AFC [TAK_CHEONG]
350 mW DO-35 Hermetically Sealed Glass AFC / Trigger Diodes; 350毫瓦的DO -35密封式玻璃AFC /触发二极管
| 型号： | AFC |
| 厂家： | 
Tak Cheong Electronics (Holdings) Co.,Ltd |
| 描述： | 350 mW DO-35 Hermetically Sealed Glass AFC / Trigger Diodes |
| 文件： | 总6页 (文件大小：188K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
®
TAK CHEONG
SEMICONDUCTOR
350 mW DO-35 Hermetically
Sealed Glass AFC / Trigger
Diodes
AXIAL LEAD
DO35
Absolute Maximum Ratings TA = 25°C unless otherwise noted
DEVICE MARKING DIAGRAM
Symbol
Parameter
Value
Units
L
PD
TSTG
TJ
Power Dissipation
350
-65 to +200
+175
mW
°C
10
43
Storage Temperature Range
L
= Logo
Device Code = FV1043
Operating Junction Temperature
°C
These ratings are limiting values above which the serviceability of the diode may be impaired.
Specification Features:
DEVICE MARKING DIAGRAM
DO-35 Package (JEDEC)
Through-Hole Device Type Mounting
Hermetically Sealed Glass
Compression Bonded Construction
L
= Logo
Device Code = DB3
All external surfaces are corrosion resistant and leads are readily solderable
Cathode indicated by polarity band
AFC-FV-1043 Electrical Characteristics
TA = 25°C unless otherwise noted
Limits
Unit
Parameter
Test Condition
Min
Typical
Max
BV
IR = 5µA
5
5
Volts
pF
Normal Capacitance
VR = 5V
C 0.1
C 4.0
VR = 0.1V
VR = 4.0V
1.8
Q
f = 100MHZ
50
March 2002 / A
Page 1
®
TAK CHEONG
SEMICONDUCTOR
Trigger - DB3 Electrical Characteristics
TA = 25°C unless otherwise noted
DB3
Unit
Parameter
Min
Typical
Max
VBO
[VBO’-VBO
[∆V]
VO
28
32
36
Volts
Volts
Volts
Volts
µA
]
±3
5
5
IBO
100
10
TR
1.5
µS
IB
µA
Electrical Symbol Definition
Typical Characteristics
+IF
Symbol
Parameter
10mA
BV
VBO
[VBO’-VBO
[∆V]
VO
Breakdown Voltage @ IR
Breakover Voltage @ IBO
BO Symmetry
]
V
IBO
Dynamic Breakover Voltage
Output Voltage
IB
-V
+V
0.5V
∆V
IBO
Breakover Current
Rise Time
VBO
TR
IB
Leakage Current
Forward Current
IF
-IF
Ordering Information
Device
Package
Bulk
Quantity
10,000
5,000
FV-1043 / DB3
FV-1043 / DB3.TB
FV-1043 / DB3.TR
FV-1043 / DB3
Tape and Ammo
Tape and Reel
10,000
Others (…contact sales representatives)
Axial-Lead Tape Packaging Standards
This axial-lead component’s packaging requirements use in automatic testing and assembly equipment. And this standard practices for
lead-tape packaging of axial-lead components meets the requirements of EIA Standard RS-296-D “Lead-taping of Components on Axial
Lead Configuration for Automatic Insertion”.
March 2002 / A
Page 2
®
TAK CHEONG
SEMICONDUCTOR
Tape & Reel Packaging Information
Tape & Reel Outline
DIM
D1
Millimeters
356
30
D2
Reel Dimensions
D3
84
W1
77.5
PKG Type
DO-35
Quantity Per Reel
Quantity Per Reel
10,000
March 2002 / A
Page 3
®
TAK CHEONG
SEMICONDUCTOR
Tape & Ammo Packaging Information
Tape & Ammo
Outline
250mm x 80mm x 80mm
PKG Type
DO-35
Quantity Per Box
Quantity Per Ammo
Box
5,000
Taping Dimensions
Description
Standard Width
Millimeters
26
52
Tape Spacing (B)
Component Pitch (C)
Untaped Lead (L1 – L2)
Glass Offset (F)
52 ± 0.69
26 +0.5 / -0
5.08 ± 0.4
± 0.69
5.08 ± 0.4
± 0.69
± 0.69
± 0.69
Bent (D)
1.2 Max
6.138 ± 0.576
0.55 Max
3.2 Min
0
1.2 Max
6.138 ± 0.576
0.55 Max
3.2 Min
0
Tape Width (G)
Tape Mismatch (E)
Taped Lead (G)
Lead Beyond Tape (H)
March 2002 / A
Page 4
®
TAK CHEONG
SEMICONDUCTOR
Bulk Packaging Information
Plastic Bag
Quantity Per Plastic Bag
DO-35 1000 x 10 Plastic Bag
Bulk Outline
250mm x 80mm x 80mm
PKG Type
DO-35
Quantity Per Box
Quantity Per Box
10,000
March 2002 / A
Page 5
®
TAK CHEONG
SEMICONDUCTOR
Package Outline
Package
Case Outline
DO-35
DO-35
DIM
Millimeters
Inches
Min
Max
Min
Max
0.46
3.05
0.55
5.08
0.018
0.120
1.000
0.060
0.022
0.200
1.500
0.090
A
B
C
D
25.40
1.53
38.10
2.28
Notes:
1. All dimensions are within JEDEC standard.
2. DO35 polarity denoted by cathode band.
March 2002 / A
Page 6
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