L252010 [SUPERWORLD]
FERRITE CHIP INDUCTORS; 铁素贴片电感
| 型号： | L252010 |
| 厂家： | 
SUPERWORLD ELECTRONICS |
| 描述： | FERRITE CHIP INDUCTORS |
| 文件： | 总7页 (文件大小：377K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FERRITE CHIP INDUCTORS
L252010 SERIES
(a) Series code
(d) Tolerance code : M = ±20%, Y = ±30%
(e) Internal Controller Number
L 2 5 2 0 1 0 1 R 0 M -
(b) Dimension code
(a)
(e)
(c)
(b)
(d)
(c) Inductance code : 1R0 = 1.0uH
2. CONFIGURATION & DIMENSIONS :
A
D
B
Unit:m/m
A
B
C
D
2.5 ±0.2 2.0 ±0.2 1.0 Max. 0.50 ±0.3
3. SCHEMATIC :
4. MATERIALS :
a
b
Ag(100%)
(a) Body : Ferrite
(b) Termination : Ag/Ni/Sn
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
5. GENERAL SPECIFICATION :
a) Temp. rise : 40°C Max.
b) Rated current : Base on temp. rise
c) Storage temp. : -40°C to +105°C
d) Operating temp. : -40°C to +105°C
e) Resistance to solder heat : 260°C.10secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
13.10.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
FERRITE CHIP INDUCTORS
L252010 SERIES
6. ELECTRICAL CHARACTERISTICS :
Inductance
(µH)
Test Frequency Rated Current
DC Resistance
SRF
(MHz) Min
Part Number
(MHz)
(mA) Max
(ȍ)
L2520101R0M-
L2520101R5M-
L2520102R2M-
L2520103R3M-
L2520104R7M-
L2520106R8M-
L252010100M-
1.0 ±20%
1.5 ±20%
2.2 ±20%
3.3 ±20%
4.7 ±20%
6.8 ±20%
10 ±20%
1
1
1
1
1
1
1
1500
1400
1300
1200
1000
900
0.10 ±30%
0.12 ±30%
0.14 ±30%
0.18 ±30%
0.23 ±30%
0.25 ±30%
0.30 ±30%
90
60
50
40
35
30
20
800
6-1. INDUCTANCE VS. FREQUENCY CURVE :
6-2 INDUCTANCE-CURRENT CURVE :
NOTE : Specifications subject to change without notice. Please check our website for latest information.
13.10.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
FERRITE CHIP INDUCTORS
L252010 SERIES
7. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
-40~+105°C (Including self-temperature rise)
Operating Temperature
Long storage conditions, please see the aplication notice
Storage Temperature
Inductance
-40~+105°C
HP4291, HP E4991+HP4287 +HP16192
HP4338
DC Power Supply, over rated current ,there will be some risk
Refer to standard electrical characteristics list
DC Resistance
Rated Current
Temperature Rise Test
40°C max. (ǻt)
1. Applied the allowed DC current.
2. Temperature measured by digital surface thermometer.
Preheat : 150°C, 60sec.
Solder : Sn-Cu0.5
Solder Temperature : 260±5°C
Flux for lead free : ROL0
Dip Time : 10±0.5sec.
Solder Heat Resistance
No mechanical damage
Remaining terminal electrode : 75% min.
Appearance: No significant abnormality.
Inductance change: Within ± 10%.
Preheating Dipping Natural
cooling
260°C
150°C
60
10±0.5
seconds
seconds
Preheat : 150°C, 60sec.
Solder : Sn-Cu0.5
Solder Temperature : 245±5°C
Flux for lead free : ROL0
Dip Time : 4±1sec.
Solderability
More than 95% of the terminal electrode
should be covered with solder.
Preheating Dipping Natural
cooling
245°C
150°C
60
4¡À1.0
seconds
seconds
Terminal Strength
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
Size
L252010
Force (Kfg) Time (sec)
> 30
1.0
W
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
Solder a chip on a test substrate, bend the substrate
by 2mm (0.079in) and return.
The duration of the applied forces shall be 60(+5) Sec
20(.787)
Bending
45(1.772) 45(1.772)
100(3.937)
40(1.575)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
13.10.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
FERRITE CHIP INDUCTORS
L252010 SERIES
7. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Bending Strength
The ferrite should not be damaged by forces
applied on the right condition.
Size
L252010
mm (inches)
1.40(0.055)
P-Kgf
1.0
1.0(0.039)
R0.5(0.02)
Chip
A
Random Vibration Test
Appearance : Cracking, Chipping & any other
defects harmful to the characteristics should
not be allowed.
Frequency : 10-55-10Hz for 15 min.
Amplitude : 1.52mm
Directions & times : X, Y, Z directions for 15 mins
This cycle shall be performed 12 times in each of three
mutually perpendicular direction.(Total 9 hours)
Inductance: within±30%
Drop
No mechanical damage
Inductance change : within±10%
Drop 10 times on a concrete floor from a
height of 75cm.
Life testing at high temperature Appearance : No damage.
Temperature : 105±2°C
Applied Current : rated current
Duration : 1008±12hrs
Temperature
Inductance : Within ±10% of initial value.
Measured at room temperature after placing for 2 to 3hrs.
Humidity
Humidity : 90~95% RH.
Temperature : 40±2°C
Duration : 504±8hrs
Measured at room temperature after placing for 2 to 3hrs.
Thermal Shock
Appearance : No damage.
Inductance : Within ±10% of initial value.
Condition for 1 cycle
Step1 : -40±2°C 30±5 min.
Step2 : +105±5°C 30±5 min.
Number of cycles : 500
Phase
Temperature (°C)
-40±2°C
Times (min.)
30±5
1
2
3
room temp
+105±2°C
<0.5
30±5
Measured at room temperature after placing for 2 to 3hrs.
Measured : 500 times
Low temperature storage test
Temperature : -40±2°C
Duration : 500±8hrs
Measured at room temperature after placing for 2 to 3hrs.
Appearance : No damage.
Inductance : Within ±30% of initial value.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
13.10.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
FERRITE CHIP INDUCTORS
L252010 SERIES
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
3.9
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
1.5
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
8-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
8-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
8-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 350°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 4~5 secs.
Preheating
20 ~ 40s
Soldering
Natural
cooling
260
217
200
150
60~150s
60~180s
480s max.
25
Time (sec)
Reflow 3 times max.
Figure 1. Re-flow Soldering (Pb Free)
Preheating
Soldering
Natural
cooling
4~5 sec
(max.)
350
330
150
Gradual
Cooling
Over 1min.
Figure 2. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
13.10.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
FERRITE CHIP INDUCTORS
L252010 SERIES
8-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4.
Upper limit
Recommendable
Figure 4
9. PACKAGING INFORMATION :
9-1. Reel Dimension
A
2±0.5
120°
Type
A(mm)
9±0.5
B(mm)
C(mm)
D(mm)
13.5±0.5
R10.5
R0.5
7" x 8mm
60.0±2.0 13.5±0.5 178.0±2.0
R1.9
7" x 8mm
9-2 Tape Dimension / 8mm
Material : Plastic
D:1.5+0.1
A
Po:4±0.1
t
P2:2±0.05
Size
P(mm)
Bo(mm)
Ao(mm)
Ko(mm)
t(mm)
L252010
4.0±0.1
2.74±0.10 2.29±0.10 1.45 max
0.3 max
Ao
Ko
P
A
Section A-A
D1:1±0.1
9-3. Packaging Quantity
Chip Size
Reel
L252010
3000
NOTE : Specifications subject to change without notice. Please check our website for latest information.
13.10.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
FERRITE CHIP INDUCTORS
L252010 SERIES
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° to 180°
Room Temp.
(°C)
Room Humidity
(%)
Room atm Tearing Speed
Top cover tape
(hPa)
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Temperature and humidity conditions : 40°C and 70% RH.
b) Recommended products should be used within 6 months from the time of delivery.
c) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
13.10.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
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