolute Maximum Ratings  
Drain-to-Source Voltage  
Drain-to-Gate Voltage  
Gate-to-Source Voltage  
BVDSS  
BVDGS  
NC  
NC  
S
1
2
3
4
8
7
6
5
D
D
D
D
± 10V  
Operating and Storage Temperature  
Soldering Temperature*  
-55°C to +150°C  
300°C  
G
*Distance of 1.6 mm from case for 10 seconds.  
SO-8  
top view  
Note: See Package Outline section for dimensions.  
7-23  
LP0701  
Thermal Characteristics  
Package  
ID (continuous)*  
ID (pulsed)*  
Power Dissipation  
θjc  
θja  
IDR  
IDRM  
*
@ TC = 25°C  
°C/W  
°C/W  
TO-92  
SO-8  
-0.5A  
-0.7A  
-1.25A  
-1.25A  
1W  
125  
83  
170  
-0.5A  
-0.7A  
-1.25A  
-1.25A  
1.5W†  
104†  
*
ID (continuous) is limited by max rated Tj.  
Mounted on FR4 board, 25mm x 25mm x 1.57mm.  
Electrical Characteristics (@ 25°C unless otherwise specified)  
Symbol  
BVDSS  
VGS(th)  
VGS(th)  
IGSS  
Parameter  
Drain-to-Source Breakdown Voltage  
Gate Threshold Voltage  
Min  
-16.5  
-0.5  
Typ  
Max  
Unit  
V
Conditions  
VGS = 0V, ID = -1mA  
VGS = VDS, ID = -1mA  
VGS = VDS, ID = -1mA  
VGS = ±10V, VDS = 0V  
VDS = -15V, VGS = 0V  
-0.7  
-1.0  
-4.0  
-100  
-100  
-1.0  
V
Change in VGS(th) with Temperature  
Gate Body Leakage  
mV/°C  
nA  
IDSS  
Zero Gate Voltage Drain Current  
nA  
mA  
VDS = 0.8 Max Rating,  
VGS = 0V, TA = 125°C  
-0.4  
-1.0  
-2.3  
2.0  
VGS = VDS = -2V  
A
ID(ON)  
ON-State Drain Current  
-0.6  
VGS = VDS = -3V  
-1.25  
A
VGS = VDS = -5V  
4.0  
2.0  
VGS = -2V, ID = -50mA  
VGS = -3V, ID = -150mA  
VGS = -5V, ID = -300mA  
VGS = -5V, ID = -300mA  
VDS = -15V, ID = -1A  
Static Drain-to-Source  
ON-State Resistance  
RDS(ON)  
1.7  
1.3  
1.5  
RDS(ON)  
GFS  
Change in RDS(ON) with temperature  
Forward Transconductance  
Input Capacitance  
0.75  
%/°C  
500  
700  
120  
100  
40  
m
CISS  
COSS  
CRSS  
td(ON)  
tr  
250  
125  
60  
Common Source Output Capacitance  
Reverse Transfer Capacitance  
Turn-ON Delay Time  
pF  
VGS = 0V, VDS = -15V, f = 1MHz  
20  
ns  
V
Rise Time  
20  
VDD =-15V, ID = -1.25A,  
td(OFF)  
tf  
Turn-OFF Delay Time  
30  
RGEN = 25Ω  
Fall Time  
30  
VSD  
Diode Forward Voltage Drop  
-1.2  
-1.5  
VGS = 0V, ISD = -500mA  
Note 1: All D.C. parameters 100% tested at 25°C unless otherwise stated. (Pulse test: 300µs pulse, 2% duty cycle.)  
Note 2: All A.C. parameters sample tested.  
Switching Waveforms and Test Circuit  
0V  
10%  
PULSE  
GENERATOR  
INPUT  
90%  
-10V  
Rgen  
t(ON)  
td(ON)  
t(OFF)  
td(OFF)  
tr  
tF  
D.U.T.  
OUTPUT  
0V  
INPUT  
90%  
90%  
RL  
OUTPUT  
VDD  
10%  
10%  
VDD  
7-24  
LP0701  
Typical Performance Curves  
Output Characteristics  
Saturation Characteristics  
VGS = -5V  
-2.5  
-2.5  
-2.0  
-1.5  
-1.0  
-0.5  
0
VGS = -5V  
-2.0  
-4V  
-4V  
-3V  
-1.5  
-3V  
-1.0  
-0.5  
0
-2V  
-1V  
-2V  
-1V  
0
-4  
-8  
-12  
-16  
0
-1  
-2  
-3  
-4  
-5  
VDS (volts)  
VDS (volts)  
Transconductance vs. Drain Current  
Power Dissipation vs. Case Temperature  
1.0  
0.8  
0.6  
0.4  
0.2  
0
2
VDS = -15V  
TA = -55°C  
SO-8  
TA = 25°C  
TO-92  
1
TA = 125°C  
0
0
-1.0  
-2.0  
0
25  
50  
75  
100  
125  
150  
ID (amperes)  
TC (°C)  
Maximum Rated Safe Operating Area  
TO-92/SO-8 (pulsed)  
Thermal Response Characteristics  
-10  
-1.0  
1.0  
0.8  
0.6  
TO-92 (DC)  
SO-8 (DC)  
TO-92  
TC = 25°C  
PD = 1W  
0.4  
0.2  
0
-0.1  
T
= 25°C  
C
-0.01  
-0.1  
-1.0  
-10  
-100  
0.001  
0.01  
0.1  
1.0  
10  
VDS (volts)  
tP (seconds)  
7-25  
LP0701  
Typical Performance Curves  
BVDSS Variation with Temperature  
On-Resistance vs. Drain Current  
VGS = -2V  
10  
8
1.1  
VGS = -3V  
VGS = -5V  
6
1.0  
0.9  
4
2
0
-1  
-3  
-50  
0
50  
100  
150  
0
-50  
0
-2  
Tj (°C)  
ID (amperes)  
Transfer Characteristics  
V(th) and RDS Variation with Temperature  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
1.6  
-2  
VDS = -15V  
1.4  
1.2  
1.0  
0.8  
0.6  
V(th) @ -1mA  
TA = -55°C  
TA = 25°C  
-1  
TA = 125°C  
RDS(ON) @ -5V, -300mA  
0
0
-1  
-2  
-3  
-4  
-5  
0
50  
100  
150  
VGS (volts)  
Tj (°C)  
Capacitance vs. Drain-to-Source Voltage  
f = 1MHz  
Gate Drive Dynamic Characteristics  
200  
-10  
-8  
-6  
-4  
-2  
0
VDS = -10V  
-20V  
CISS  
100  
238pF  
COSS  
CRSS  
CISS = 115pF  
0
0
-5  
-10  
-15  
1
2
3
4
5
VDS (volts)  
QG (nanocoulombs)  
7-26  

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