L2-1R0-10 [SUPERWORLD]

FERRITE CHIP INDUCTORS;
L2-1R0-10
型号: L2-1R0-10
厂家: SUPERWORLD ELECTRONICS    SUPERWORLD ELECTRONICS
描述:

FERRITE CHIP INDUCTORS

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FERRITE CHIP INDUCTORS  
L2 SERIES  
1. PART NO. EXPRESSION :  
(a) Series code  
(c) Tolerance code : K = ± 10%, M = ± 20%  
L 2 - 4 7 N K - □□  
(a)  
(b) (c) (d)  
(g) 10: Standard  
(b) Inductance code : 47N = 0.047uH  
11 ~ 99 : Internal control number  
2. CONFIGURATION & DIMENSIONS :  
A
D
B
L
G
Recommended PC Board Pattern  
Unit:m/m  
A
B
C
D
G
H
L
1.60± 0.15  
1.80± 0.15  
0.80± 0.15 0.80± 0.15 0.30± 0.20 0.60 Ref.  
0.80 Ref.  
2.60 Ref.  
3. SCHEMATIC :  
4. MATERIALS :  
a
b
Ag(100%)  
(a) Body : Ferrite  
Ni(100%)-1.5um(min.)  
Sn(100%)-3.0um(min.)  
(b) Termination : Ag/Ni/Sn  
5. GENERAL SPECIFICATION :  
a) Operating temp. : -40° C to +105° C ( including self-temperature. rise )  
b) Storage condition (component in its packaging)  
i) Temperature : -10 to 40° C  
ii) Humidity : 60%  
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.  
26.01.2015  
PG. 1  
SUPERWORLD ELECTRONICS (S) PTE LTD  
FERRITE CHIP INDUCTORS  
L2 SERIES  
6. ELECTRICAL CHARACTERISTICS :  
Dim. A  
Test  
SRF  
( MHz )  
Min.  
DC Resistance  
Rated Current  
( mA )  
Inductance  
Q
Frequency  
( MHz )  
( )  
Part Number  
( mm )  
± 0.15  
( μH )  
Min.  
Max.  
Max.  
L2-47N-10  
L2-68N-10  
L2-82N-10  
L2-R10-10  
L2-R12-10  
L2-R15-10  
L2-R18-10  
L2-R22-10  
L2-R27-10  
L2-R33-10  
L2-R39-10  
L2-R47-10  
L2-R56-10  
L2-R68-10  
L2-R82-10  
L2-1R0-10  
L2-1R2-10  
L2-1R5-10  
L2-1R8-10  
L2-2R2-10  
L2-2R7-10  
L2-3R3-10  
L2-3R9-10  
L2-4R7-10  
L2-100-10  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.60  
1.80  
0.047  
0.068  
0.082  
0.100  
0.120  
0.150  
0.180  
0.220  
0.270  
0.330  
0.390  
0.470  
0.560  
0.680  
0.820  
1.000  
1.200  
1.500  
1.800  
2.200  
2.700  
3.300  
3.900  
4.700  
10.000  
10  
10  
10  
15  
15  
15  
15  
15  
15  
15  
15  
15  
15  
15  
15  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
50  
50  
50  
25  
25  
25  
25  
25  
25  
25  
25  
25  
25  
25  
25  
10  
10  
10  
10  
10  
10  
10  
10  
10  
2
260  
250  
245  
240  
205  
180  
165  
150  
136  
125  
110  
105  
95  
0.30  
0.30  
0.30  
0.50  
0.50  
0.60  
0.60  
0.80  
0.80  
0.85  
1.00  
1.35  
1.55  
1.70  
2.10  
0.60  
0.80  
0.80  
0.95  
1.15  
1.35  
1.55  
1.70  
2.10  
2.55  
50  
50  
50  
50  
50  
50  
50  
50  
50  
35  
35  
35  
35  
35  
35  
25  
25  
25  
25  
15  
15  
15  
15  
15  
15  
80  
75  
70  
60  
55  
50  
45  
40  
38  
36  
33  
17  
Inductance tolerance :  
: K : ±10%  
L : ± 15%  
M : ± 20%  
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.  
26.01.2015  
PG. 2  
SUPERWORLD ELECTRONICS (S) PTE LTD  
FERRITE CHIP INDUCTORS  
L2 SERIES  
7. IMPEDANCE VS. FREQUENCY CURVES :  
L vs IDC  
100  
10 0  
10  
1
4R7  
1 R2  
R12  
0.1  
1
10  
1 00  
1000  
DC Current(m A )  
Q vs Freq.  
FCI160 8F-Se ries Q vs Freq.  
1 20  
1 00  
80  
R1 0  
1 R5  
1R0  
60  
40  
4R7  
10 0  
20  
0
1
10  
100  
FREQUENCY(MHz)  
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.  
26.01.2015  
PG. 3  
SUPERWORLD ELECTRONICS (S) PTE LTD  
FERRITE CHIP INDUCTORS  
L2 SERIES  
8. SOLDERING AND MOUNTING :  
8-1. Recommended PC Board Pattern  
2.60  
PC board should be designed so that products can prevent damage from  
mechanical stress when warping the board.  
0.60  
8-2. Soldering  
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering  
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.  
Note.  
If wave soldering is used ,there will be some risk.  
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk  
8-2.1 Lead Free Solder Re-flow :  
Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)  
8-2.2 Soldering Iron :  
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a  
soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.  
Note :  
a) Preheat circuit and products to 150° C.  
d) 1.0mm tip diameter (max)  
e) Use a 20 watt soldering iron with tip diameter of 1.0mm  
f) Limit soldering time to 4-5 secs.  
b) 350° C tip temperature for Ferrite chip bead (max)  
c) Never contact the ceramic with the iron tip  
Preheating  
Soldering  
20~40s  
Natural  
cooling  
Preheating  
Soldering  
Natural  
cooling  
350  
150  
TP(260° C/40s max.)  
217  
200  
150  
60~150s  
60~180s  
480s max.  
25  
Gradual  
Cooling  
Time(sec.)  
Over 60s.  
Figure 1. Re-flow Soldering:3 times max  
Within4~5s  
Figure 2. Wave Soldering:1 times max  
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.  
26.01.2015  
PG. 4  
SUPERWORLD ELECTRONICS (S) PTE LTD  
FERRITE CHIP INDUCTORS  
L2 SERIES  
8-3. Solder Volume  
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume  
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3.  
Minimum fillet height = soldering thickness + 25% product height  
Upper limit  
ReC0mmendable  
Figure 3  
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.  
26.01.2015  
PG. 5  
SUPERWORLD ELECTRONICS (S) PTE LTD  
FERRITE CHIP INDUCTORS  
L2 SERIES  
9. PACKAGING INFORMATION :  
9-1. Reel Dimension  
A
Type  
A(mm)  
B(mm)  
C(mm)  
D(mm)  
7" x 8mm  
9.0± 0.5 60.0± 2.0 13.5± 0.5 178.0± 2.0  
7" x 12mm 13.5± 0.5 60.0± 2.0 13.5± 0.5 178.0± 2.0  
2± 0.5  
13.5± 0.5  
7" x 8mm  
7" x 12mm  
R10.5  
R0.5  
R1.9  
120°  
9-2.1 Tape Dimension / 8mm  
Material of taping is paper  
Po:4± 0.1  
D:1.5+0.1/-0.0  
t
Size  
0
Bo(mm)  
Ao(mm)  
Ko(mm)  
0.50max  
P(mm)  
t(mm)  
0.68± 0.05 0.38± 0.05  
2.0± 0.05  
0.50max  
Ko  
P
Ao  
Po:4± 0.1  
+0.1  
-0.05  
P2:2± 0.1  
D:1.56  
t
Size  
1
Bo(mm)  
1.12± 0.03  
1.85± 0.05  
2.30± 0.05  
Ao(mm)  
0.62± 0.03  
1.05± 0.05  
1.50± 0.05  
Ko(mm)  
P(mm)  
t(mm)  
0.60± 0.03 2.0± 0.10 0.60± 0.03  
0.95± 0.05 4.0± 0.10 0.95± 0.05  
0.95± 0.05 4.0± 0.10 0.95± 0.05  
2
3(09)  
Ko  
Ao  
P
Material of taping is plastic  
Size  
2(08)  
3(09)  
3(12)  
4(11)  
5
Bo(mm)  
Ao(mm)  
Ko(mm)  
P(mm)  
t(mm)  
D1(mm)  
none  
D:1.5+0.1  
A
Po:4± 0.1  
t
P2:2± 0.05  
1.95± 0.10 1.05± 0.10 1.05± 0.10 4.0± 0.10 0.23± 0.05  
2.25± 0.10 1.42± 0.10 1.04± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10  
2.35± 0.10 1.50± 0.10 1.45± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10  
3.50± 0.10 1.88± 0.10 1.27± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10  
3.42± 0.10 2.77± 0.10 1.55± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10  
3.40± 0.10 1.77± 0.10 1.04± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10  
Ao  
Ko  
P
A
4(09)  
Section A-A  
D1:1± 0.1  
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.  
26.01.2015  
PG. 6  
SUPERWORLD ELECTRONICS (S) PTE LTD  
FERRITE CHIP INDUCTORS  
L2 SERIES  
9-2.2 Tape Dimension / 12mm  
Po:4± 0.1  
P2:2± 0.05  
t
D:1.5+0.1  
A
Series  
Z / L  
Size  
6
Bo(mm)  
4.95± 0.1  
4.95± 0.1  
Ao(mm)  
1.93± 0.1  
3.66± 0.1  
Ko(mm)  
1.93± 0.1  
1.85± 0.1  
P(mm)  
4.0± 0.1  
8.0± 0.1  
t(mm)  
D1(mm)  
1.5± 0.1  
1.5± 0.1  
0.24± 0.05  
0.24± 0.05  
7
P
Ao  
Ko  
A
D1:1.5± 0.1  
Section A-A  
9-3. Packaging Quantity  
Chip Size  
Chip / Reel  
Inner Box  
Middle Box  
Carton  
7
6
5
4(11)  
4(09)  
3(12)  
3(09)  
4000  
2
1
0
1000  
4000  
20000  
40000  
2000  
2500  
3000  
15000  
75000  
150000  
3000  
15000  
75000  
2000  
10000  
50000  
100000  
4000  
10000  
50000  
250000  
500000  
15000  
75000  
375000  
750000  
8000  
40000  
80000  
12500  
62500  
125000  
20000  
100000  
200000  
20000  
100000  
200000  
150000  
9-4. Tearing Off Force  
The force for tearing off cover tape is 15 to 60 grams  
in the arrow direction under the following conditions.  
F
165° C to 180° C  
Room Temp.  
(° C)  
Room Humidity  
(%)  
Room atm Tearing Speed  
Top cover tape  
(hPa)  
(mm/min)  
5~35  
45~85  
860~1060  
300  
Base tape  
Application Notice  
1. Storage Conditions :  
To maintain the solderabililty of terminal electrodes :  
a) Recommended products should be used within 12 months from the time of delivery.  
b) The packaging material should be kept where no chlorine or sulfur exists in the air.  
2. Transportation :  
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.  
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.  
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.  
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.  
26.01.2015  
PG. 7  
SUPERWORLD ELECTRONICS (S) PTE LTD  

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