C1HQ-1N0S-10 [SUPERWORLD]
CERAMIC CHIP INDUCTORS;
| 型号： | C1HQ-1N0S-10 |
| 厂家： | 
SUPERWORLD ELECTRONICS |
| 描述： | CERAMIC CHIP INDUCTORS |
| 文件： | 总7页 (文件大小：182K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CERAMIC CHIP INDUCTORS
C1HQ SERIES
1. PART NO. EXPRESSION :
(d) Inductance Tolerence : S=± 0.3nH , J=± 5% , K=± 10%
(e) 10: Standard
(a) Series code
C 1 H Q - 1 N 0 S - □□
(c)
(b) Category Code
(a) (b)
(d) (e)
(c) Inductance code : 1N0 = 1.0nH
11 ~ 99 : Internal control number
2. C0NFIGURATION & DIMENSIONS :
A
D
B
L
G
Recommended PC Board Pattern
Unit:m/m
H
A
B
C
D
L
G
1.00± 0.05 0.60± 0.10 0.50± 0.05 0.175± 0.075 1.55 Ref. 0.50~0.55 0.60~0.70
3. SCHEMATIC :
4. MATERIALS :
a
b
Ag(100%)
(a) Body : ceramic ( Pb Free )
(b) Termination : ( Pb Free )
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
5. GENERAL SPECIFICATION :
a) Operating temp. : -40° C to +105° C ( including self-temperature. rise )
b) Storage condition (component in its packaging)
i) Temperature : -10 to 40° C
ii) Humidity : 60%
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
28.01.2015
PG. 1
SUPERWORLD ELECTRONICS (S) PTE LTD
CERAMIC CHIP INDUCTORS
C1HQ SERIES
6. ELECTRICAL CHARACTERISTICS :
SRF
DC Resistance
Rated Current
(mA) Max
Inductance
(nH)
Test Frequency
( MHz )
Q
Q(Typ.) Frequency(MHz)
( Ω )
( MHz )
Part Number
Min
300 800 900 1500 1800
Typ.
0.014
0.016
0.030
0.035
0.035
0.040
0.050
0.060
0.070
0.075
0.080
0.085
0.090
0.095
0.110
0.120
0.130
0.130
0.135
0.140
0.150
0.165
0.165
0.190
Max. Typ. Min.
>13000 10000
>13000 10000
>13000 8000
0.07
710
710
710
710
660
660
630
630
570
540
500
490
470
C1HQ-1N0S-10
C1HQ-1N2S-10
C1HQ-1N5S-10
C1HQ-1N8S-10
C1HQ-2N0S-10
C1HQ-2N2S-10
C1HQ-2N4S-10
C1HQ-2N7S-10
C1HQ-3N0S-10
C1HQ-3N3S-10
C1HQ-3N6S-10
C1HQ-3N9S-10
C1HQ-4N3S-10
C1HQ-4N7S-10
C1HQ-5N1S-10
C1HQ-5N6S-10
C1HQ-6N2S-10
C1HQ-6N8S-10
C1HQ-7N5S-10
C1HQ-8N2S-10
C1HQ-9N1S-10
C1HQ-10NS-10
C1HQ-12NS-10
C1HQ-15NS-10
1.0
1.2
1.5
1.8
2.0
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
53 129 147 217 244
0.07
0.07
0.07
0.08
0.08
0.09
0.09
0.11
0.12
0.14
0.15
0.16
0.17
0.19
0.20
0.22
0.23
0.25
0.27
0.29
0.31
0.39
0.45
45
35
32
38
37
34
30
31
32
33
34
29
30
30
30
31
28
28
29
29
28
26
25
97 110 156 177
76 104 116
69
61
68
67
54
49
51
54
53
53
47
48
48
48
49
44
45
46
45
45
40
38
11000
10500
10000
9600
9200
8700
8300
7800
7300
6900
6400
6000
6000
6000
6000
6000
6000
6000
5000
4000
4000
4000
66
73
71
59
52
54
57
56
56
50
51
51
51
52
49
50
50
49
48
45
42
92 100
94 103
92 101
74
67
70
72
71
70
64
65
64
65
66
59
60
62
59
57
51
49
86
73
76
79
77
76
71
72
71
71
72
64
65
66
62
60
52
51
450
430
6300
6200
6100
4000
4000
3900
420
400
390
370
360
350
330
300
280
6000
5500
5000
4800
4500
4300
4100
3900
3700
3600
3400
3200
2700
2300
12
15
Inductance Tolerence : S=± 0.3nH , J=± 5% , K=± 10%
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
28.01.2015
PG. 2
SUPERWORLD ELECTRONICS (S) PTE LTD
CERAMIC CHIP INDUCTORS
C1HQ SERIES
7. CHARACTERISTICS CURVES :
Impedance v.s. Frequency Characteristics
1000
100
15n
10
1
8.2n
4.7n
2.7n
1.5n
0. 1
1
10
100
1000
10000
FREQUENCY(MHz)
Inductance v.s. Frequency Characteristics
100
15n
8.2n
10
4.7n
2.7n
1.5n
1
1
10
100
1000
10000
FREQUENCY(MHz)
Q v.s. Frequency Characteristics
100
10
1.5n
15n
4.7n
1
1
10
100
1000
10000
FR EQUENCY(MHz)
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
28.01.2015
PG. 3
SUPERWORLD ELECTRONICS (S) PTE LTD
CERAMIC CHIP INDUCTORS
C1HQ SERIES
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
Unit:m/m
H
L
G
L
G
1.55
0.50~0.55
0.60~0.70
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
8-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
8-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
8-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process Control limitations. In the event that
a soldering iron must be employed the following precautions are reCommended.
Note :
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 4 ~ 5 secs.
a) Preheat circuit and products to 150° C.
b) 350° C tip temperature (max)
c) Never Contact the ceramic with the iron tip
Preheating
Soldering
20~40s
Natural
Cooling
Preheating
Soldering
Natural
Cooling
W i thi n 4~5s
350
150
TP(260° C/40s max.)
217
200
150
60~150s
60~180s
480s max.
25
Time(sec.)
Gradual
C0oling
Over 1min.
Figure 1. Re-flow Soldering : 3 times max
Figure 2. Hand Soldering : 1 times max
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
28.01.2015
PG. 4
SUPERWORLD ELECTRONICS (S) PTE LTD
CERAMIC CHIP INDUCTORS
C1HQ SERIES
8-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3.
Minimum fillet height = soldering thickness + 25% product height
Upper limit
ReC0mmendable
Figure 3
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
28.01.2015
PG. 5
SUPERWORLD ELECTRONICS (S) PTE LTD
CERAMIC CHIP INDUCTORS
C1HQ SERIES
9. PACKAGING INFORMATION :
9-1. Reel Dimension
COVER TAPE
2.0± 0.5
A
EMBOSSED CARRIER
Type
A(mm)
B(mm)
C(mm)
D(mm)
7" x 8mm
10± 1.5 50 or more 13± 0.2 178.0± 2.0
9-2 Tape Dimension / 8mm
Material : Paper
D:1.56+0.1-0.05
Po:4± 0.1
P2:2± 0.10
t
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
C1HQ
1.15± 0.10 0.75± 0.10 0.80 max
2.0± 0.05
0.80 max
Ao
Ko
P
9-3. Packaging Quantity
C1HQ
10000
50000
250000
500000
Chip Size
Chip / Reel
Inner Box
Middle Box
Carton
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
28.01.2015
PG. 6
SUPERWORLD ELECTRONICS (S) PTE LTD
CERAMIC CHIP INDUCTORS
C1HQ SERIES
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° C to 180° C
Room Temp.
(° C)
Room Humidity
(%)
Room atm Tearing Speed
Top cover tape
(hPa)
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Recommended products should be used within 12 months from the time of delivery.
b) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
28.01.2015
PG. 7
SUPERWORLD ELECTRONICS (S) PTE LTD
相关型号：
©2020 ICPDF网 联系我们和版权申明