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070223FE [SUYIN-USA]

ULTRA THIN D-SUB EDGE MOUNT; 超薄D- SUB边缘安装

070223FE


元器件型号：	070223FE
生产厂家：	SUYIN USA, INC.
描述和应用：	ULTRA THIN D-SUB EDGE MOUNT 超薄D- SUB边缘安装
PDF文件：	总1页 (文件大小：159K)
下载文档：	下载PDF数据表文档文件
型号参数：070223FE参数

0702460801

2.54mm (.100) Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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10 MOLEX

0702460802

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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11 MOLEX

0702461001

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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13 MOLEX

0702461002

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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7 MOLEX

0702461004

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.13μm (5μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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13 MOLEX

0702461201

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 12Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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14 MOLEX

0702461202

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 12Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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14 MOLEX

0702461401

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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9 MOLEX

0702461402

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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10 MOLEX

0702461404

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin (Sn) PC TailPlating

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19 MOLEX

0702461601

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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17 MOLEX

0702461602

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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9 MOLEX

0702461604

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating

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13 MOLEX

0702462001

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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6 MOLEX

0702462002

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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7 MOLEX

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