TMPC1265HP-4R7MG-D [TAI-TECH]

SMD Power Inductor;


型号：	TMPC1265HP-4R7MG-D
厂家：	TAI-TECH
描述：	SMD Power Inductor
文件：	总4页 (文件大小：1063K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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SMD Power Inductor

TMPC1265HP-Serise(G)-D

1. Features

1. Carbonyl Powder.

2. Compact design.

Halogen

3. High current，low DCR，high efficiency.

4. Very low acoustic noise and very low leakage flux noise.

5. High reliability.

Halogen-free

6. 100% Lead(Pb)-Free and RoHS compliant.

7. Operating temperature -40~+125℃(Including self - temperature rise)

2. Applications

Note PC power system，incl. IMVP-6

DC/DC converter .

3. Dimensions

330

1926

leadframe

Recommend PC Board Pattern

1R5

1926

non-leadframe

Series

A(mm)

A'(mm)

B(mm)

C(mm)

D(mm)

E(mm)

L(mm) G(mm) H(mm)

14.2

8.0

5.0

2.3±0.3

4.7±0.3

TMPC1265HP 13.5±0.5 12.5±0.3 12.5±0.3 6.2±0.3

Note: 1. The above PCB layout reference only.

2. Recommend solder paste thickness

at 0.15mm and above.

4. Part Numbering

TMPC

1265

330

A: Series

B: Dimension

C: Type

BxC

HP:H:Carbonyl Powder,P:PAD broaden.

D: Inductance

330=33.0uH

E: Inductance Tolerance

F: Code

M=±20%.

Marking: Black.330 and 1926(19 YY, 26 WW,follow production date).

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5. Specification

Inductance

L0 (uH)±20%

DCR

(mΩ) Typ.

@25℃

DCR

(mΩ) Max.

@25℃

I rms ( A )

Typ

I sat ( A )

Typ

Part Number

Type

non-leadframe

leadframe

TMPC1265HP-R15MG-D

TMPC1265HP-R22MG-D

TMPC1265HP-R30MG-D

TMPC1265HP-R33MG-D

TMPC1265HP-R36MG-D

TMPC1265HP-R40MG-D

TMPC1265HP-R47MG-D

TMPC1265HP-R50MG-D

TMPC1265HP-R56MG-D

TMPC1265HP-R68MG-D

TMPC1265HP-R82MG-D

TMPC1265HP-1R0MG-D

TMPC1265HP-1R2MG-D

TMPC1265HP-1R5MG-D

TMPC1265HP-1R8MG-D

TMPC1265HP-2R2MG-D

TMPC1265HP-2R7MG-D

TMPC1265HP-3R3MG-D

TMPC1265HP-4R7MG-D

TMPC1265HP-5R6MG-D

TMPC1265HP-6R8MG-D

TMPC1265HP-8R2MG-D

TMPC1265HP-100MG-D

TMPC1265HP-130MG-D

TMPC1265HP-150MG-D

TMPC1265HP-220MG-D

TMPC1265HP-330MG-D

TMPC1265HP-470MG-D

TMPC1265HP-680MG-D

0.15

0.22

0.30

0.33

0.36

0.40

0.47

0.50

0.56

0.68

0.82

1.00

1.20

1.50

1.80

2.20

2.70

3.30

4.70

5.60

6.80

8.20

10.0

13.0

15.0

22.0

33.0

47.0

68.0

100

55.0

53.0

48.0

46.0

45.0

44.0

41.0

40.0

37.0

35.0

33.0

30.0

28.0

27.0

24.0

22.0

20.0

18.0

13.5

12.5

11.5

10.5

10.0

9.0

118.0

112.0

72.0

68.0

66.0

64.0

63.0

60.0

58.0

55.0

50.0

48.0

47.0

45.0

40.0

37.0

32.0

30.0

28.0

23.0

18.0

16.0

15.5

13.0

12.0

11.0

9.5

0.49

0.47

0.60

0.65

0.70

0.90

0.92

1.05

1.25

1.50

1.70

1.90

2.50

3.60

3.80

4.30

5.70

7.00

8.50

9.50

12.0

13.2

21.0

23.2

32.5

48.0

76.0

110.0

145.0

0.60

0.72

0.80

0.90

1.00

1.20

1.25

1.2

1.5

1.9

2.3

2.4

3.0

4.0

leadframe

4.2

leadframe

5.5

leadframe

6.8

leadframe

8.4

leadframe

10.0

11.5

15.5

16.5

24.0

28.0

37.0

58.0

90.0

130.0

165.0

leadframe

9.0

leadframe

9.0

leadframe

8.0

leadframe

6.5

leadframe

4.8

7.8

leadframe

TMPC1265HP-101MG-D

Note:

4.2

5.5

1. Test frequency : Ls : 100KHz /1.0V.

2. All test data referenced to 25℃ ambient.

3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.

4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃

5. Saturation Current (Isat) will cause L0 to drop approximately 30%.

6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and

thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

7. Special inquiries besides the above common used types can be met on your requirement.

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10. Typical Performance Curves

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