TN2640ND [SUPERTEX]

N-Channel Enhancement-Mode Vertical DMOS FETs; N沟道增强型垂直DMOS场效应管
TN2640ND
型号: TN2640ND
厂家: Supertex, Inc    Supertex, Inc
描述:

N-Channel Enhancement-Mode Vertical DMOS FETs
N沟道增强型垂直DMOS场效应管

晶体 小信号场效应晶体管 开关 输入元件
文件: 总4页 (文件大小:462K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TN2640  
Low Threshold  
N-Channel Enhancement-Mode  
Vertical DMOS FETs  
Ordering Information  
Order Number / Package  
BVDSS  
/
RDS(ON)  
(max)  
VGS(th)  
(max)  
ID(ON)  
(min)  
BVDGS  
SO-8  
TO-92  
DPAK  
Die†  
400V  
5.0  
2.0V  
2.0A  
TN2640LG  
TN2640N3  
TN2640K4  
TN2640ND  
MIL visual screening available.  
Low Threshold DMOS Technology  
Features  
These low threshold enhancement-mode (normally-off) transis-  
tors utilize a vertical DMOS structure and Supertex's well-proven  
silicon-gate manufacturing process. This combination produces  
devices with the power handling capabilities of bipolar transistors  
and with the high input impedance and positive temperature  
coefficient inherent in MOS devices. Characteristic of all MOS  
structures, these devices are free from thermal runaway and  
thermally induced secondary breakdown.  
Low threshold — 2.0V max.  
High input impedance  
Low input capacitance  
Fast switching speeds  
Low on resistance  
Free from secondary breakdown  
Low input and output leakage  
Supertex’s vertical DMOS FETs are ideally suited to a wide range  
of switching and amplifying applications where very low threshold  
voltage, highbreakdownvoltage, highinputimpedance, lowinput  
capacitance, and fast switching speeds are desired.  
Complementary N- and P-channel devices  
Applications  
Package Options  
Logic level interfaces – ideal for TTL and CMOS  
Solid state relays  
D (TAB)  
Battery operated systems  
Photo voltaic drives  
G
S
Analog switches  
General purpose line drivers  
Telecom switches  
SGD  
TO-252  
(D-PAK)  
TO-92  
Absolute Maximum Ratings  
Drain-to-Source Voltage  
D
D
D
D
1
2
3
4
8
7
6
5
NC  
NC  
S
BVDSS  
BVDGS  
± 20V  
Drain-to-Gate Voltage  
Gate-to-Source Voltage  
G
Operating and Storage Temperature  
Soldering Temperature*  
-55°C to +150°C  
300°C  
top view  
SO-8  
* Distance of 1.6 mm from case for 10 seconds.  
Note: See Package Outline section for dimensions.  
12/19/01  
Supertex Inc. does not recommend the use of its products in life support applications and will not knowingly sell its products for use in such applications unless it receives an adequate "products liability  
indemnification insurance agreement." Supertex does not assume responsibility for use of devices described and limits its liability to the replacement of devices determined to be defective due to  
workmanship. No responsibility is assumed for possible omissions or inaccuracies. Circuitry and specifications are subject to change without notice. For the latest product specifications, refer to the  
Supertex website: http://www.supertex.com. For complete liability information on all Supertex products, refer to the most current databook or to the Legal/Disclaimer page on the Supertex website.  
TN2640  
Thermal Characteristics  
Package  
ID (continuous)*  
ID (pulsed)  
Power Dissipation  
θjc  
θja  
IDR  
*
IDRM  
@ TC = 25°C  
°C/W  
°C/W  
TO-92  
220mA  
260mA  
500mA  
2.0A  
2.0A  
3.0A  
1.0W  
1.3W†  
2.5W†  
125  
24  
170  
96†  
50  
220mA  
260mA  
500mA  
2.0A  
2.0A  
3.0A  
SO-8  
DPAK  
6.25  
* ID (continuous) is limited by max rated Tj.  
Mounted on FR4 board, 25mm x 25mm x 1.57mm.  
Electrical Characteristics (@ 25°C unless otherwise specified)  
Symbol  
Parameter  
Min  
Typ  
Max  
Unit  
Conditions  
Drain-to-Source  
Breakdown Voltage  
BVDSS  
400  
0.8  
V
VGS = 0V, ID = 1.0mA  
VGS(th)  
VGS(th)  
IGSS  
Gate Threshold Voltage  
2.0  
-4.0  
100  
10  
V
mV/°C  
nA  
VGS = VDS, ID= 2.0mA  
VGS = VDS, ID= 2.0mA  
VGS = ± 20V, VDS = 0V  
Change in VGS(th) with Temperature  
Gate Body Leakage  
-2.5  
IDSS  
Zero Gate Voltage Drain Current  
µA  
VGS = 0V, VDS = Max Rating  
1.0  
mA  
VGS = 0V, VDS = 0.8 Max Rating  
TA = 125°C  
ID(ON)  
ON-State Drain Current  
1.5  
2.0  
3.5  
4.0  
3.2  
3.0  
VGS = 5.0V, VDS = 25V  
A
V
GS = 10V, VDS = 25V  
VGS = 4.5V, ID = 500mA  
GS = 10V, ID = 500mA  
RDS(ON)  
5.0  
5.0  
Static Drain-to-Source  
ON-State Resistance  
V
RDS(ON)  
GFS  
CISS  
COSS  
CRSS  
td(ON)  
tr  
Change in RDS(ON) with Temperature  
Forward Transconductance  
Input Capacitance  
0.75  
%/°C  
VGS = 10V, ID = 500mA  
VDS = 25V, ID = 100mA  
200  
330  
180  
35  
m
225  
70  
25  
15  
20  
25  
27  
0.9  
VGS = 0V, VDS = 25V  
f = 1.0 MHz  
Common Source Output Capacitance  
Reverse Transfer Capacitance  
Turn-ON Delay Time  
pF  
7.0  
4.0  
15  
VDD = 25V,  
Rise Time  
ns  
ID = 2.0A,  
td(OFF)  
tf  
Turn-OFF Delay Time  
Fall Time  
20  
RGEN = 25Ω  
22  
VSD  
trr  
Diode Forward Voltage Drop  
Reverse Recovery Time  
V
VGS = 0V, ISD = 200mA  
VGS = 0V, ISD = 1.0A  
300  
ns  
Notes:  
1. All D.C. parameters 100% tested at 25°C unless otherwise stated. (Pulse test: 300µs pulse, 2% duty cycle.)  
2. All A.C. parameters sample tested.  
VDD  
Switching Waveforms and Test Circuit  
RL  
10V  
90%  
PULSE  
GENERATOR  
INPUT  
OUTPUT  
10%  
0V  
Rgen  
t(ON)  
td(ON)  
t(OFF)  
td(OFF)  
tr  
tF  
D.U.T.  
VDD  
0V  
INPUT  
10%  
10%  
OUTPUT  
90%  
90%  
2
TN2640  
Typical Performance Curves  
Output Characteristics  
Saturation Characteristics  
5.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
VGS = 10V  
6V  
8V  
4.0  
VGS = 10V  
8V  
4V  
3V  
3.0  
2.0  
1.0  
0
6V  
4V  
3V  
2V  
2V  
0
2
4
6
8
10  
0
0
0
10  
30  
40  
50  
20  
VDS (volts)  
VDS (volts)  
Transconductance vs. Drain Current  
Power Dissipation vs. Temperature  
2.0  
1.6  
1.2  
0.8  
0.4  
0
3.0  
2.4  
1.8  
1.2  
0.6  
0
DPAK  
V
= 25V  
DS  
SO-8  
T
= -55°C  
A
TO-92  
25°C  
125°C  
3.0  
4.0  
5.0  
0
25  
50  
75  
100  
125  
150  
1.0  
2.0  
ID (amperes)  
TC (°C)  
Maximum Rated Safe Operating Area  
Thermal Response Characteristics  
10  
1.0  
1.0  
0.8  
0.6  
0.4  
0.2  
0
TO-92 (pulsed)  
DPAK (DC)  
SO-8 (pulsed)  
TO-92 (DC)  
0.1  
SO-8 (DC)  
0.01  
0.001  
T
= 25°C  
TO-92  
C
T
= 25°C  
C
P
= 1.0W  
D
10  
100  
1000  
0.001  
0.01  
0.1  
1.0  
10  
VDS (volts)  
tp (seconds)  
3
TN2640  
Typical Performance Curves  
BVDSS Variation with Temperature  
On-Resistance vs. Drain Current  
1.15  
10  
8
V
= 5V  
GS  
1.10  
1.05  
1.00  
0.95  
V
= 10V  
6
GS  
4
2
0.9  
0.90  
0
-50  
0
50  
100  
150  
0
1.0  
2.0  
3.0  
4.0  
5.0  
150  
5
I
D (amperes)  
Tj (°C)  
Transfer Characteristics  
VTH and RDS Variation with Temperature  
3.0  
2.4  
1.8  
1.2  
0.6  
0
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
2.2  
1.8  
1.4  
1.0  
0.6  
0.2  
25°C  
V
@ 2mA  
(th)  
125°C  
TA = -55°C  
VDS = 25V  
R
@ 10V, 0.5A  
DS(ON)  
0
2
4
6
8
10  
-50  
0
50  
100  
VGS (volts)  
Tj (°C)  
Capacitance vs. Drain-to-Source Voltage  
f = 1MHz  
Gate Drive Dynamic Characteristics  
400  
10  
8
300  
200  
653pF  
6
V
= 10V  
V
DS  
C
ISS  
4
= 40V  
DS  
100  
0
2
0
C
OSS  
253pF  
1
C
RSS  
3
0
10  
20  
30  
40  
0
2
4
QG (nanocoulombs)  
VDS (volts)  
12/19/01rev.1  
1235 Bordeaux Drive, Sunnyvale, CA 94089  
TEL: (408) 744-0100 • FAX: (408) 222-4895  
www.supertex.com  
©2001 Supertex Inc. All rights reserved. Unauthorized use or reproduction prohibited.  

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