SGP.1575.25.4.C.02 [TAOGLAS]

Patent pending;
SGP.1575.25.4.C.02
型号: SGP.1575.25.4.C.02
厂家: Taoglas    Taoglas
描述:

Patent pending

文件: 总13页 (文件大小:2164K)
中文:  中文翻译
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SGP.25c  
Specification  
Part No.  
SGP.1575.25.4.C.02  
GPS SMT Patch Antenna  
Product Name  
Features  
25mm*25mm*4.5mm  
1575MHz Centre Frequency  
Patent pending  
RoHS Compliant  
SPE-11-8-139/D/SS  
|
page 1 of 13  
1. Introduction  
This ceramic GPS patch antenna is based on smart XtremeGainTM technology. It is  
mounted via SMT process and has been selected as optimal solution for the 45x45mm  
ground plane.  
2. Specification  
Original Patch Specification tested on 45mm ground plane  
NO  
1
PARAMETER  
Range of Receiving Frequency  
Center Frequency  
Bandwidth  
SPECIFICATION  
1575.42 MHz ± 1.023 MHZ  
1575.42 ± 3MHz  
8MHz min  
NOTES  
With 45*45mm Ground Plane  
2
Return Loss ≤-10 dB  
3
≤ -10 dB  
4
Return Loss  
1.5 max  
Centre Frequency  
Centre Frequency  
Centre Frequency  
Centre Frequency  
Centre Frequency  
-40°C to +85°C  
5
VSWR  
+2.0 dBic typ.  
-1.0 dBic typ.  
3.0 dB max  
6
Gain at Zenith  
7
Gain at 10°elevation  
Axial Ratio  
8
RHCP  
9
Polarization  
50 Ohms  
10  
11  
12  
Impedance  
0 ± 20ppm / °C  
-40°C to +85°C  
Frequency Temperature Coefficient (tf)  
Operating Temperature  
**Changes in user groundplane and environment will offset centre frequency  
SPE-11-8-139/D/SS  
|
page 2 of 13  
3. Electrical Specifications  
3.1 Return Loss, SWR, Impedance, measured on the test fixture  
CH1 RFL LOG  
5
dB / REF  
0
dB  
1:-15.197 dB  
1.6843 nH  
1 575.420 000 MHz  
CH3 RFL 1 U FS  
1: 46.533 Ω 1.6843 Ω  
*
CH1 Markers  
BW: 10.504643 MHz  
cent: 1575.615765 MHz  
Q: 149.99  
Cor  
1.57542 GHz  
1 loss: -15.197 dB  
Cor  
3
4
1
3
4
2
2
CH3 Markers  
2: 45.992 Ω  
16.689 Ω  
1.57561 GHz  
3: 41.982 Ω  
29.475 Ω  
1.57036 GHz  
4: 43.537 Ω  
30.424 Ω  
1.58086 GHz  
Center 1 575.420 000 MHz  
Span 100.000 000 MHz  
SPE-11-8-139/D/SS  
|
page 3 of 13  
3.2 2D Radiation Pattern  
0
5
0
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-45  
-50  
90  
270  
180  
Pattern  
Model No.  
SGP.25.C  
SGP.25.C  
Test Mode Freq (MHz) Max Gain(dBi)  
Min Gain(dBi)  
3.70 / 354.00 -17.00 / 105.00  
2.92 / 0.00 -8.76 / 2099.00  
Avg. Gain(dBi) Source Polar.  
1
2
XZ  
YZ  
1575.42  
1575.42  
-1.61  
-0.96  
RHCP  
RHCP  
Date: 2009 / 9 / 4  
SPE-11-8-139/D/SS  
|
page 4 of 13  
4. Mechanical Specifications  
4.1 Antenna Dimensions and Drawing  
NOTE:  
1. Solder mask.  
2. Area to be soldered.  
3. Dimension of 50 Ohm CPW dependent  
on individual board.  
Name  
SGP.25 Patch 25x25x4 SGP.25C Ceramic Clear  
SGP.25 PCB FR 0.5t Green  
Part No. Material Finish Quantity  
1
2
1
1
4. Matching circuit-capacitor and inductor  
values dependent on individual environment  
5. Must be soldered to complete antenna  
feed connection  
SPE-11-8-139/D/SS  
|
page 5 of 13  
4.2 Antenna Footprint  
4.2.1 Top Copper  
SPE-11-8-139/D/SS  
|
page 6 of 13  
4.2 Antenna Footprint  
4.2.2 Top Paste  
SPE-11-8-139/D/SS  
|
page 7 of 13  
4.2 Antenna Footprint  
4.2.3 Top Mask  
SPE-11-8-139/D/SS  
|
page 8 of 13  
4.2 Antenna Footprint  
4.2.4 Composite  
SPE-11-8-139/D/SS  
|
page 9 of 13  
4.3 Test Jig and Dimension  
NOTE:  
1. Solder Mask (Black)  
2. Solder Area  
SPE-11-8-139/D/SS | page 10 of 13  
4.4 Test Fixture set up and measurements  
Antenna Setup  
& Measurements  
Test Fixture  
45 by 45mm  
Ground Plane  
Patch Antenna  
Network Analyzer  
S11 Characteristics  
Calibration Point  
Log map  
Smith Chart  
SMA Adapter  
SPE-11-8-139/D/SS | page 11 of 13  
5. Recommended Reflow Soldering Profile  
SGP.25.C can be assembled following Pb-free assembly. According to the Standard IPC/JEDEC J-STD-  
020C, the temperature profile suggested is as follow:  
PHASE  
PROFILE FEATURES  
Temperature Min(Tsmin)  
Temperature Max(Tsmax)  
Time(ts) from (Tsmin to Tsmax)  
Avg. Ramp-up Rate (Tsmax to TP)  
Temperature(TL)  
Pb-Free Assembly (SnAgCu)  
150°C  
PREHEAT  
200°C  
60-120 seconds  
3°C/second(max)  
217°C  
RAMP-UP  
REFLOW  
Total Time above TL (tL)  
Temperature(TP)  
30-100 seconds  
260°C  
PEAK  
Time(tp)  
2-5 seconds  
RAMP-DOWN  
Rate  
3°C/second(max)  
8 minutes max.  
96.5Sn/3Ag/0.5Cu  
SHENMAO PF606-P26  
Time from 25°C to Peak Temperature  
Composition of solder paste  
Solder Paste Model  
Soldering Iron condition: Soldering iron temperature 270°C±10°C.  
Apply preheating at 120°C for 2-3 minutes. Finish soldering for each terminal within 3 seconds, if soldering  
iron temperature over 270°C±10°C or 3 seconds, it will make cause component surface peeling or damage.  
SPE-11-8-139/D/SS | page 12 of 13  
6. Packaging  
200 pcs per reel / inner carton  
4 reels per outer carton - 800 pcs  
Taoglas makes no warranties based on the  
accuracy or completeness of the contents  
of this document and reserves the right  
to make changes to specifications and  
product descriptions at any time without  
notice. Taoglas reserves all rights to this  
Reproduction, use or disclosure to third  
parties without express permission is  
strictly prohibited.  
document and the information contained  
herein.  
Copyright © Taoglas Ltd.  
SPE-11-8-139/D/SS | page 13 of 13  

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