TBMA1004P4-7R5MN-D [TAI-TECH]

SMD Power Inductor;


型号：	TBMA1004P4-7R5MN-D
厂家：	TAI-TECH
描述：	SMD Power Inductor
文件：	总3页 (文件大小：452K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TAI-TECH

TBMA1004P4-Series(N)-D

SMD Power Inductor

1. Features

1. Shielded construction.

2. Capable of corresponding high frequency .

3. Low loss realized with low DCR.

Halogen

4. High performance (Isat) realized by metal dust core.

5. Ultra low buzz noise, due to composite construction.

6. 100% Lead(Pb)-Free and RoHS compliant.

7. Operating temperature -40~+125℃(Including self - temperature rise)

Halogen-free

2. Applications

1. DC/DC converters in distributed power systems.

2. DC/DC converter for Field Programmable Gate Array(FPGA).

3. Battery powered devices.

4. Thin type on-board power supply module for exchanger.

5. VRM for server.

Recommend PC Board Pattern

6. High current, low profile POL converters.

7. PDA/notebook/desktop/server and battery powered devices.

3. Dimensions

100

1933

Unit:mm

2.9

1.5

3.3

9.7

3.4

Note: 1. The above PCB layout reference only.

2. Recommend solder paste thickness at

0.15mm and above.

100

1933

Series

TBMA1004 12.0±0.20 9.60±0.20 8.7±0.25 11.3±0.30 1.95±0.15 2.80±0.10 3.4 MIN 2.3±0.3 2.5±0.3 ≤0.15

Unit:mm

4. Part Numbering

TBMA

1004

100

A: Series

B: Dimension

C: Type

BxC

Standard.

D: Inductance

R10=0.1uh，1R0=1.0uh，100=10uh，101=100uh，102=1000uh.

K=±10%，L=±15%，M=±20%，N=±25%，Y=±30%

E: Inductance Tolerance

F: Code

Marking: Black.100 and 1933(19 YY, 33 WW,follow production date).

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5. Specification

Inductance

L0 A(uH)

±20%

Heat Rating

Current DC

I rms ( A ) Typ I sat ( A ) Typ

Saturation

Current DC

DCR

(mΩ)Typ

DCR

(mΩ)Max

Part Number

TBMA1004P4-R43MN-D

TBMA1004P4-5R6MN-D

TBMA1004P4-7R5MN-D

TBMA1004P4-100MN-D

TBMA1004P4-150MN-D

0.43

5.60

7.50

10.0

15.0

22.0

27.0

7.50

6.80

5.60

4.60

4.0

38.0

11.0

10.0

7.40

5.50

5.0

1.90

20.0

25.0

30.5

43.5

2.30

23.0

28.0

32.6

45.5

74.4

TBMA1004P4-220MN-D

Note:

1. Test frequency : Ls : 100KHz /1.0V.

2. All test data referenced to 25℃ ambient.

3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.

4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃

5. Saturation Current (Isat) will cause L0 to drop approximately30%.

6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and

thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

7. Special inquiries besides the above common used types can be met on your requirement.

6. Schematic Diagram

7. Material List

Items

Base

Core

Wire

Clip

Materials

Plastic

Alloy Powder

Marking

Polyester Wire or equivalent.

100% Pb free solder(Ni+Sn---Plating)

Epoxy

Glue

Ink

Halogen-free ketone

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12. Typical Performance Curves

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