070212FR [SUYIN-USA]

SLIM D-SUB RIGHT ANGLE P.C.B. MOUNT; SLIM D- SUB直角P.C.B. MOUNT
070212FR
型号: 070212FR
厂家: SUYIN USA, INC.    SUYIN USA, INC.
描述:

SLIM D-SUB RIGHT ANGLE P.C.B. MOUNT
SLIM D- SUB直角P.C.B. MOUNT

文件: 总1页 (文件大小:143K)
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070213FR

SLIM D-SUB RIGHT ANGLE P.C.B. MOUNT

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25 SUYIN-USA

070221ME

ULTRA THIN D-SUB EDGE MOUNT

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22 SUYIN-USA

070223FE

ULTRA THIN D-SUB EDGE MOUNT

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18 SUYIN-USA

0702460801

2.54mm (.100) Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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10 MOLEX

0702460802

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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11 MOLEX

0702461001

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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13 MOLEX

0702461002

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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7 MOLEX

0702461004

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.13μm (5μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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13 MOLEX

0702461201

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 12Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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14 MOLEX

0702461202

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 12Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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14 MOLEX

0702461401

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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9 MOLEX

0702461402

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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10 MOLEX

0702461404

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin (Sn) PC TailPlating

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19 MOLEX

0702461601

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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17 MOLEX

0702461602

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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9 MOLEX