TMPA1265SP-R68MN-D [TAI-TECH]
SMD Power Inductor;
| 型号： | TMPA1265SP-R68MN-D |
| 厂家： | 
TAI-TECH |
| 描述： | SMD Power Inductor |
| 文件： | 总4页 (文件大小：1083K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TAI-TECH
SMD Power Inductor
1. Features
1. Shielded construction.
2. Capable of corresponding high frequency .
3. Low loss realized with low DCR.
Halogen
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6. 100% Lead(Pb)-Free and RoHS compliant.
7. Operating temperature -40~+125℃(Including self - temperature rise)
Halogen-free
2. Applications
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
3. Dimensions
C
A
A`
D
100
1919
leadframe
C
A
Recommend PC Board Pattern
D
A`
L
R22
1919
G
non-leadframe
L(mm) G(mm) H(mm)
Series
A
A`
B
C
D
E
14.5
8.0
5.0
See Spec
table
TMPA1265 13.5±0.5
Unit:mm
12.6±0.3
12.6±0.2
6.2±0.3
2.3±0.3
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
4. Part Numbering
TMPA
1265
SP
-
100
MN
-
D
A
B
C
D
E
F
A: Series
B: Dimension
C: Type
BxC.
Standard.
D: Inductance
R10=0.1uh，1R0=1.0uh，100=10uh，101=100uh，102=1000uh.
K=±10%，L=±15%，M=±20%，N=±25%，Y=±30%
E: Inductance Tolerance
F: Code
Marking: Black.100 and 1919(19 YY, 19 WW,follow production date).
TAI-TECH
5. Specification
Heat Rating
Current DC
Irms ( A )
Saturation
Current DC
I sat ( A )
Inductance
L0 A(uH)
±20%
DCR
(mΩ)
Typ
DCR
(mΩ)
Max
E(mm)
±0.3
Part Number
Type
Typ
65
Max
60
Typ
120
112
75
Max
115
105
65
TMPA1265SP-R10YN-D
TMPA1265SP-R22MN-D
TMPA1265SP-R33MN-D
TMPA1265SP-R47MN-D
TMPA1265SP-R68MN-D
TMPA1265SP-1R0MN-D
TMPA1265SP-1R5MN-D
TMPA1265SP-1R8MN-D
TMPA1265SP-2R2MN-D
TMPA1265SP-2R7MN-D
TMPA1265SP-3R3MN-D
TMPA1265SP-4R7MN-D
TMPA1265SP-5R6MN-D
TMPA1265SP-6R8MN-D
TMPA1265SP-8R2MN-D
TMPA1265SP-100MN-D
TMPA1265SP-150MN-D
TMPA1265SP-220MN-D
TMPA1265SP-270MN-D
TMPA1265SP-330MN-D
TMPA1265SP-470MN-D
TMPA1265SP-680MN-D
TMPA1265SP-820MN-D
TMPA1265SP-101MN-D
Note:
0.10±30%
0.22
0.33
0.47
0.68
1.00
1.50
1.80
2.20
2.70
3.30
4.70
5.60
6.80
8.20
10.0
15.0
22.0
27.0
33.0
47.0
68.0
82.0
100
0.2
0.4
0.6
0.88
1.25
1.5
2.2
3.2
3.7
4.2
5.3
6.8
8.3
9.8
12
0.25
0.46
0.7
4.7
4.7
4.7
4.7
4.0
4.0
4.0
4.7
4.7
4.7
4.7
4.7
4.7
4.7
4.7
4.7
4.7
4.7
4.7
4.7
4.7
4.7
4.7
4.7
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
leadframe
53
42
46
36
42
35
68
58
1.02
1.5
36.5
33
33
55
46
29
45
36
1.8
29
25
35
30
2.53
3.6
27
23
31
27
25
21
28.5
27.5
27
24
4.2
leadframe
24
20
23
5.0
leadframe
22
19
22.5
21
6.2
leadframe
20
17
25
8.0
leadframe
18
15
23
19.5
18
9.8
leadframe
16.5
15
14
21
11.3
13.8
15.8
26
leadframe
12.5
11
19
17
leadframe
13
17
15
13
leadframe
11
9.5
8
13.5
10
12
22
leadframe
10
9
31
35
leadframe
9.5
9.0
8.0
5.8
5.0
5.0
7.2
6.5
5.7
4.8
4.0
3.8
9.0
9.0
7.6
6.0
5.0
5.0
8.0
8.0
6.8
5.0
4.2
4.0
36
45
leadframe
46
55
leadframe
58
67
leadframe
82
100
132
161
leadframe
110
140
leadframe
leadframe
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
TAI-TECH
11. Typical Performance Curves
TAI-TECH
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