TMPC1205HP-R22MG-D [TAI-TECH]
SMD Power Inductor;
| 型号： | TMPC1205HP-R22MG-D |
| 厂家： | 
TAI-TECH |
| 描述： | SMD Power Inductor |
| 文件： | 总4页 (文件大小：735K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
P2
TAI-TECH
TMPC1205HP-Serise(G)-D
SMD Power Inductor
1. Features
1. Magnetic metal powder inductor.
2. Compact design.
Halogen
3. High current，low DCR，high efficiency.
4. Very low acoustic noise and very low leakage flux noise.
5. High reliability.
Halogen-free
6. 100% Lead(Pb)-Free and RoHS compliant.
7. Operating temperature -40~+125℃(Including self - temperature rise)
2. Applications
Note PC power system，incl. IMVP-6
DC/DC converter .
3. Dimensions
C
A
D
ꢀ4R7
1926
leadframe
D
C
A
Recommend PC Board Pattern
L
R47
1926
E
B
G
non-leadframe
L(mm) G(mm) H(mm)
Series
A(mm)
B(mm)
C(mm)
D(mm)
E(mm)
14.2
8.0
5.0
2.3±0.3 4.7±0.3
TMPC1205HP
13.5±0.5
12.5±0.3 4.8±0.2
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
4. Part Numbering
TMPC
1205
HP
-
4R7
MG
-
D
F
A
B
C
D
E
A: Series
B: Dimension
C: Type
BxC
HP:H:Magnetic metal powder, P:PAD broaden.
D: Inductance
E: Inductance Tolerance
F: Code
4R7=4.70uH
M=±20%
Marking: Black.4R7 and 1926(19 YY, 26 WW,follow production date).
P3
TAI-TECH
5. Specification
DCR
(mΩ) Typ.
@25℃
DCR
(mΩ) Max.
@25℃
I rms ( A )
Typ
I sat ( A )
Typ
Inductance
L0 (uH)±20%
Part Number
Type
TMPC1205HP-R20MG-D
TMPC1205HP-R22MG-D
TMPC1205HP-R33MG-D
TMPC1205HP-R36MG-D
TMPC1205HP-R39MG-D
TMPC1205HP-R47MG-D
TMPC1205HP-R50MG-D
TMPC1205HP-R56MG-D
TMPC1205HP-R68MG-D
TMPC1205HP-R82MG-D
TMPC1205HP-1R0MG-D
TMPC1205HP-1R2MG-D
TMPC1205HP-1R5MG-D
TMPC1205HP-1R8MG-D
TMPC1205HP-2R2MG-D
TMPC1205HP-2R7MG-D
TMPC1205HP-3R3MG-D
TMPC1205HP-4R7MG-D
TMPC1205HP-5R6MG-D
TMPC1205HP-6R0MG-D
TMPC1205HP-6R8MG-D
TMPC1205HP-8R2MG-D
TMPC1205HP-100MG-D
TMPC1205HP-120MG-D
TMPC1205HP-150MG-D
TMPC1205HP-180MG-D
TMPC1205HP-220MG-D
TMPC1205HP-270MG-D
TMPC1205HP-330MG-D
TMPC1205HP-680MG-D
0.20
0.22
0.33
0.36
0.39
0.47
0.50
0.56
0.68
0.82
1.00
1.20
1.50
1.80
2.20
2.70
3.30
4.70
5.60
6.00
6.80
8.20
10.0
12.0
15.0
18.0
22.0
27.0
33.0
68.0
82.0
52.0
52.0
42.0
42.0
42.0
38.0
37.0
36.0
34.0
31.0
29.0
28.0
27.0
21.0
20.0
17.0
15.0
12.0
11.5
11.5
11.0
9.5
110.0
110.0
80.0
75.0
70.0
65.0
60.0
55.0
54.0
52.0
50.0
49.0
48.0
40.0
32.0
32.0
32.0
27.0
22.0
21.5
21.0
18.0
16.0
15.0
13.0
11.0
10.0
8.5
0.45
0.50
0.70
0.75
0.78
0.86
0.90
1.00
1.40
1.70
1.85
2.50
2.80
4.00
4.20
4.70
6.80
11.4
12.3
13.0
14.5
16.8
21.4
28.0
32.0
40.0
50.0
63.0
73.0
135.0
198.0
0.55
0.70
0.90
0.95
0.95
1.10
1.30
1.50
1.70
2.10
2.50
3.00
3.30
4.90
5.50
6.70
9.20
15.0
16.5
16.5
18.5
22.5
25.5
34.0
38.0
45.0
58.0
76.0
88.0
162.0
238.0
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
leadframe
9.0
8.6
8.2
7.5
6.5
5.2
5.0
8.0
3.5
5.5
TMPC1205HP-820MG-D
Note:
3.0
4.8
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
P8
TAI-TECH
10. Typical Performance Curves
P9
TAI-TECH
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