Z4K900-RE-10 [SUPERWORLD]
FERRITE CHIP BEADS; 铁氧体片状磁珠
| 型号： | Z4K900-RE-10 |
| 厂家： | 
SUPERWORLD ELECTRONICS |
| 描述： | FERRITE CHIP BEADS |
| 文件： | 总9页 (文件大小：362K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FERRITE CHIP BEADS
Z4 SERIES
1. PART NO. EXPRESSION :
(a) Series code
(e) R : Reel
Z 4 K 2 6 0 - R E - 1 0
(b) Dimension code
(f) Current code : E = 500mA
(g) 10 : Lead Free
(a)(b)(c) (d)
(e)(f) (g)
(c) Material code
(d) Impedance code : 260 = 26ȍ
2. CONFIGURATION & DIMENSIONS :
A
D
L
G
B
PCB Pattern
Unit:m/m
L
A
B
C
D
G
H
3.20±0.20 1.60±0.20 1.10±0.20 0.50±0.30 2.20 Ref. 1.40 Ref. 4.40 Ref.
3. SCHEMATIC :
4. MATERIALS :
a
b
Ag(100%)
(a) Body : Ferrite
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
(b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION :
a) Temp. rise : 30°C Max.
b) Rated current : Base on temp. rise
c) Storage temp. : -55°C to +125°C
d) Operating temp. : -55°C to +125°C
e) Resistance to solder heat : 260°C.10secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
FERRITE CHIP BEADS
Z4 SERIES
6. ELECTRICAL CHARACTERISTICS :
Test
Frequency
( MHz )
DC Resistance
( ȍ )
Rated Current
( mA )
EIA
Size
Impedance
Part Number
( ȍ )
Max.
Max.
Z4K260-RE-10
Z4K310-RE-10
Z4K420-RE-10
Z4K500-RE-10
Z4K700-RE-10
Z4K900-RE-10
Z4N190-RE-10
1206
1206
1206
1206
1206
1206
1206
26 ±25%
31 ±25%
42 ±25%
50 ±25%
70 ±25%
90 ±25%
19 ±25%
100
100
100
100
100
100
100
0.2
0.2
0.2
0.2
0.2
0.2
0.2
500
500
500
500
500
500
500
7. IMPEDANCE VS. FREQUENCY CURVES :
Z4K260-RE-10
Z4K310-RE-10
80
60
40
20
0
80
60
40
20
Z
Z
X
X
R
R
0
1
1
10
100
1000
10
100
1000
FREQUENCY(MHz)
FREQUE NCY(MHz)
Z4K500-RE-10
Z
4
K
4
2
0
-R
E
-
10
100
80
60
40
20
0
100
80
60
40
20
Z
Z
X
X
R
FREQUENCY(MHz)
R
0
1
10
100
1000
1
10
100
1000
FREQUENCY( MHz)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
FERRITE CHIP BEADS
Z4 SERIES
7. IMPEDANCE VS. FREQUENCY CURVES :
Z4K900-RE-10
Z4K700-RE-10
160
120
80
40
0
200
160
120
80
Z
Z
X
X
40
R
R
0
1
10
100
1000
1
10
100
1000
FREQUENCY(MHz)
FREQUENCY(MHz)
Z4N190-RE-10
Z 4190-E-00
80
60
40
20
0
Z
X
R
1
10
100
1000
FREQUENCY(MHz)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
FERRITE CHIP BEADS
Z4 SERIES
8. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Electrical Characteristics Test
Impedance
HP4291A, HP4287A+16092A
HP4338B
Refer to standard electrical characteristics list
DC Resistance
Rated Current
Temperature Rise Test
30°C max. (ǻt)
1. Applied the allowed DC current.
2. Temperature measured by digital surface thermometer.
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 260±5°C
Flux for lead free : rosin
Dip Time : 10±0.5sec.
Solder Heat Resistance
Appearance : No significant abnormality
Impedance change : Within ±30%
No mechanical damage
Remaining terminal electrode : 70% min.
Preheating Dipping Natural
cooling
260°C
150°C
60
10±0.5
seconds
seconds
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 245±5°C
Flux for lead free : rosin
Dip Time : 4±1sec.
Solderability
More than 90% of the terminal electrode
should be covered with solder.
Preheating Dipping Natural
cooling
245°C
150°C
60
4±1.0
seconds
seconds
Terminal Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
For Z Series :
Size
1
Force (Kfg)
0.2
Time (sec)
> 25
2
3
4
0.5
0.6
1.0
W
5
1.0
6
1.0
7
1.5
W
8
2.0
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
Solder a chip on a test substrate, bend the substrate
by 2mm (0.079in) and return.
20(.787)
Bending
45(1.772) 45(1.772)
100(3.937)
40(1.575)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
FERRITE CHIP BEADS
Z4 SERIES
8. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Bending Strength
The ferrite should not be damaged by forces
applied on the right condition.
Series name mm (inches)
P-Kgf
0.3
1.0
Z2
Z3
Z4
Z5
Z6
Z7
Z8
0.80 (0.033)
1.40 (0.055)
1.0(0.039)
R0.5(0.02)
2.00 (0.079)
2.5
Chip
A
2.70 (0.106)
2.5
Random Vibration Test
Appearance : Cracking, shipping & any other
defects harmful to the characteristics should
not be allowed.
Frequency : 10-55-10Hz for 1 min.
Amplitude : 1.52mm
Directions & times : X, Y, Z directions for 2 hours.
A period of 2 hours in each of 3 mutually perpendicular
directions (Total 6 hours).
Impedance : Within ±30%
Drop
Drop 10 times on a concrete floor from a
height of 75cm.
a. No mechanical damage
b. Impedance change : ±30%
Loading at High
Temperature
Appearance : No damage.
Impedance : Within ±30% of initial value.
Temperature : 125±5°C
Applied Current : rated current
Duration : 500±12hrs
Measured at room temperature after placing for 2 to 3hrs.
Humidity
Humidity : 90~95% RH.
Temperature : 40±2°C
Duration : 500±12hrs
Measured at room temperature after placing for 2 to 3hrs.
For Z Series :
Thermal Shock
Appearance : No damage.
Condition for 1 cycle
Step1 : -55±2°C 30±3 min.
Step2 : +125±5°C 30±3 min.
Number of cycles : 5
Impedance : Within ±30% of initial value.
Phase
1
2
Temperature (°C)
-55±2°C
Times (min.)
30±3
+125±5°C
30±3
Measured at room temperature after placing for 2 to 3hrs.
Measured : 5 times
Low temperature storage test
Temperature : -55±2°C
Duration : 500±12hrs
Measured at room temperature after placing for 2 to 3hrs.
Drop
Drop 10 times on a concrete floor from a
height of 75cm.
a. No mechanical damage
b. Impedance change : ±30%
Derating
Derating Curve
6A
5A
4A
3A
6
5
4
3
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85°C, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
2A
1.5A
2
1A
1
0
85
125
Operating Temperature(°C)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
FERRITE CHIP BEADS
Z4 SERIES
9. SOLDERING AND MOUNTING :
9-1. Recommended PC Board Pattern
4.40
2.20
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
9-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
9-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
9-2.2 Solder Wave :
Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature
seen by the circuit when immersed in the molten solder wave, typical at 230°C. Due to the risk of thermal damage to
products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering
is shown in Fig. 2
9-2.3 Soldering Iron (Figure 3) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 350°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Preheating
Soldering
20~40s
Natural
cooling
Preheating
Soldering
Natural
cooling
260
TP(260°C/10s max.)
217
245
150
200
150
60~150s
60~180s
480s max.
25
Gradual
Cooling
Time(sec.)
Over 2min.
Figure 1. Re-flow Soldering
Within 10s
Preheating
Soldering
Natural
cooling
Figure 2. Wave Soldering
3s
(max.)
350
10s
(max.)
330
150
Gradual
Cooling
Over 1min.
Figure 3. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
FERRITE CHIP BEADS
Z4 SERIES
9-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4.
Upper limit
Recommendable
Figure 4
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
FERRITE CHIP BEADS
Z4 SERIES
10. PACKAGING INFORMATION :
10-1. Reel Dimension
A
Type
A(mm)
B(mm)
C(mm)
D(mm)
7" x 8mm 9.0±0.5 60.0±2.0 13.5±0.5 178.0±2.0
7" x 12mm 13.5±0.5 60.0±2.0 13.5±0.5 178.0±2.0
2±0.5
13.5±0.5
R10.5
R0.5
7" x 8mm
7" x 12mm
R1.9
120°
10-2 Tape Dimension / 8mm
Material : Paper
Po:4±0.1
+0.1
-0.05
P2:2±0.1
D:1.56
t
Series
Z / L
Size
1
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
2.0±0.1
4.0±0.1
4.0±0.1
t(mm)
D1(mm)
none
1.12±0.03 0.62±0.03 0.60±0.03
1.85±0.05 1.05±0.05 0.95±0.05
2.30±0.05 1.50±0.05 0.95±0.05
0.60±0.03
0.95±0.05
0.95±0.05
2
none
3(09)
none
Ko
P
Ao
Material : Plastic
D:1.5+0.1
A
Po:4±0.1
t
P2:2±0.05
Series
Size
2
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
4.0±0.1
4.0±0.1
4.0±0.1
4.0±0.1
4.0±0.1
t(mm)
D1(mm)
none
1.95±0.10 1.05±0.10 1.05±0.10
2.25±0.10 1.42±0.10 1.04±0.10
2.35±0.10 1.50±0.10 1.45±0.10
3.50±0.10 1.88±0.10 1.27±0.10
3.42±0.10 2.77±0.10 1.55±0.10
0.23±0.05
0.22±0.05
0.22±0.05
0.22±0.05
0.22±0.05
3(09)
3(12)
4
1.0±0.1
1.0±0.1
1.0±0.1
1.0±0.1
Z / L
Ao
Ko
P
A
Section A-A
5
D1:1±0.1
10-2.1 Tape Dimension / 12mm
Po:4±0.1
P2:2±0.05
t
D:1.5+0.1
A
Series
Z / L
Size
Bo(mm)
4.95±0.1
4.95±0.1
6.10±0.1
Ao(mm)
1.93±0.1
3.66±0.1
5.40±0.1
Ko(mm)
1.93±0.1
1.85±0.1
2.00±0.1
P(mm)
4.0±0.1
8.0±0.1
8.0±0.1
t(mm)
D1(mm)
1.5±0.1
1.5±0.1
1.5±0.1
6
7
8
0.24±0.05
0.24±0.05
0.30±0.05
P
Ao
Ko
A
D1:1.5±0.1
Section A-A
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8
FERRITE CHIP BEADS
Z4 SERIES
10-3. Packaging Quantity
Chip Size
Chip / Reel
Inner Box
Middle Box
Carton
8
7
6
5
4
3 (12)
2000
3 (09)
4000
2
1
1000
4000
20000
40000
7000
1000
4000
20000
40000
12000
2000
8000
40000
80000
20000
2500
3000
4000
10000
50000
250000
500000
300000
12500
62500
125000
30000
15000
75000
150000
50000
10000
50000
100000
100000
20000
100000
200000
150000
20000
100000
200000
200000
Bulk (Bags)
10-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° to 180°
Room Temp.
(°C)
Room Humidity
(%)
Room atm Tearing Speed
Top cover tape
(hPa)
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Temperature and humidity conditions : -10 ~ 40°C and 30 ~ 70% RH.
b) Recommended products should be used within 6 months from the time of delivery.
c) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 9
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