L3-330 [SUPERWORLD]
FERRITE CHIP INDUCTORS; 铁素贴片电感
| 型号： | L3-330 |
| 厂家： | 
SUPERWORLD ELECTRONICS |
| 描述： | FERRITE CHIP INDUCTORS |
| 文件： | 总9页 (文件大小：363K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FERRITE CHIP INDUCTORS
L3 SERIES
1. PART NO. EXPRESSION :
(a) Series code
(d) 10 : Lead Free
L 3 - 4 7 N K - 1 0
(b) Inductance code : 47N = 0.047uH
(c) Tolerance code : K = 10ꢀ% ꢁ = ꢂ0ꢀ
(a)
(b) (c) (d)
2. CONFIGURATION & DIMENSIONS :
A
D
L
G
B
PCB Pattern
G
Unit:m/m
L
A
B
C
D
H
ꢂ.00 0.ꢂ0 1.ꢂ5 0.ꢂ0 0.85 0.ꢂ0 1.ꢂ5 0.ꢂ0 0.50 0.30 1.00 Ref. 1.00 Ref. 3.00 Ref.
3. SCHEMATIC :
4. MATERIALS :
a
b
Ag(100ꢀ)
(a) Body : Ferrite
Ni(100ꢀ)-1.5um(min.)
Sn(100ꢀ)-3.0um(min.)
(b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION :
a) Temp. rise : 30°C ꢁax.
b) Rated current : Base on temp. rise
c) Storage temp. : -40°C to +85°C
d) Operating temp. : -40°C to +85°C
e) Resistance to solder heat : ꢂ60°C.10secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
FERRITE CHIP INDUCTORS
L3 SERIES
6. ELECTRICAL CHARACTERISTICS :
Test
Frequency
( MHz )
SRF
( MHz )
Min.
DC Resistance
EIA
Size
Inductance
( µH )
Q
Min.
Rated Current
( mA )
Part Number
( ȍ )
Max.
L3-47N -10
L3-68N -10
L3-82N -10
L3-R10 -10
L3-R12 -10
L3-R15 -10
L3-R18 -10
L3-R22 -10
L3-R27 -10
L3-R33 -10
L3-R39 -10
L3-R47 -10
L3-R56 -10
L3-R68 -10
L3-R82 -10
L3-1R0 -10
L3-1R2 -10
L3-1R5 -10
L3-1R8 -10
L3-2R2 -10
L3-2R7 -10
L3-3R3 -10
L3-3R9 -10
L3-4R7 -10
L3-5R6 -10
L3-6R8 -10
L3-8R2 -10
L3-100 -10
L3-120 -10
L3-150 -10
L3-180 -10
L3-220 -10
L3-270 -10
L3-330 -10
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0.047
0.068
0.082
0.100
0.120
0.150
0.180
0.220
0.270
0.330
0.390
0.470
0.560
0.680
0.820
1.000
1.200
1.500
1.800
2.200
2.700
3.300
3.900
4.700
5.600
6.800
8.200
10.000
12.000
15.000
18.000
22.000
27.000
33.000
15
15
15
20
20
20
20
20
20
20
25
25
25
25
25
45
45
45
45
45
45
45
45
45
45
45
45
45
45
30
30
30
30
30
50
50
50
25
25
25
25
25
25
25
25
25
25
25
25
10
10
10
10
10
10
10
10
10
4
320
280
255
235
220
200
185
170
150
145
135
125
115
105
100
75
0.20
0.20
0.20
0.30
0.30
0.40
0.40
0.50
0.50
0.55
0.65
0.65
0.75
0.80
1.00
0.40
0.50
0.50
0.60
0.65
0.75
0.80
0.90
1.00
0.90
1.00
1.10
1.15
1.25
0.80
0.90
1.10
1.15
1.25
300
300
300
250
250
250
250
250
250
250
200
200
150
150
150
50
65
50
60
50
55
50
50
30
45
30
41
30
38
30
35
30
32
15
4
29
15
4
26
15
2
24
15
2
22
15
1
19
5
1
18
5
1
16
5
1
14
5
0.4
13
5
Packaging : Paper Carrier Tape
Inductance tolerance : : K : ±10%
M : ±20%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
FERRITE CHIP INDUCTORS
L3 SERIES
7. IMPEDANCE VS. FREQUENCY CURVES :
Q vs. Frequency
1ꢂ0
100
80
4R7
100
R10
60
1R0
40
330
ꢂ0
0
1
10
100
FREQUENCY(ꢁHz)
L vs. IDC
100
10
1
330
100
4R7
1Rꢂ
R1ꢂ
0.1
1
10
100
1000
DCCurrent(mA)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
FERRITE CHIP INDUCTORS
L3 SERIES
8. RELIABILITY & TEST CONDITION :
ITEꢁ
PERFORꢁANCE
TEST CONDITION
Electrical Characteristics Test
Impedance
HP4ꢂ91A% HP4ꢂ87A+1609ꢂA
HP4338B
Refer to standard electrical characteristics list
DC Resistance
Rated Current
Temperature Rise Test
30°C max. (ǻt)
1. Applied the allowed DC current.
ꢂ. Temperature measured by digital surface thermometer.
Preheat : 150°C% 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : ꢂ60 5°C
Flux for lead free : rosin
Dip Time : 10 0.5sec.
Solder Heat Resistance
No mechanical damage
Remaining terminal electrode : 70ꢀ min.
Preheating Dipping Natural
cooling
ꢂ60°C
150°C
60
seconds
10 0.5
seconds
Preheat : 150°C% 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : ꢂ45 5°C
Flux for lead free : rosin
Dip Time : 4 1sec.
Solderability
ꢁore than 90ꢀ of the terminal electrode
should be covered with solder.
Preheating Dipping Natural
cooling
ꢂ45°C
150°C
60
seconds
4 1.0
seconds
Terminal Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
For Z / L Series :
Size
1
Force (Kfg)
0.ꢂ
Time (sec)
> ꢂ5
ꢂ
3
4
0.5
0.6
1.0
W
5
1.0
6
1.0
7
1.5
W
8
ꢂ.0
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
Solder a chip on a test substrate% bend the substrate
by ꢂmm (0.079in) and return.
ꢂ0(.787)
Bending
45(1.77ꢂ) 45(1.77ꢂ)
100(3.937)
40(1.575)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
FERRITE CHIP INDUCTORS
L3 SERIES
8. RELIABILITY & TEST CONDITION :
ITEꢁ
PERFORꢁANCE
TEST CONDITION
Bending Strength
The ferrite should not be damaged by forces
applied on the right condition.
For Z / L Series :
Series name mm (inches)
P-Kgf
0.3
1.0
ꢂ
3
4
5
6
7
8
0.80 (0.033)
1.40 (0.055)
1.0(0.039)
R0.5(0.0ꢂ)
ꢂ.00 (0.079)
ꢂ.70 (0.106)
ꢂ.5
ꢂ.5
Chip
A
Random Vibration Test
Appearance : Cracking% shipping & any other
defects harmful to the characteristics should
not be allowed.
Frequency : 10-55-10Hz for 1 min.
Amplitude : 1.5ꢂmm
Directions & times : X% Y% Z directions for ꢂ hours.
A period of ꢂ hours in each of 3 mutually perpendicular
directions (Total 6 hours).
Drop
Drop 10 times on a concrete floor from a
height of 75cm.
No mechanical damage
Loading at High
Temperature
Appearance : No damage.
Inductance : Within 10ꢀ of initial value.
Q : Within 30ꢀ of initial value.
Temperature : 85 5°C
Applied Current : rated current
Duration : 1008 1ꢂhrs
ꢁeasured at room temperature after placing for ꢂ to 3hrs.
Humidity
Humidity : 90~95ꢀ RH.
Temperature : 40 ꢂ°C
Duration : 1008 1ꢂhrs
ꢁeasured at room temperature after placing for ꢂ to 3hrs.
For L Series :
Thermal Shock
Appearance : No damage.
Condition for 1 cycle
Step1 : -40 ꢂ°C 30 3 min.
Stepꢂ : +85 5°C 30 3 min.
Number of cycles : 100
Inductance : Within 10ꢀ of initial value.
Q : Within 30ꢀ of initial value.
Phase
1
ꢂ
Temperature (°C)
-40 ꢂ°C
Times (min.)
30 3
ꢁeasured at room temperature after placing for ꢂ to 3hrs.
+85 5°C
30 3
ꢁeasured : 100 times
Low temperature storage test
Temperature : -55 ꢂ°C
Duration : 1008 1ꢂhrs
ꢁeasured at room temperature after placing for ꢂ to 3hrs.
Drop
Drop 10 times on a concrete floor from a
height of 75cm.
No mechanical damage
Derating
Derating Curve
6A
5A
4A
3A
6
5
4
3
For the ferrite chip bead which withstanding current over 1.5A% as the
operating temperature over 85°C% the derating current information is
necessary to consider with. For the detail derating of current% please
refer to the Derated Current vs. Operating Temperature curve.
ꢂA
1.5A
ꢂ
1A
1
0
85
1ꢂ5
Operating Temperature(°C)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
FERRITE CHIP INDUCTORS
L3 SERIES
9. SOLDERIND AND MOUNTING :
9-1. Recommended PC Board Pattern
ꢂ.60
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
0.60
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
9-2. Soldering
ꢁildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder% chip and substrate. The terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided% the preferred technique is the utilization of hot
air soldering tools.
9-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
9-2.2 Solder Wave :
Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature
seen by the circuit when immersed in the molten solder wave% typical at ꢂ30°C. Due to the risk of thermal damage to
products% wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering
is shown in Fig. ꢂ
9-2.3 Soldering Iron (Figure 3) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 350°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a ꢂ0 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Preheating
Soldering
10s max.
Natural
cooling
Preheating
Soldering
Natural
cooling
ꢂ60
ꢂ50 ~ ꢂ60
ꢂ30
ꢂ45
150
180
150
60~1ꢂ0s
30~60s
Gradual
Cooling
Time(sec.)
Figure 1. Re-flow Soldering
Over ꢂmin.
Within 3s
Preheating
Soldering
Natural
cooling
Figure ꢂ. Wave Soldering
3s
(max.)
350
10s
(max.)
330
150
Gradual
Cooling
Over 1min.
Figure 3. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
FERRITE CHIP INDUCTORS
L3 SERIES
9-3. Solder Volume
Accordingly increasing the solder volume% the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4.
Upper limit
Recommendable
Figure 4
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
FERRITE CHIP INDUCTORS
L3 SERIES
10. PACKAGING INFORMATION :
10-1. Reel Dimension
A
Type
A(mm)
B(mm)
C(mm)
D(mm)
7" x 8mm 9.0±0.5 60.0±2.0 13.5±0.5 178.0±2.0
7" x 12mm 13.5±0.5 60.0±2.0 13.5±0.5 178.0±2.0
2±0.5
13.5±0.5
R10.5
R0.5
7" x 8mm
7" x 12mm
R1.9
120°
10-2 Tape Dimension / 8mm
Material : Paper
Po:4±0.1
t
+0.1
-0.05
P2:2±0.1
D:1.5
Series
Z / L
Size
1
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
2.0±0.1
4.0±0.1
4.0±0.1
t(mm)
D1(mm)
none
1.12±0.05 0.67±0.05 0.54±0.05
1.80±0.05 1.05±0.05 0.95±0.05
2.30±0.05 1.50±0.05 0.95±0.05
0.23±0.05
0.95±0.05
0.95±0.05
2
none
3(09)
none
Ko
P
Ao
Material : Plastic
D:1.5+0.1
A
Po:4±0.1
t
P2:2±0.05
Series
Size
2
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
4.0±0.1
4.0±0.1
4.0±0.1
4.0±0.1
4.0±0.1
t(mm)
D1(mm)
none
1.80±0.10 1.01±0.10 1.02±0.10
2.25±0.10 1.42±0.10 1.04±0.10
2.35±0.10 1.50±0.10 1.45±0.10
3.50±0.10 1.88±0.10 1.27±0.10
3.42±0.10 2.77±0.10 1.55±0.10
0.22±0.05
0.22±0.05
0.22±0.05
0.22±0.05
0.22±0.05
3(09)
3(12)
4
1.0±0.1
1.0±0.1
1.0±0.1
1.0±0.1
Z / L
Ao
Ko
P
A
Section A-A
5
D1:1±0.1
10-2.1 Tape Dimension / 12mm
Po:4±0.1
P2:2±0.05
t
D:1.5+0.1
A
Series
Z / L
Size
Bo(mm)
4.95±0.1
4.95±0.1
6.10±0.1
Ao(mm)
1.93±0.1
3.66±0.1
5.40±0.1
Ko(mm)
1.93±0.1
1.85±0.1
2.00±0.1
P(mm)
4.0±0.1
8.0±0.1
8.0±0.1
t(mm)
D1(mm)
1.5±0.1
1.5±0.1
1.5±0.1
6
7
8
0.24±0.05
0.24±0.05
0.30±0.05
P
Ao
Ko
A
D1:1.5±0.1
Section A-A
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8
FERRITE CHIP INDUCTORS
L3 SERIES
10-3. Packaging Quantity
Chip Size
Chip / Reel
Inner Box
Middle Box
Carton
8
7
6
5
4
3 (12)
2000
3 (09)
4000
2
1
1000
4000
20000
40000
7000
1000
4000
20000
40000
12000
2000
8000
40000
80000
20000
2500
3000
4000
10000
50000
250000
500000
300000
12500
62500
125000
30000
15000
75000
150000
50000
10000
50000
100000
100000
20000
100000
200000
150000
20000
100000
200000
200000
Bulk (Bags)
10-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° to 180°
Room Temp.
(°C)
Room Humidity
(%)
Room atm Tearing Speed
Top cover tape
(hPa)
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Temperature and humidity conditions : 10 ~ 40°C and 30 ~ 70% RH.
b) Recommended products should be used within 6 months from the time of delivery.
c) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 9
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