SWLP.2450.12.4.B.02 [TAOGLAS]
rohs compliant;型号: | SWLP.2450.12.4.B.02 |
厂家: | Taoglas |
描述: | rohs compliant 局域网 WLAN 无线局域网 射频 微波 |
文件: | 总18页 (文件大小:1254K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SPECIFICATION
Part No.
:
SWLP.2450.12.4.B.02
Product Name
:
12*12*4mm 2.4GHz SMD Patch
Antenna
Features
:
2.4 - 2.5GHz Patch Antenna
For Wi-Fi/WLAN/ISM/Zigbee Industrial Applications
High Gain 2dBi
Linearly Polarized
ROHS Compliant
Top
Bottom
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1. Introduction
This 12*12*4mm high gain 2.4GHz patch antenna is ideally suited for high performance
industrial applications in the 2.4GHz Wi-Fi, ISM, and Zigbee bands. This product has highest
gain in the XZ (azimuth) plane direction, most suitable for fixed wireless applications where
transmission and reception is focused to one hemisphere of the device, for example a wireless
meter on a reinforced concrete wall. It can also be placed anywhere on the device ground-
plane, unlike most chip or loop antennas which need to be edge mounted.
Many module manufacturers specify peak gain limits for any antennas that are to be
connected to that module. Those peak gain limits are based on free-space conditions. In
practice, the peak gain of an antenna tested in free-space can degrade by at least 1 or 2dBi
when put inside a device. So ideally you should go for a slightly higher peak gain antenna
than mentioned on the module specification to compensate for this effect, giving you better
performance.
Upon testing of any of our antennas with your device and a selection of appropriate layout,
integration technique, or cable, Taoglas can make sure any of our antennas’ peak gain will
be below the peak gain limits. Taoglas can then issue a specification and/or report for the
selected antenna in your device that will clearly show it complying with the peak gain limits,
so you can be assured you are meeting regulatory requirements for that module.
For example, a module manufacturer may state that the antenna must have less than 2dBi
peak gain, but you don’t need to select an embedded antenna that has a peak gain of less
than 2dBi in free-space. This will give you a less optimized solution. It is better to go for a
slightly higher free-space peak gain of 3dBi or more if available. Once that antenna gets
integrated into your device, performance will degrade below this 2dBi peak gain due to the
effects of GND plane, surrounding components, and device housing. If you want to be
absolutely sure, contact Taoglas and we will test. Choosing a Taoglas antenna with a higher
peak gain than what is specified by the module manufacturer and enlisting our help will
ensure you are getting the best performance possible without exceeding the peak gain limits.
SPE-13-8-007/G/SS
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It is better not to select an embedded antenna with very low free-space peak gain (<2dBi)
directly, as this antenna would have worse performance in your device, and lead to
compromised performance compared to using a Taoglas antenna.
2. Key Antenna Performance Indicators*
ELECTRICAL
Frequency Range
Bandwidth
Efficiency
2400 MHz to 2500 MHz
100 MHz @ -7dB
80.12% @ 2450 MHz
Linear
Polarization
VSWR
3.0 max @ Center Frequency
+2 dBi typ.
Peak Gain
Impedance
50 Ohms
MECHANICAL
Dimensions
Weight
12mm x 12mm x 4mm
4g
ENVIRONMENTAL
Operating Temperature
Storage Temperature
Termination
-40℃ to +85℃
-40℃ to +85℃
Ag (Environmentally Friendly Pb Free)
Original Patch Specification measured on EVB 50*50mm. Actual value depends on ground-plane and
housing
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3.
Electrical Specifications
3.1 Return Loss
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3.2 Definition of X-Y-Z Plane
Y
X
Z
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3.3 Radiation Patterns
XY Plane
X
0
10
0
330
30
-10
-20
-30
-40
300
60
Y
270
90
2400MHz
2450MHz
2500MHz
240
120
210
330
150
30
(dB)
180
XZ Plane
Z
0
10
0
-10
-20
-30
-40
300
60
X
270
90
2400MHz
240
120
2450MHz
2500MHz
210
150
(dB)
180
SPE-13-8-007/G/SS
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YZ Plane
Z
0
10
0
330
30
-10
-20
-30
-40
300
60
Y
270
90
2400MHz
2450MHz
2500MHz
240
120
210
150
(dB)
180
SPE-13-8-007/G/SS
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3.4 Efficiency
3.5 Average Gain
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3.6 Peak Gain
3.7 3D Radiation Pattern
2400MHz
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2450MHz
2500MHz
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4. Dimensions
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4.1 Evaluation Board Dimensions
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5. Footprint
5.1 Top Copper
5.2 Top Solder paste
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5.3 Top Solder Mask
5.4 Composite Diagram
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6. Packaging
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SPE-13-8-007/G/SS
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7. Recommended Reflow Temperature Profile
SWLP.12B can be assembled following Pb-free assembly. According to the Standard
IPC/JEDEC J-STD-020C, the temperature profile suggested is as follow:
Phase
Profile Features
Temperature Min(Tsmin)
Temperature Max(Tsmax)
Time(ts) from (Tsmin to Tsmax)
Avg. Ramp-up Rate (Tsmax to
TP)
Pb-Free Assembly (SnAgCu)
PREHEAT
150°C
200°C
60-120 seconds
3°C/second(max)
RAMP-UP
REFLOW
PEAK
Temperature(TL)
217°C
Total Time above TL (tL)
Temperature(TP)
30-100 seconds
260°C
Time(tp)
2-5 seconds
RAMP-DOWN
Rate
3°C/second(max)
8 minutes max.
96.5Sn/3Ag/0.5Cu
SHENMAO PF606-P26
Time from 25°C to Peak Temperature
Composition of solder paste
Solder Paste Model
Soldering Iron condition: Soldering iron temperature 270°C±10°C.
Apply preheating at 120°C for 2-3 minutes. Finish soldering for each terminal within 3 seconds, if soldering iron
temperature over270°C±10°C or 3 seconds, it will make cause component surface peeling or damage.
SPE-13-8-007/G/SS
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Taoglas makes no warranties based on the accuracy or completeness of the contents of this document and
reserves the right to make changes to specifications and product descriptions at any time without notice.
Taoglas reserves all rights to this document and the information contained herein.
Reproduction, use or disclosure to third parties without express permission is strictly prohibited.
Copyright © Taoglas Ltd.
SPE-13-8-007/G/SS
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