L811HW-100MF-13 [SUPERWORLD]
HIGH CURRENT MOLDED POWER INDUCTORS; 高电流模压功率电感
| 型号： | L811HW-100MF-13 |
| 厂家： | 
SUPERWORLD ELECTRONICS |
| 描述： | HIGH CURRENT MOLDED POWER INDUCTORS |
| 文件： | 总10页 (文件大小：582K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HIGH CURRENT MOLDED POWER INDUCTORS
L811HW SERIES
1. PART NO. EXPRESSION :
(a) Series code
(d) Tolerance code : M = ±20%
L 8 1 1 H W - 1 R 0 M F -
(b) Type code
(e) F : RoHS Compliant
(a)
(b)
(c) (d)(e) (f)
(c) Inductance code : 1R0 = 1.0uH
(f) 11 ~ 99 : Internal controlled number
2. CONFIGURATION & DIMENSIONS :
A'
A
C'
C
D
L
G
SWORLD
R36
PCB Pattern
Unit:m/m
L
A'
A
B'
B
C'
C
D
E
G
H
11.8 Max. 10.2±0.5 10.5 Max. 10.0±0.5 4.2 Max.
4.0 Max.
2.2±0.5
2.9±0.5
5.4 Ref.
4.5 Ref.
12.4 Ref.
3. SCHEMATIC :
4. MATERIALS :
(a) Core
a
b
(b) Wire
(c) Terminal
c
5. FEATURES :
a) Shielded Construction
b) Frequency up to 5MHz
NOTE : Specifications subject to change without notice. Please check our website for latest information.
30.08.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
HIGH CURRENT MOLDED POWER INDUCTORS
L811HW SERIES
6. GENERAL SPECIFICATION :
a) Test Freq. : 100KHz/1.0VDC; Q : 100KHz/1.0VDC
b) Ambient Temp. : 20°C
c) Operating Temp. : -55°C to +125°C
d) Storage Temp. : -55°C to +125°C
e) Humidity Range : 50 ~ 60% RH
f) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately ǻT=40°C without core loss.
g) Saturation Current (Isat) : Will cause L0 to drop approximately 20% typ.
h) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions.
7. ELECTRICAL CHARACTERISTICS :
Inductance L0
( µH )
±20% @ 0 Adc
Irms
( A )
Typ.
Isat
( A )
Typ.
DCR
( mȍ )
Max.
Q
Min.
Part No.
L811HW-R22MF-
L811HW-R36MF-
L811HW-R47MF-
L811HW-R56MF-
L811HW-R68MF-
L811HW-1R0MF-
L811HW-1R5MF-
L811HW-2R2MF-
L811HW-3R3MF-
L811HW-4R7MF-
L811HW-6R8MF-
L811HW-100MF-
0.22
0.36
0.47
0.56
0.68
1.00
1.50
2.20
3.30
4.70
6.80
10.00
32
28
40
40
38
36
32
28
20
16.5
14
13
11
9
1.4
1.4
18
18
18
18
18
20
20
20
20
20
20
20
26
1.6
25
1.9
23
2.4
20
3.5
12
7.5
11.5
10.0
8.0
6.5
5.0
8.56
10.0
13.5
24.0
35.0
NOTE : Specifications subject to change without notice. Please check our website for latest information.
30.08.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
HIGH CURRENT MOLDED POWER INDUCTORS
L811HW SERIES
8. CHARACTERISTICS CURVES :
INDUCTANCE VS. FREQUENCY
Q VS. FREQUENCY
INDUCTANCE VS. DC CURRENT
TEMP. RISE VS. DC CURRENT
NOTE : Specifications subject to change without notice. Please check our website for latest information.
30.08.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
HIGH CURRENT MOLDED POWER INDUCTORS
L811HW SERIES
8. CHARACTERISTICS CURVES :
L811HW-R36MF-ꢀꢀ
L811HW-R22MF-ꢀꢀ
0.8
100
90
0.3
0.25
0.2
100
90
80
70
60
50
40
30
20
80
0.6
0.4
0.2
0
70
60
50
40
30
0.15
0.1
0.05
0
20
10
0
10
0
0
10
20
32
40
0
8
7.6
6
16
24
32
30.4
24
40
DC CURRENT(A)
DC CURRENT (A)
L811HW-R47MF-ꢀꢀ
L811HW-R56MF-
ꢀꢀ
1
100
1
100
90
90
80
70
60
0.8
80
0.75
70
60
0.6
0.4
0.2
0
50
40
30
0.5
0.25
0
50
40
30
20
10
0
20
10
0
0
8
16
24
32
40
0
15.2
22.8
38
DC CURRENT(A)
DC CURRENT (A)
L811HW-R68MF-ꢀꢀ
L811HW-1R0MF-ꢀꢀ
1.6
1.2
0.8
0.4
0
100
90
0.8
0.6
0.4
0.2
0
100
90
80
70
60
50
40
30
80
70
60
50
40
30
20
10
0
20
10
0
0
12
18
30
0
6.6
13.2
19.8
26.4
33
DC CURR ENT(A)
DC CURRENT(A)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
30.08.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
HIGH CURRENT MOLDED POWER INDUCTORS
L811HW SERIES
8. CHARACTERISTICS CURVES :
L811HW-2R2MF-ꢀꢀ
L811HW-1R5MF-ꢀꢀ
4
3.2
2.4
1.6
0.8
0
100
90
3
2.4
1.8
1.2
0.6
0
100
90
80
80
70
70
60
60
50
40
30
50
40
30
20
10
0
20
10
0
0
0
0
4 .4
8.8
13.2
17.6
22
0
4.8
9.6
14.4
19.2
24
DC CURRENT(A)
DC CURRENT(A)
L811HW-3R3MF-ꢀꢀ
L81HW-4R7MF-ꢀꢀ
6
100
90
6.4
4.8
3.2
1.6
0
100
90
4.8
80
80
70
60
70
60
3.6
2.4
50
40
30
50
40
30
1.2
0
20
10
0
20
10
0
4
8
12
16
0
2.8
5.6
8.4
11.2
14
DC CURRENT(A)
DC CURRENT(A)
L811HW-100MF-ꢀꢀ
L811HW-6R8MF-ꢀꢀ
12
9.6
7.2
4.8
2.4
0
100
12
100
90
80
90
80
9.6
70
60
50
40
30
20
10
0
70
60
7.2
4.8
2.4
0
50
40
30
20
10
0
2.2
4.4
6.6
8.8
11
0
1.8
3.6
5.4
7.2
9
DC CURRENT(A)
DC CURRENT(A)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
30.08.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
HIGH CURRENT MOLDED POWER INDUCTORS
L811HW SERIES
9. CORE LOSS :
100KHz and 500KHz
40000
material
100KHz
500KHz
gauss loss
30000
20000
100
200
300
400
500
600
700
800
900
1000
-
266
-
1,234
351.7
665.9
1,039
1,471
1,923
2,537
3,148
3,902
2,932
5,195
8,336
12,025
15,715
20,444
25,429
31,002
500KHZ
10000
100KHZ
0
0
200
400
600
800
1000
1000
1000
gauss
gauss
100KHz
4000
material
100KHz
gauss loss
3000
2000
1000
0
300
400
500
600
700
800
900
1000
351.7
665.9
1,039
1,471
1,923
2,537
3,148
3,902
200
400
600
gauss
800
gauss
500KHz
40000
30000
20000
10000
0
0
200
400
600
800
gauss
gauss
NOTE : Specifications subject to change without notice. Please check our website for latest information.
30.08.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
HIGH CURRENT MOLDED POWER INDUCTORS
L811HW SERIES
10. RELIABILITY AND TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Electrical Characteristics Test
HP4284A, CH11025, CH3302, CH1320, CH1320S
LCR meter.
Inductance
Refer to standard electrical characteristics list
DCR
CH16502, Agilent33420A Micro-Ohm Meter.
Heat Rated Current (Irms)
Irms(A) will cause the coil temperature rise
approximately ǻT=40°C without core loss
1. Applied the allowed DC current
2. Temperature measured by digital surface thermometer
Saturation Current (Isat)
Isat(A) will cause Lo to drop approximately 20% typ.
Mechanical Performance Test
Solderability Test
Solder Heat Resistance
Reliability Test
More than 90% of the terminal electrode
should be covered with solder.
Preheat : 150°C, 60sec.
Solder : Sn99.95-Cu0.05
Solder Temperature : 245±5°C
Flux for lead free : rosin
Dip Time : 4±1sec.
Preheating Dipping Natural
cooling
245°C
150°C
60
4±1
seconds
seconds
1. Appearance : No significant abnormality
2. Inductance change : Within ±20%
Preheat : 150°C, 60sec.
Solder : Sn99.95-Cu0.05
Solder Temperature : 260±5°C
Flux for lead free : rosin
Dip Time : 10±0.5sec.
Preheating Dipping Natural
cooling
260°C
150°C
60
10±0.5
seconds
seconds
High Temperature
Life Test
Temperature : 125±5°C
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
Low Temperature
Life Test
Temperature : -55±5°C
Time : 500±12 hours
1. Appearance : No damage
Measure at room temperature after placing for 2 to 3 hrs.
2. Inductance : Within ±20% of initial value.
No disconnection or short circuit.
Thermal Shock
Conditions of 1 cycle.
Step
Temperature (°C)
-55±3
Room Temperature
+125±3
Times (min.)
30±3
Within 3
30±3
1
2
3
4
Room Temperature
Within 3
Total : 5 cycles
Measure at room temperature after placing for 2 to 3 hrs.
Humidity Resistance
1. Appearance : No damage
Temperature : 40±5°C
Humidity : 90% to 95%
Applied Current : Rated Curent
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
2. Inductance : Within ±20% of initial value.
No disconnection or short circuit.
Frequency : 10-55-10Hz for 1 min.
Amplitude : 1.52mm
Directions & times : X, Y, Z directions for 2 hours.
A period of 2 hours in each of 3 mutually perpendicular
directions (Total 6 hours).
Random Vibration Test
Appearance : Cracking, shipping and any other
defects harmful to the characteristics should not
be allowed.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
30.08.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
HIGH CURRENT MOLDED POWER INDUCTORS
L811HW SERIES
11. SOLDERING AND MOUNTING :
11-1. Recommended PC Board Pattern
3.5
5.4
3.5
11-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
11-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
11-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Preheating Soldering Natural
Preheating Soldering Natural
cooling
cooling
10s max.
280
250~260
230
260
150
180
150
60~120s
Gradual
Over 1min.
Cooling
30~60s
Within 3secs.
Figure 1. Re-flow Soldering
Figure 2. Iron Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
30.08.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8
HIGH CURRENT MOLDED POWER INDUCTORS
L811HW SERIES
12. PACKAGING INFORMATION :
12-1. Reel Dimension
COVER TAPE
2.0±0.5
A
EMBOSSED CARRIER
Type
A(mm)
B(mm)
C(mm)
D(mm)
330
13" x 24mm 24.0±0.5
100±2.0
13.5±0.5
12-2 Tape Dimension
4.0±0.1
2.0±0.1
Ø1.5+0.1
t
P
0.15 MIN
Ko
Ao
Series
L811HW
Ao(mm)
Bo(mm)
Ko(mm)
4.5±0.1
P(mm)
W(mm)
F(mm)
t(mm)
10.5±0.1 11.8±0.1
16.0±0.1 24.0±0.3 11.5±0.1 0.35±0.05
12-3. Packaging Quantity
Size
L811HW
900
Chip / Reel
Inner Box
Carton
1800
7200
NOTE : Specifications subject to change without notice. Please check our website for latest information.
30.08.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 9
HIGH CURRENT MOLDED POWER INDUCTORS
L811HW SERIES
12-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
80°
165° to 1
Room Temp.
(°C)
Room Humidity
(%)
Room atm Tearing Speed
Top cover tape
(hPa)
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Temperature and humidity conditions : Less than 30°C and 70% RH.
b) Recommended products should be used within 6 months from the time of delivery.
c) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
30.08.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 10
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