TC7920K6-G [SUPERTEX]
Two Pair, N- and P-Channel Enhancement-Mode MOSFET with Drain-Diodes;![TC7920K6-G](http://pdffile.icpdf.com/pdf2/p00343/img/icpdf/TC7920_2113819_icpdf.jpg)
型号: | TC7920K6-G |
厂家: | ![]() |
描述: | Two Pair, N- and P-Channel Enhancement-Mode MOSFET with Drain-Diodes 开关 光电二极管 晶体管 |
文件: | 总5页 (文件大小:579K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Supertex inc.
TC7920
Two Pair, N- and P-Channel
Enhancement-Mode MOSFET with Drain-Diodes
Features
General Description
► High voltage Vertical DMOS technology
► Integrated drain output high voltage diodes
► Integrated gate-to-source resistor
► Integrated gate-to-source Zener diode
► Low threshold, Low on-resistance
► Low input & output capacitance
The Supertex TC7920 consists of two pairs of high voltage, low
threshold N-channel and P-channel MOSFETs in a 12-Lead
DFN package. All MOSFETs have integrated the output drain
high voltage diodes, gate-to-source resistors and gate-to-source
Zener diode clamps which are desired for high voltage pulser
applications. The complimentary, high-speed, high voltage, gate-
clamped N and P-channel MOSFET pairs utilize an advanced
vertical DMOS structure and Supertex’s well-proven silicon-gate
manufacturing process. This combination produces a device with
the power handling capabilities of bipolar transistors and with the
high input impedance and positive temperature coefficient inherent
in MOS devices.
► Fast switching speeds
► Electrically isolated N- and P-MOSFET pairs
Applications
► High voltage pulsers
► Amplifiers
► Buffers
Characteristic of all MOS structures, these devices are free from
thermal runaway and thermally induced secondary breakdown.
Supertex’s vertical DMOS FETs are ideally suited to a wide range
of switching and amplifying applications where very low threshold
voltage, high breakdown voltage, high input impedance, low input
and output capacitance, and fast switching speeds are desired.
► Piezoelectric transducer drivers
► General purpose line drivers
► Logic level interfaces
Typical Application Circuit
VPP
+100V
+10V
0.47µF
1.0µF
0.1µF
VDD
OE
VH
ENAB
OUTA
INA
+PULSE
1.8 to 5.0V
Logic Imputs
VNN
OUTB
INB
INC
-100V
-PULSE
DAMP
OUTC
OUTD
1.0µF
IND
GND
VSS
VL
Supertex
MD1822
10nF
Supertex
Doc.# DSFP-TC7920
B080613
Supertex inc.
www.supertex.com
TC7920
Ordering Information
Product Summary
Part Number
Package Option Packing
BVDSS/BVDGS
RDS(ON) (max)
TC7920K6-G
12-Lead DFN 3000/Reel
N-Channel
P-Channel
N-Channel
P-Channel
200V
-200V
7.0Ω
8.0Ω
Absolute Maximum Ratings
Parameter
Value
BVDSS
BVDGS
Pin Configuration
Drain-to-source voltage
1
2
3
4
5
6
GN1
GP1
GN2
SN2
GP2
SP2
12
11
10
9
SN1
DN1
DP1
SP1
DN2
DP2
Drain-to-gate voltage
Operating and storage temperature
-55°C to +150°C
Thermal
Pad
Absolute Maximum Ratings are those values beyond which damage to the
device may occur. Functional operation under these conditions is not implied.
Continuous operation of the device at the absolute rating level may affect
device reliability. All voltages are referenced to device ground.
8
7
Typical Thermal Resistance
12-Lead DFN
Package
θja
(top view)
12-Lead DFN
42OC/W
Note:
Package Marking
1.0oz, 4-layer, 3”x4” PCB.
Y = Last Digit of Year Sealed
W = Code for Week Sealed
L = Lot Number
7920
YWLL
= “Green” Packaging
Package may or may not include the following marks: Si or
12-Lead DFN
Drain Output Diodes
Sym
Parameter
Min
Typ
-
Max
Unit
V
Condition
VR
Breakdown voltage
Forward voltage
Park forward current
200
-
-
-
-
-
-
IR = 100µA
VF
IFM
-
-
-
-
-
1.25
3.0
1.0
100
1.0
V
IF = 100mA
A
Pulse width = 1.0μs, D% = 1%, One diode
VR = 100 V, TA = 25OC
VR = 100 V, TA = 125OC
IF = IR = 10mA, IRR = 1.0 mA, RL = 100Ω
IR
trr
Reverse current
µA
µs
Reverse recovery time
Pin Description
Pin #
Function Description
Pin #
Function Description
1
2
3
4
5
6
GN1
GP1
GN2
SN2
GP2
SP2
Gate of N-MOSFET 1
Gate of P-MOSFET 1
Gate of N-MOSFET 2
7
8
DP2
DN2
SP1
DP1
DN1
SN1
Drain of P-MOSFET 2
Drain of N-MOSFET 2
Source of P-MOSFET 1
Drain of P-MOSFET 1
Drain of N-MOSFET 1
Source of N-MOSFET 1
9
Source of N-MOSFET 2
Gate of P-MOSFET 2
Source of P-MOSFET 2
10
11
12
Thermal Pad
Die attachment substrate, must be grounded externally
Doc.# DSFP-TC7920
B080613
Supertex inc.
www.supertex.com
2
TC7920
N-Channel Electrical Characteristics (TA = 25°C unless otherwise specified)
Sym
BVDSS
VGS(th)
Parameter
Min
200
1.0
-
Typ
Max
Units Conditions
Drain-to-source breakdown voltage
Gate threshold voltage
-
-
-
-
-
-
-
V
V
VGS = 0V, ID = 2.0mA
VGS = VDS, ID = 1.0mA
2.4
-4.5
50
ΔVGS(th) Change in VGS(th) with temperature
mV/OC VGS = VDS, ID = 1.0mA
RGS
Gate-to-source shunt resistor
Gate-to-source Zener voltage
10
KΩ
V
IGS = 100µA
VZGS
13.2
-
25
IGS = 2.0mA
10.0
µA
VDS = Max rating, VGS = 0V
IDSS
Zero gate voltage drain current
On-state drain current
VDS = 0.8 Max Rating,
VGS = 0V, TA = 125OC
-
-
1.0
mA
A
0.9
-
-
-
VGS = 5.0V, VDS = 25V
VGS = 10V, VDS = 50V
VGS = 5.0V, ID = 150mA
ID(ON)
2.0
-
-
-
13
10
1.0
-
RDS(ON) Static drain-to-source on-state resistance
Ω
-
-
VGS = 10V, ID = 1.0A
ΔRDS(ON) Change in RDS(ON) with temperature
-
-
%/OC VGS = 5.0V, ID =150mA
GFS
CISS
COSS
CRSS
td(ON)
tr
Forward transconductance
Input capacitance
300
-
52
6.9
1.3
-
mmho VDS = 25V, ID = 500mA
-
-
-
-
-
-
-
-
-
-
VGS = 0V,
VDS = 25V,
f = 1.0MHz
Common source output capacitance
Reverse transfer capacitance
Turn-on delay time
-
pF
ns
-
10
15
20
15
1.8
-
VDD =25V,
ID = 1.0A,
RGEN = 25Ω
Rise time
-
td(OFF)
tf
Turn-off delay time
-
Fall time
-
VSD
Diode forward voltage drop
Reverse recovery time
-
V
VGS = 0V, ISD = 500mA
VGS = 0V, ISD = 500mA
trr
300
ns
Notes:
1. All D.C. parameters 100% tested at 25OC unless otherwise stated. (Pulse test: 300µs pulse, 2% duty cycle.)
2. All A.C. parameters sample tested.
N-Channel Switching Waveforms and Test Circuit
10V
VDD
90%
INPUT
RL
10%
Pulse
OUTPUT
0V
Generator
t(ON)
td(ON)
10%
t(OFF)
td(OFF)
RGEN
tr
tf
D.U.T
VDD
OUTPUT
0V
10%
90%
INPUT
90%
Doc.# DSFP-TC7920
B080613
Supertex inc.
www.supertex.com
3
TC7920
P-Channel Electrical Characteristics (TA = 25°C unless otherwise specified)
Sym
BVDSS
VGS(th)
Parameter
Min
-200
-1.0
-
Typ
Max
Units Conditions
Drain-to-source breakdown voltage
Gate threshold voltage
-
-
-
-
-
-
-
V
V
VGS = 0V, ID = -2.0mA
VGS = VDS, ID = -1.0mA
-2.4
4.5
50
ΔVGS(th) Change in VGS(th) with temperature
mV/OC VGS = VDS, ID = -1.0mA
RGS
Gate-to-source shunt resistor
Gate-to-source Zener voltage
10
KΩ
V
IGS = 100µA
VZGS
13.2
-
25
IGS = -2.0mA
-10
µA
VDS = Max rating, VGS = 0V
IDSS
Zero gate voltage drain current
On-state drain current
VDS = 0.8 Max Rating,
VGS = 0V, TA = 125OC
-
-
-1.0
mA
A
-0.7
-
-
-
VGS = -5.0V, VDS = -25V
VGS = -10V, VDS = -50V
VGS = -5.0V, ID = -150mA
VGS = -10V, ID = -1.0A
VGS = -10V, ID =-200mA
ID(ON)
-2.0
-
-
-
15
12
1.0
-
RDS(ON) Static drain-to-source on-state resistance
Ω
-
-
ΔRDS(ON) Change in RDS(ON) with temperature
-
-
%/OC
GFS
CISS
COSS
CRSS
td(ON)
tr
Forward transconductance
Input capacitance
300
-
54
7.5
2.6
-
mmho VDS = -25V, ID = -500mA
-
-
-
-
-
-
-
-
-
-
VGS = 0V,
VDS = -25V,
f = 1.0MHz
Common source output capacitance
Reverse transfer capacitance
Turn-on delay time
-
pF
ns
-
10
15
20
15
-1.8
-
VDD = -25V,
ID = -1.0A,
RGEN = 25Ω
Rise time
-
td(OFF)
tf
Turn-off delay time
-
Fall time
-
VSD
Diode forward voltage drop
Reverse recovery time
-
V
VGS = 0V, ISD = -500mA
VGS = 0V, ISD = -500mA
trr
300
ns
Notes:
1. All D.C. parameters 100% tested at 25OC unless otherwise stated. (Pulse test: 300µs pulse, 2% duty cycle.)
2. All A.C. parameters sample tested.
P-Channel Switching Waveforms and Test Circuit
0V
10%
Pulse
Generator
INPUT
-10V
90%
RGEN
D.U.T
t(ON)
td(ON)
t(OFF)
td(OFF)
90%
Input
tf
tr
0V
OUTPUT
VDD
OUTPUT
RL
90%
10%
10%
VDD
Doc.# DSFP-TC7920
B080613
Supertex inc.
www.supertex.com
4
TC7920
12-Lead DFN Package Outline (K6)
4.00x4.00mm body, 1.00mm height (max), 0.50mm pitch
D
D2
12
12
E
E2
Note 1
(Index Area
D/2 x E/2)
Note 1
(Index Area
D/2 x E/2)
e
1
b
1
View B
Top View
Side View
Bottom View
Note 3
L
θ
A3
A
Seating
Plane
L1
Note 2
A1
View B
Notes:
1. A Pin 1 identifier must be located in the index area indicated. The Pin 1 identifier can be: a molded mark/identifier; an embedded metal marker; or
a printed indicator.
2. Depending on the method of manufacturing, a maximum of 0.15mm pullback (L1) may be present.
3. The inner tip of the lead may be either rounded or square.
Symbol
A
A1
A3
b
D
D2
E
E2
e
L
L1
0.00
-
θ
0O
-
MIN
NOM
MAX
0.80
0.90
1.00
0.00
0.02
0.05
0.18
0.25
0.30
3.85
4.00
4.15
3.19
3.34
3.44
3.85
4.00
4.15
2.29
2.44
2.54
0.30
0.40
0.50
Dimension
(mm)
0.20
REF
0.50
BSC
0.15
14O
Drawings not to scale.
Supertex Doc.#: DSPD-12DFNK64X4P050, Version A030210.
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline
information go to http://www.supertex.com/packaging.html.)
Supertex inc. does not recommend the use of its products in life support applications, and will not knowingly sell them for use in such applications unless it receives
an adequate “product liability indemnification insurance agreement.” Supertex inc. does not assume responsibility for use of devices described, and limits its liability
to the replacement of the devices determined defective due to workmanship. No responsibility is assumed for possible omissions and inaccuracies. Circuitry and
specifications are subject to change without notice. For the latest product specifications refer to the Supertex inc. (website: http//www.supertex.com)
©2013 Supertex inc.All rights reserved. Unauthorized use or reproduction is prohibited.
Supertex inc.
1235 Bordeaux Drive, Sunnyvale, CA 94089
Tel: 408-222-8888
www.supertex.com
Doc.# DSFP-TC7920
B080613
5
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