VP1310N3 [SUPERTEX]
P-Channel Enhancement-Mode Vertical DMOS FETs; P沟道增强型垂直DMOS场效应管型号: | VP1310N3 |
厂家: | Supertex, Inc |
描述: | P-Channel Enhancement-Mode Vertical DMOS FETs |
文件: | 总4页 (文件大小:31K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
VP1304
VP1306
VP1310
P-Channel Enhancement-Mode
Vertical DMOS FETs
Ordering Information
Order Number / Package
BVDSS
/
RDS(ON)
(max)
ID(ON)
(min)
BVDGS
TO-92
-40V
-60V
25Ω
25Ω
25Ω
-0.25A
-0.25A
-0.25A
VP1304N3
VP1306N3
VP1310N3
-100V
Features
Advanced DMOS Technology
Free from secondary breakdown
Low power drive requirement
Ease of paralleling
These enhancement-mode (normally-off) transistors utilize a
vertical DMOS structure and Supertex’s well-proven silicon-gate
manufacturing process. This combination produces devices with
the power handling capabilities of bipolar transistors and with the
high input impedance and positive temperature coefficient inher-
ent in MOS devices. Characteristic of all MOS structures, these
devices are free from thermal runaway and thermally-induced
secondary breakdown.
9
Low CISS and fast switching speeds
Excellent thermal stability
Integral Source-Drain diode
High input impedance and high gain
Supertex’s vertical DMOS FETs are ideally suited to a wide range
of switching and amplifying applications where high breakdown
voltage, high input impedance, low input capacitance, and fast
switching speeds are desired.
Complementary N- and P-channel devices
Applications
Package Options
Motor controls
Converters
Amplifiers
Switches
Power supply circuits
Drivers (relays, hammers, solenoids, lamps,
memories, displays, bipolar transistors, etc.)
S G D
Absolute Maximum Ratings
Drain-to-Source Voltage
TO-92
BVDSS
BVDGS
± 20V
Drain-to-Gate Voltage
Gate-to-Source Voltage
Operating and Storage Temperature
Soldering Temperature*
-55°C to +150°C
300°C
Note: See Package Outline section for dimensions.
* Distance of 1.6 mm from case for 10 seconds.
7-251
VP1304/VP1306/VP1310
Thermal Characteristics
Package
ID (continuous)*
ID (pulsed)
Power Dissipation
θjc
θja
IDR*
IDRM
@ TC = 25°C
°C/W
°C/W
TO-92
-0.15A
-0.65A
1.0W
125
170
-0.15A
-0.65A
* I (continuous) is limited by max rated T
T = 25°C
A
D
j.
Electrical Characteristics (@ 25°C unless otherwise specified)
Symbol
Parameter
Min
-100
-60
Typ
Max
Unit
Conditions
VP1310
VP1306
VP1304
BVDSS
Drain-to-Source
V
ID = -1mA, VGS = 0V
Breakdown Voltage
-40
VGS(th)
∆VGS(th)
IGSS
Gate Threshold Voltage
-1.5
-3.5
-3.85
-100
-10
V
mV/°C
nA
VGS = VDS, ID = -1mA
VGS = VDS, ID = -1mA
VGS = ±20V, VDS = 0V
Change in VGS(th) with Temperature
Gate Body Leakage
-3.2
-0.1
IDSS
Zero Gate Voltage Drain Current
VGS = 0V, VDS = Max Rating
-500
µA
VGS = 0V, VDS = 0.8 Max Rating
TA = 125°C
ID(ON)
ON-State Drain Current
-0.08
-0.25
-0.23
-0.7
32
19
0.8
120
20
12
3
VGS = -5V, VDS = -25V
VGS = -10V, VDS = -25V
VGS = -5V, ID = -50mA
VGS = -10V, ID = -250mA
VGS = -10V, ID = -250mA
VDS = -25V, ID = -200mA
A
RDS(ON)
40
25
Static Drain-to-Source
ON-State Resistance
Ω
∆RDS(ON)
GFS
CISS
COSS
CRSS
td(ON)
tr
Change in RDS(ON) with Temperature
Forward Transconductance
Input Capacitance
1.1
%/°C
Ω
75
m
35
15
5
VGS = 0V, VDS = -25V
Common Source Output Capacitance
Reverse Transfer Capacitance
Turn-ON Delay Time
pF
ns
f = 1 MHz
3
5
VDD = -25V
Rise Time
3
5
ID = -250mA
td(OFF)
tf
Turn-OFF Delay Time
Fall Time
3
5
R
GEN = 25Ω
3
8
VSD
Diode Forward Voltage Drop
Reverse Recovery Time
-1.2
350
-1.7
V
ISD = -0.25A, VGS = 0V
ISD = -0.25A, VGS = 0V
trr
ns
Notes:
1. All D.C. parameters 100% tested at 25°C unless otherwise stated. (Pulse test: 300µs pulse, 2% duty cycle.)
2. All A.C. parameters sample tested.
Switching Waveforms and Test Circuit
0V
10%
PULSE
GENERATOR
INPUT
90%
-10V
Rgen
t(ON)
td(ON)
t(OFF)
td(OFF)
tr
tF
D.U.T.
OUTPUT
0V
INPUT
90%
90%
RL
OUTPUT
VDD
10%
10%
VDD
7-252
VP1304/VP1306/VP1310
Typical Performance Curves
Output Characteristics
Saturation Characteristics
-1.0
-0.5
-0.4
-0.3
-0.2
-0.1
0
V
= -10V
GS
-0.8
-0.6
-0.4
-0.2
0
V
= -10V
GS
-8V
-6V
-8V
-6V
-4V
-3V
-4V
-3V
0
-2
-4
-6
-8
-10
0
-10
-20
-30
-40
-50
-1.0
-100
VDS (volts)
VDS (volts)
Transconductance vs. Drain Current
VDS = -25V
Power Dissipation vs. Ambient Temperature
0.2
2.5
2.0
1.5
1.0
0.5
0
9
T = -55°C
A
T
T
= 25°C
A
A
0.1
= 125°C
TO-92
0
0
-0.2
-0.4
-0.6
-0.8
0
25
50
75
100
125
150
ID (amperes)
TC (°C)
Maximum Rated Safe Operating Area
Thermal Response Characteristics
-10
-1.0
1.0
TO-92 (pulsed)
0.5
TO-92 (DC)
-0.1
TO-92
T
= 25°C
P
T
= 1W
A
D
C
= 25°C
-0.01
0
0.001
0.01
0.1
1.0
10
-0.1
-1.0
-10
tp (seconds)
VDS (volts)
7-253
VP1304/VP1306/VP1310
Typical Performance Curves
BVDSS Variation with Temperature
On-Resistance vs. Drain Current
100
80
60
40
20
0
1.1
1.0
0.9
V
= -5V
GS
V
= -10V
GS
-50
0
50
100
150
0
-50
0
-0.2
-0.4
-0.6
-0.8
-1.0
I
D (amperes)
Tj (°C)
Transfer Characteristics
V(th) and RDS Variation with Temperature
2.0
1.6
1.2
0.8
0.4
0
-1.0
-0.8
-0.6
-0.4
-0.2
0
R
@ -10V, -0.25A
DS(ON)
1.2
1.1
1.0
0.9
0.8
V
= -25V
DS
T
= -55°C
A
25°C
125°C
V
@ -1mA
(th)
0
-2
-4
-6
-8
-10
0
50
100
150
V
GS (volts)
Tj (°C)
Capacitance vs. Drain-to-Source Voltage
f = 1MHz
Gate Drive Dynamic Characteristics
VDS = -10V
40
30
20
10
0
-10
-8
-6
-4
-2
0
CISS
VDS
40 pF
= -40V
COSS
25 pF
0.1
CRSS
0.2
0.3
0
-10
-20
-30
-40
0.4
0.5
QG (nanocoulombs)
VDS (volts)
7-254
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