SGP1575154A02 [TAOGLAS]

GPS/GALILEO SMT PAtch Antenna;


型号：	SGP1575154A02
厂家：	Taoglas
描述：	GPS/GALILEO SMT PAtch Antenna 全球定位系统
文件：	总13页 (文件大小：1006K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SPECIFICATION

Part No.

SGP.1575.15.4.A.02

Product Name

GPS/GALILEO SMT Patch Antenna

Features

15mm*15mm*4.5mm

1575MHz Centre Frequency

Patent Pending

RoHS Compliant

SPE-11-8-137/F/SS Page 1 of 13

1. Introduction

This ceramic GPS/GALILEO patch antenna is based on smart XtremeGain™

technology. It is mounted via SMT process and has been selected as optimal

solution for the 45x45mm ground plane.

2. Specification

Original Patch Specification tested on 45mm ground plane

Parameter

Specification

1575.42 MHz ± 1.023 MHz

With 45*45mm ground

Notes

Range of Receiving Frequency

Center Frequency

1575.42 ± 3MHz

plane

Bandwidth

VSWR

6MHz min

Return Loss ≤-10 dB

1.5 max

Gain at Zenith

Gain at 10°elevation

Axial Ratio

+1.0 dBic typ.

3.0 dB max

RHCP

Polarization

Impedance

50 Ohms

Frequency Temperature

Coefficient（τf）

Operating Temperature

0 ± 20ppm / ^oC

-40ºC to +85ºC

-40°C to +85°C

**Changes in user groundplane and environment will offset centre frequency

SPE-11-8-137/F/SS Page 2 of 13

3. Electrical Specifications

3.1 Return Loss, SWR, Impedance, measured on the

test fixture

SPE-11-8-137/F/SS Page 3 of 13

4. Mechanical Specifications

4.1 Dimensions and Drawing

SPE-11-8-137/F/SS Page 4 of 13

4.2 Antenna Footprint

4.2.1 Top Copper

SPE-11-8-137/F/SS Page 5 of 13

4.2.2 Top Paste

SPE-11-8-137/F/SS Page 6 of 13

4.2.3 Top Mask

SPE-11-8-137/F/SS Page 7 of 13

4.2.4 Composite

SPE-11-8-137/F/SS Page 8 of 13

4.3 Test Jig and Dimension

SPE-11-8-137/F/SS Page 9 of 13

4.4 Test Fixture set up and measurements

SPE-11-8-137/F/SS Page 10 of 13

5. Recommended Reflow Soldering Profile

SGP.15A can be assembled following Pb-free assembly. According to the Standard

IPC/JEDEC J-STD-020C, the temperature profile suggested is as follow:

Phase

Profile Features

Temperature Min(Tsmin)

Temperature Max(Tsmax)

Time(ts) from (Tsmin to Tsmax)

Avg. Ramp-up Rate (Tsmax to TP)

Temperature(TL)

Pb-Free Assembly (SnAgCu)

150°C

PREHEAT

200°C

60-120 seconds

3°C/second(max)

217°C

RAMP-UP

REFLOW

Total Time above TL (tL)

Temperature(TP)

30-100 seconds

260°C

PEAK

Time(tp)

2-5 seconds

RAMP-DOWN

Rate

3°C/second(max)

8 minutes max.

96.5Sn/3Ag/0.5Cu

SHENMAO PF606-P26

Time from 25°C to Peak Temperature

Composition of solder paste

Solder Paste Model

Soldering Iron condition: Soldering iron temperature 270°C±10°C.

Apply preheating at 120°C for 2-3 minutes. Finish soldering for each terminal within 3 seconds, if soldering iron

temperature over270°C±10°C or 3 seconds, it will make cause component surface peeling or damage.

SPE-11-8-137/F/SS Page 11 of 13

6. Packaging

SPE-11-8-137/F/SS Page 12 of 13

Taoglas makes no warranties based on the accuracy or completeness of the contents of this document and reserves

the right to make changes to specifications and product descriptions at any time without notice. Taoglas reserves

all rights to this document and the information contained herein.

Reproduction, use or disclosure to third parties without express permission is strictly prohibited.

SPE-11-8-137/F/SS Page 13 of 13

SGP1575154A02 [TAOGLAS]

相关型号：

SGP1575184C02

SGP1575254C02

SGP15A

SGP15B

SGP15G

SGP15J

SGP15K

SGP15M

SGP15N120

SGP15N120_09

SGP15N60

SGP15N60