L2-1R0-10 [SUPERWORLD]
FERRITE CHIP INDUCTORS;型号: | L2-1R0-10 |
厂家: | SUPERWORLD ELECTRONICS |
描述: | FERRITE CHIP INDUCTORS |
文件: | 总7页 (文件大小:266K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
FERRITE CHIP INDUCTORS
L2 SERIES
1. PART NO. EXPRESSION :
(a) Series code
(c) Tolerance code : K = ± 10%, M = ± 20%
L 2 - 4 7 N K - □□
(a)
(b) (c) (d)
(g) 10: Standard
(b) Inductance code : 47N = 0.047uH
11 ~ 99 : Internal control number
2. CONFIGURATION & DIMENSIONS :
A
D
B
L
G
Recommended PC Board Pattern
Unit:m/m
A
B
C
D
G
H
L
1.60± 0.15
1.80± 0.15
0.80± 0.15 0.80± 0.15 0.30± 0.20 0.60 Ref.
0.80 Ref.
2.60 Ref.
3. SCHEMATIC :
4. MATERIALS :
a
b
Ag(100%)
(a) Body : Ferrite
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
(b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION :
a) Operating temp. : -40° C to +105° C ( including self-temperature. rise )
b) Storage condition (component in its packaging)
i) Temperature : -10 to 40° C
ii) Humidity : 60%
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 1
SUPERWORLD ELECTRONICS (S) PTE LTD
FERRITE CHIP INDUCTORS
L2 SERIES
6. ELECTRICAL CHARACTERISTICS :
Dim. A
Test
SRF
( MHz )
Min.
DC Resistance
Rated Current
( mA )
Inductance
Q
Frequency
( MHz )
( Ω )
Part Number
( mm )
± 0.15
( μH )
Min.
Max.
Max.
L2-47N□-10
L2-68N□-10
L2-82N□-10
L2-R10□-10
L2-R12□-10
L2-R15□-10
L2-R18□-10
L2-R22□-10
L2-R27□-10
L2-R33□-10
L2-R39□-10
L2-R47□-10
L2-R56□-10
L2-R68□-10
L2-R82□-10
L2-1R0□-10
L2-1R2□-10
L2-1R5□-10
L2-1R8□-10
L2-2R2□-10
L2-2R7□-10
L2-3R3□-10
L2-3R9□-10
L2-4R7□-10
L2-100□-10
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.60
1.80
0.047
0.068
0.082
0.100
0.120
0.150
0.180
0.220
0.270
0.330
0.390
0.470
0.560
0.680
0.820
1.000
1.200
1.500
1.800
2.200
2.700
3.300
3.900
4.700
10.000
10
10
10
15
15
15
15
15
15
15
15
15
15
15
15
30
30
30
30
30
30
30
30
30
30
50
50
50
25
25
25
25
25
25
25
25
25
25
25
25
10
10
10
10
10
10
10
10
10
2
260
250
245
240
205
180
165
150
136
125
110
105
95
0.30
0.30
0.30
0.50
0.50
0.60
0.60
0.80
0.80
0.85
1.00
1.35
1.55
1.70
2.10
0.60
0.80
0.80
0.95
1.15
1.35
1.55
1.70
2.10
2.55
50
50
50
50
50
50
50
50
50
35
35
35
35
35
35
25
25
25
25
15
15
15
15
15
15
80
75
70
60
55
50
45
40
38
36
33
17
Inductance tolerance :
□ : K : ±10%
L : ± 15%
M : ± 20%
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 2
SUPERWORLD ELECTRONICS (S) PTE LTD
FERRITE CHIP INDUCTORS
L2 SERIES
7. IMPEDANCE VS. FREQUENCY CURVES :
L vs IDC
100
10 0
10
1
4R7
1 R2
R12
0.1
1
10
1 00
1000
DC Current(m A )
Q vs Freq.
FCI160 8F-Se ries Q vs Freq.
1 20
1 00
80
R1 0
1 R5
1R0
60
40
4R7
10 0
20
0
1
10
100
FREQUENCY(MHz)
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 3
SUPERWORLD ELECTRONICS (S) PTE LTD
FERRITE CHIP INDUCTORS
L2 SERIES
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
2.60
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
0.60
8-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
8-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)
8-2.2 Soldering Iron :
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a
soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.
Note :
a) Preheat circuit and products to 150° C.
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 4-5 secs.
b) 350° C tip temperature for Ferrite chip bead (max)
c) Never contact the ceramic with the iron tip
Preheating
Soldering
20~40s
Natural
cooling
Preheating
Soldering
Natural
cooling
350
150
TP(260° C/40s max.)
217
200
150
60~150s
60~180s
480s max.
25
Gradual
Cooling
Time(sec.)
Over 60s.
Figure 1. Re-flow Soldering:3 times max
Within4~5s
Figure 2. Wave Soldering:1 times max
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 4
SUPERWORLD ELECTRONICS (S) PTE LTD
FERRITE CHIP INDUCTORS
L2 SERIES
8-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3.
Minimum fillet height = soldering thickness + 25% product height
Upper limit
ReC0mmendable
Figure 3
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 5
SUPERWORLD ELECTRONICS (S) PTE LTD
FERRITE CHIP INDUCTORS
L2 SERIES
9. PACKAGING INFORMATION :
9-1. Reel Dimension
A
Type
A(mm)
B(mm)
C(mm)
D(mm)
7" x 8mm
9.0± 0.5 60.0± 2.0 13.5± 0.5 178.0± 2.0
7" x 12mm 13.5± 0.5 60.0± 2.0 13.5± 0.5 178.0± 2.0
2± 0.5
13.5± 0.5
7" x 8mm
7" x 12mm
R10.5
R0.5
R1.9
120°
9-2.1 Tape Dimension / 8mm
Material of taping is paper
Po:4± 0.1
D:1.5+0.1/-0.0
t
Size
0
Bo(mm)
Ao(mm)
Ko(mm)
0.50max
P(mm)
t(mm)
0.68± 0.05 0.38± 0.05
2.0± 0.05
0.50max
Ko
P
Ao
Po:4± 0.1
+0.1
-0.05
P2:2± 0.1
D:1.56
t
Size
1
Bo(mm)
1.12± 0.03
1.85± 0.05
2.30± 0.05
Ao(mm)
0.62± 0.03
1.05± 0.05
1.50± 0.05
Ko(mm)
P(mm)
t(mm)
0.60± 0.03 2.0± 0.10 0.60± 0.03
0.95± 0.05 4.0± 0.10 0.95± 0.05
0.95± 0.05 4.0± 0.10 0.95± 0.05
2
3(09)
Ko
Ao
P
Material of taping is plastic
Size
2(08)
3(09)
3(12)
4(11)
5
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
D1(mm)
none
D:1.5+0.1
A
Po:4± 0.1
t
P2:2± 0.05
1.95± 0.10 1.05± 0.10 1.05± 0.10 4.0± 0.10 0.23± 0.05
2.25± 0.10 1.42± 0.10 1.04± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10
2.35± 0.10 1.50± 0.10 1.45± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10
3.50± 0.10 1.88± 0.10 1.27± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10
3.42± 0.10 2.77± 0.10 1.55± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10
3.40± 0.10 1.77± 0.10 1.04± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10
Ao
Ko
P
A
4(09)
Section A-A
D1:1± 0.1
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 6
SUPERWORLD ELECTRONICS (S) PTE LTD
FERRITE CHIP INDUCTORS
L2 SERIES
9-2.2 Tape Dimension / 12mm
Po:4± 0.1
P2:2± 0.05
t
D:1.5+0.1
A
Series
Z / L
Size
6
Bo(mm)
4.95± 0.1
4.95± 0.1
Ao(mm)
1.93± 0.1
3.66± 0.1
Ko(mm)
1.93± 0.1
1.85± 0.1
P(mm)
4.0± 0.1
8.0± 0.1
t(mm)
D1(mm)
1.5± 0.1
1.5± 0.1
0.24± 0.05
0.24± 0.05
7
P
Ao
Ko
A
D1:1.5± 0.1
Section A-A
9-3. Packaging Quantity
Chip Size
Chip / Reel
Inner Box
Middle Box
Carton
7
6
5
4(11)
4(09)
3(12)
3(09)
4000
2
1
0
1000
4000
20000
40000
2000
2500
3000
15000
75000
150000
3000
15000
75000
2000
10000
50000
100000
4000
10000
50000
250000
500000
15000
75000
375000
750000
8000
40000
80000
12500
62500
125000
20000
100000
200000
20000
100000
200000
150000
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° C to 180° C
Room Temp.
(° C)
Room Humidity
(%)
Room atm Tearing Speed
Top cover tape
(hPa)
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Recommended products should be used within 12 months from the time of delivery.
b) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 7
SUPERWORLD ELECTRONICS (S) PTE LTD
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