TMPA1205SP-2R2MN-D [TAI-TECH]

SMD Power Inductor;


型号：	TMPA1205SP-2R2MN-D
厂家：	TAI-TECH
描述：	SMD Power Inductor
文件：	总3页 (文件大小：639K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TAI-TECH

TMPA1205SP-Series(N)-D

SMD Power Inductor

1. Features

1. Shielded construction.

2. Capable of corresponding high frequency .

3. Low loss realized with low DCR.

Halogen

4. High performance (Isat) realized by metal dust core.

5. Ultra low buzz noise, due to composite construction.

6. 100% Lead(Pb)-Free and RoHS compliant.

7. Operating temperature -40~+125℃(Including self - temperature rise)

Halogen-free

2. Applications

1. DC/DC converters in distributed power systems.

2. DC/DC converter for Field Programmable Gate Array(FPGA).

3. Battery powered devices.

4. Thin type on-board power supply module for exchanger.

5. VRM for server.

6. High current, low profile POL converters.

7. PDA/notebook/desktop/server and battery powered devices.

3. Dimensions

100

1919

leadframe

Recommend PC Board Pattern

1R0

1919

non-leadframe

L(mm) G(mm) H(mm)

Series

14.5

8.0

5.0

See Spec

table

TMPA1205

13.5±0.5 12.6±0.2 4.7±0.3 2.3±0.3

Note: 1. The above PCB layout reference only.

2. Recommend solder paste thickness at

0.15mm and above.

Unit:mm

4. Part Numbering

TMPA

1205

100

A: Series

B: Dimension

C: Type

BxC.

Standard.

D: Inductance

R10=0.1uh，1R0=1.0uh，100=10uh，101=100uh，102=1000uh.

K=±10%，L=±15%，M=±20%，N=±25%，Y=±30%

E: Inductance Tolerance

F: Code

Marking: Black.100 and 1919(19 YY, 19 WW,follow production date).

TAI-TECH

5. Specification

Heat Rating

Current DC

Irms( A )

Saturation

Current DC

I sat ( A )

Inductance

L0 A(uH)

±20%

DCR

(mΩ)

Typ

DCR

(mΩ)

Max

E(mm)

±0.3

Part Number

Type

Typ

Max

Typ

Max

TMPA1205SP-R47MN-D

TMPA1205SP-R68MN-D

TMPA1205SP-1R0MN-D

TMPA1205SP-1R5MN-D

TMPA1205SP-2R2MN-D

TMPA1205SP-3R3MN-D

TMPA1205SP-4R7MN-D

TMPA1205SP-6R8MN-D

TMPA1205SP-100MN-D

TMPA1205SP-150MN-D

TMPA1205SP-220MN-D

TMPA1205SP-330MN-D

Note:

0.47

0.68

1.00

1.50

2.20

3.30

4.70

6.80

10.0

15.0

22.0

33.0

0.77

1.3

1.6

3.2

4.1

6.0

8.8

0.9

1.55

1.9

3.8

4.8

7.0

10.2

4.0

4.7

non-leadframe

leadframe

15.5

leadframe

15.5

20.5

leadframe

12.5

18.5

16.5

leadframe

9.0

8.2

7.0

5.2

10.5

9.2

7.5

6.5

19.2

leadframe

9.4

8.0

6.0

leadframe

8.5

7.3

leadframe

1. Test frequency : Ls : 100KHz /1.0V.

2. All test data referenced to 25℃ ambient.

3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.

4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃

5. Saturation Current (Isat) will cause L0 to drop approximately 30%.

6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and

thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

7. Special inquiries besides the above common used types can be met on your requirement.

TAI-TECH

11. Typical Performance Curves

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