SDL1310 [SUPERWORLD]
HIGH CURRENT POWER INDUCTORS; 大电流功率电感器
| 型号： | SDL1310 |
| 厂家： | 
SUPERWORLD ELECTRONICS |
| 描述： | HIGH CURRENT POWER INDUCTORS |
| 文件： | 总4页 (文件大小：200K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HIGH CURRENT POWER INDUCTORS
SDL1310 SERIES
1. PART NO. EXPRESSION :
(a) Series code
(d) Tolerance code : M = ±20%
S D L 1 3 1 0 - R 6 0 M F
(b) Dimension code
(e) F : Lead Free
(a)
(b)
(c) (d)(e)
(c) Inductance code : R60 = 0.60uH
2. CONFIGURATION & DIMENSIONS :
A
H
PCB Pattern
E
mm
mm
mm
mm
mm
mm
mm
G
mm
mm
A
B
C
D
E
F
H
I
13.0 Max.
14.0 Max.
9.0 Max.
3.5±0.5
6.0±0.5
7.3±0.5
7.3±0.5
6.0±0.5
2.0±0.5
3. SCHEMATIC :
4. GENERAL SPECIFICATION :
a) Operating temp. : -55°C to +125°C
b) Storage temp. : -55°C to +125°C
c) Irms (A) : Will cause coil temp. to rise approximately ǻT=60°C without core loss.
d) Isat (A) : Will cause L0 to drop approximately 20%
e) Part temperature (ambient + temp. rise) : Should not exceed 125°C under worst case operating conditions.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
05.05.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
HIGH CURRENT POWER INDUCTORS
SDL1310 SERIES
5. ELECTRICAL CHARACTERISTICS :
Test
Frequency
( Hz )
DCR
( mȍ )
Max.
Irms
( A )
Max.
Isat
( A )
Max.
Inductance L0
Part No.
( µH )
SDL1310-R60MF
0.60±20%
0.25V / 100K
1.0
30
40
6. CHARACTERISTICS CURVES :
SDL1310-R60MF
NOTE : Specifications subject to change without notice. Please check our website for latest information.
05.05.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
HIGH CURRENT POWER INDUCTORS
SDL1310 SERIES
7. RELIABILITY AND TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Electrical Characteristics Test
HP4284A, CH11025, CH3302, CH1320, CH1320S
LCR meter.
Inductance
Refer to standard electrical characteristics list
DCR
CH16502, Agilent33420A Micro-Ohm Meter.
Heat Rated Current (Irms)
Irms(A) will cause the coil temperature rise
approximately ǻT=40°C without core loss
1. Applied the allowed DC current
2. Temperature measured by digital surface thermometer
Saturation Current (Isat)
Isat(A) will cause Lo to drop approximately 20%
Mechanical Performance Test
Solderability Test
Solder Heat Resistance
Reliability Test
More than 90% of the terminal electrode
should be covered with solder.
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 230±5°C
Flux for lead free : rosin
Dip Time : 4±1sec.
Preheating Dipping Natural
cooling
230°C
150°C
60
4±1
seconds
seconds
1. Appearance : No significant abnormality
2. Inductance change : Within ±20%
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 260±5°C
Flux for lead free : rosin
Dip Time : 10±0.5sec.
Preheating Dipping Natural
cooling
260°C
150°C
60
10±0.5
seconds
seconds
High Temperature
Life Test
Temperature : 125±5°C
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
Low Temperature
Life Test
Temperature : -55±5°C
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
1. Appearance : No damage
2. Inductance : Within ±20% of initial value.
No disconnection or short circuit.
Thermal Shock
Conditions of 1 cycle.
Step
Temperature (°C)
-55±3
Room Temperature
+125±3
Times (min.)
30±3
Within 3
30±3
1
2
3
4
Room Temperature
Within 3
Total : 5 cycles
Measure at room temperature after placing for 2 to 3 hrs.
Humidity Resistance
1. Appearance : No damage
Temperature : 40±5°C
Humidity : 90% to 95%
Applied Current : Rated Curent
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
2. Inductance : Within ±20% of initial value.
No disconnection or short circuit.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
05.05.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
HIGH CURRENT POWER INDUCTORS
SDL1310 SERIES
8. SOLDERIND AND MOUNTING :
8-1. Recommended PC Board Pattern ( Unit : mm )
6.0±0.5
8-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
8-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
8-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Preheating Soldering Natural
Preheating Soldering Natural
cooling
cooling
10s max.
280
250~260
230
260
150
180
150
60~120s
Gradual
Over 1min.
Cooling
30~60s
Within 3secs.
Figure 1. Re-flow Soldering
Figure 2. Iron Soldering
9. PACKING AND QUANTITY :
Size
SDL1310
180
Styrofoam
Inner box
Carton
360
1800
NOTE : Specifications subject to change without notice. Please check our website for latest information.
05.05.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
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