C1-6N8-10 [SUPERWORLD]
CERAMIC CHIP INDUCTORS;型号: | C1-6N8-10 |
厂家: | SUPERWORLD ELECTRONICS |
描述: | CERAMIC CHIP INDUCTORS |
文件: | 总8页 (文件大小:384K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CERAMIC CHIP INDUCTORS
C1 SERIES
1. PART NO. EXPRESSION :
(a) Series code
(c) Inductance Tolerence : S=± 0.3nH , J=± 5% , K=± 10%
(d) 10: Standard
C 1 - 1 N 0 S - □□
(c)
(a)
(b)
(d)
(b) Inductance code : 1N0 = 1.0nH
11 ~ 99 : Internal control number
2. C0NFIGURATION & DIMENSIONS :
A
B
D
L
G
Recommended PC Board Pattern
Unit:m/m
L
A
B
C
D
G
H
1.00± 0.05 0.50± 0.05 0.50± 0.05 0.25± 0.10 0.45~0.55 0.45~0.55
1.50
3. SCHEMATIC :
4. MATERIALS :
a
b
Ag(100%)
(a) Body : ceramic ( Pb Free )
(b) Termination : ( Pb Free )
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
5. GENERAL SPECIFICATION :
a) Operating temp. : -40° C to +105° C ( including self-temperature. rise )
b) Storage condition (component in its packaging)
i) Temperature : -10 to 40° C
ii) Humidity : 60%
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 1
SUPERWORLD ELECTRONICS (S) PTE LTD
CERAMIC CHIP INDUCTORS
C1 SERIES
6. ELECTRICAL CHARACTERISTICS :
SRF
DC Resistance
Rated Current
(mA) Max
Inductance
(nH)
Test Frequency
( MHz )
Q
Q(Typ.) Frequency(MHz)
( Ω )
( MHz )
Min
Part Number
Min
100 300 500 800 1000
Typ.
0.04
Max.
Typ.
10000 >13000
10000 >13000
6000 >13000
0.08
0.09
0.10
0.12
0.12
0.13
0.13
0.13
0.16
0.16
0.20
0.21
0.20
0.21
0.21
0.23
0.25
0.25
0.25
0.28
0.30
0.31
0.40
0.46
0.55
0.60
0.70
0.80
0.90
1.00
1.00
1.20
1.30
1.50
300
300
300
300
300
300
300
300
300
300
300
300
300
C1-1N0S-10
C1-1N2S-10
C1-1N5S-10
C1-1N8S-10
C1-2N0S-10
C1-2N2S-10
C1-2N4S-10
C1-2N7S-10
C1-3N0S-10
C1-3N3S-10
C1-3N6S-10
C1-3N9S-10
C1-4N3S-10
C1-4N7S-10
C1-5N1S-10
C1-5N6S-10
C1-6N2S-10
C1-6N8□-10
C1-7N5□-10
C1-8N2□-10
C1-9N1□-10
C1-10N□-10
C1-12N□-10
C1-15N□-10
C1-18N□-10
C1-22N□-10
C1-27N□-10
C1-33N□-10
C1-39N□-10
C1-47N□-10
C1-56N□-10
C1-68N□-10
C1-82N□-10
C1-R10□-10
1.0
1.2
1.5
1.8
2.0
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
11
11
11
11
11
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
25
25
24
23
21
18
18
18
18
18
18
18
18
18
18
18
18
18
18
18
34
35
33
30
27
25
24
24
24
24
24
24
24
24
24
24
24
23
23
23
43
44
44
36
34
31
31
31
31
31
31
31
31
31
31
30
30
29
29
29
29
29
29
28
28
26
25
23
23
21
18
18
15
12
52
52
48
42
39
36
35
34
35
35
35
35
35
34
34
35
34
32
32
31
31
31
31
30
30
27
26
22
21
18
16
11
6
0.04
0.05
0.06
0.06
0.07
0.07
0.08
0.09
0.10
0.11
0.12
0.12
0.12
0.13
0.15
0.16
0.17
0.18
0.21
0.22
0.23
0.28
0.31
0.35
0.42
0.47
0.50
0.52
0.58
0.61
0.70
0.81
0.94
6000
6000
6000
6000
6000
6000
6000
5000
4000
4000
4000
11000
10500
10000
9500
9000
8500
8000
7500
7000
6500
6000
300
300
4000
4000
3900
5800
5700
5600
300
300
300
300
300
300
300
300
300
300
300
300
200
200
200
200
180
150
150
3900
3700
3600
3400
3200
2700
2300
2100
1900
1600
1300
1200
1000
750
5500
5200
4900
4500
4300
3900
3500
3100
2800
2300
1900
1700
1500
1300
1200
1100
1000
8
8
8
8
8
8
8
8
8
8
8
8
8
8
10
10
11
11
11
11
11
11
11
11
11
11
10
10
18
18
18
18
18
17
17
16
16
16
16
15
14
14
23
23
23
23
23
22
21
20
20
19
18
17
16
14
12
15
18
22
27
33
39
47
56
750
68
600
82
600
-
100
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 2
SUPERWORLD ELECTRONICS (S) PTE LTD
CERAMIC CHIP INDUCTORS
C1 SERIES
SRF
DC Resistance
Rated Current
(mA) Max
Inductance
(nH)
Test Frequency
( MHz )
Q
Q(Typ.) Frequency(MHz)
( Ω )
( MHz )
Part Number
Min
100 300 500 800 1000
Max.
Typ.
1.10
2.57
2.97
3.29
3.92
Min
Typ.
800
150
140
130
120
110
600
550
500
450
400
8
8
8
8
8
10
12
12
12
12
12
17
16
16
14
10
17
-
-
-
-
-
-
-
-
-
-
-
1.60
3.20
3.70
4.20
4.80
C1-R12□-10
C1-R15□-10
C1-R18□-10
C1-R22□-10
C1-R27□-10
120
150
180
220
270
100
100
100
100
100
920
810
700
600
-
-
Inductance Tolerence : □
J=± 5%
K=± 10%
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 3
SUPERWORLD ELECTRONICS (S) PTE LTD
CERAMIC CHIP INDUCTORS
C1 SERIES
7. CHARACTERISTICS CURVES :
Impedance v.s. Frequency Characteristics
10000
1000
100n
100
47n
10
22n
1
10n
6.8n
0. 1
1
10
100
1 000
10000
FREQUENCY(MHz)
Inductance v.s. Frequency Characteristics
1000
100n
100
10
1
47n
22n
10n
6.8n
1
10
100
1000
1 0000
FREQUENCY(MHz)
Q v.s. Frequency Characteristics
100
10
1
6.8n
10n
22n
47n
100n
1
10
100
1000
10000
FREQUENCY(MHz)
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
CERAMIC CHIP INDUCTORS
C1 SERIES
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
Unit:m/m
H
L
G
L
G
1.50
0.45~0.55
0.45~0.55
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
8-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
8-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)
8-2.2 Soldering Iron :
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a
soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.
Note :
d) 1.0mm tip diameter (max)
a) Preheat circuit and products to 150° C.
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 4-5 secs.
b) 350° C tip temperature for Ferrite chip bead (max)
c) Never contact the ceramic with the iron tip
Preheating
Soldering
20~40s
Natural
cooling
Preheating
Soldering
Natural
cooling
350
150
TP(260° C/40s max.)
217
200
150
60~150s
60~180s
480s max.
25
Gradual
Cooling
Time(sec.)
Over 60s.
Figure 1. Re-flow Soldering:3 times max
Within4~5s
Figure 2. Wave Soldering:1 times max
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 5
SUPERWORLD ELECTRONICS (S) PTE LTD
CERAMIC CHIP INDUCTORS
C1 SERIES
8-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3.
Minimum fillet height = soldering thickness + 25% product height
Upper limit
ReC0mmendable
Figure 3
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 6
SUPERWORLD ELECTRONICS (S) PTE LTD
CERAMIC CHIP INDUCTORS
C1 SERIES
9. PACKAGING INFORMATION :
9-1. Reel Dimension
A
2± 0.5
R1.9
120°
13.5± 0.5
R10.5
R0.5
7" x 8mm
Type
A(mm)
B(mm)
60± 2
C(mm)
D(mm)
7" x 8mm
9.0± 0.5
13.5± 0.5 178.0± 2.0
9-2 Tape Dimension / 8mm
Material : Paper
D:1.56+0.1-0.05
Po:4± 0.1
P2:2± 0.10
t
Size
C1
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
1.15± 0.10 0.65± 0.10 0.80 max
2.0± 0.05
0.80 max
Ao
Ko
P
9-3. Packaging Quantity
C1
Chip Size
Chip / Reel
Inner Box
Middle Box
Carton
10000
50000
250000
500000
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 7
SUPERWORLD ELECTRONICS (S) PTE LTD
CERAMIC CHIP INDUCTORS
C1 SERIES
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° C to 180° C
Room Temp.
(° C)
Room Humidity
(%)
Room atm Tearing Speed
Top cover tape
(hPa)
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Recommended products should be used within 12 months from the time of delivery.
b) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 8
SUPERWORLD ELECTRONICS (S) PTE LTD
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