MAX3223EIDBG4 [TAOS]
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION;
| 型号： | MAX3223EIDBG4 |
| 厂家： | 
TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS |
| 描述： | 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION 驱动 |
| 文件： | 总22页 (文件大小：646K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MAX3223E
www.ti.com.......................................................................................................................................... SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
Check for Samples: MAX3223E
1
FEATURES
DB, DW, OR PW PACKAGE
•
ESD Protection for RS-232 Bus Pins
(TOP VIEW)
–
–
–
±15-kV Human-Body Model (HBM)
EN
C1+
1
20 FORCEOFF
±8-kV IEC61000-4-2, Contact Discharge
±15-kV IEC61000-4-2, Air-Gap Discharge
2
19
18
17
16
15
14
13
12
11
V
CC
3
V+
GND
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
4
C1−
DOUT1
RIN1
5
C2+
•
•
•
•
•
•
•
Operates With 3-V to 5.5-V VCC Supply
Operates up to 500 kbit/s
6
C2−
ROUT1
FORCEON
DIN1
7
V−
8
DOUT2
RIN2
ROUT2
Two Drivers and Two Receivers
Low Standby Current . . . 1 μA Typ
External Capacitors . . . 4 × 0.1 μF
Accepts 5-V Logic Input With 3.3-V Supply
9
DIN2
10
INVALID
Alternative High-Speed Pin-Compatible Device
(1 Mbit/s) for SNx5C3223E
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
DESCRIPTION/ORDERING INFORMATION
The MAX3223E consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD
protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to
5.5-V supply. The device operates at typical data signaling rates up to 500 kbit/s and a maximum of 30-V/μs
driver output slew rate.
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is
set low and EN is high, both drivers and receivers are shut off, and the supply current is reduced to 1 mA.
Disconnecting the serial port or turning off the peripheral drivers causes auto-powerdown to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown enabled,
the device is activated automatically when a valid signal is applied to any receiver input. The INVALID output is
used to notify the user if an RS-232 signal is present at any receiver input. INVALID is high (valid data) if any
receiver input voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less
than 30 μs. INVALID is low (invalid data) if the receiver input voltage is between –0.3 V and 0.3 V for more than
30 μs. Refer to Figure 4 for receiver input levels.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
MAX3223E
SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009.......................................................................................................................................... www.ti.com
Table 1. ORDERING INFORMATION
(1) (2)
TA
PACKAGE
ORDERABLE PART NUMBER
MAX3223ECDW
MAX3223ECDWR
MAX3223ECDB
TOP-SIDE MARKING
Tube of 25
Reel of 2000
Tube of 70
Reel of 2000
Tube of 70
Reel of 2000
Tube of 25
Reel of 2000
Tube of 70
Reel of 2000
Tube of 70
Reel of 2000
SOIC – DW
SSOP – DB
TSSOP – PW
SOIC – DW
SSOP – DB
TSSOP – PW
MAX3223EC
–0°C to 70°C
MP223EC
MP223EC
MAX3223EI
MP223EI
MAX3223ECDBR
MAX3223ECPW
MAX3223ECPWR
MAX3223EIDW
MAX3223EIDWR
MAX3223EIDB
–40°C to 85°C
MAX3223EIDBR
MAX3223EIPW
MP223EI
MAX3223EIPWR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
2
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Product Folder Link(s): MAX3223E
MAX3223E
www.ti.com.......................................................................................................................................... SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009
FUNCTION TABLES
ABC
EACH DRIVER(1)
INPUTS
OUTPUT
DOUT
DRIVER STATUS
VALID RIN
RS-232 LEVEL
DIN
FORCEON
FORCEOFF
X
L
X
H
H
L
L
X
X
Z
H
L
Powered off
H
H
H
H
H
H
Normal operation with
auto-powerdown disabled
H
L
X
Yes
Yes
No
No
H
L
Normal operation with
auto-powerdown enabled
H
L
L
L
Z
Z
Powered off by
auto-powerdown feature
H
L
(1) H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER(1)
INPUTS
OUTPUT
DOUT
VALID RIN
RS-232 LEVEL
RIN
EN
L
H
L
L
X
X
H
L
X
H
L
X
Z
H
Open
No
(1) H = high level, L = low level, X = irrelevant,
Z = high impedance (off),
Open = input disconnected or connected driver off
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MAX3223E
SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009.......................................................................................................................................... www.ti.com
LOGIC DIAGRAM (POSITIVE LOGIC)
13
17
DIN1
DIN2
DOUT1
12
8
DOUT2
20
14
FORCEOFF
FORCEON
11
Powerdown
INVALID
1
EN
15
16
9
ROUT1
RIN1
RIN2
10
ROUT2
Pin numbers are for the DB, DW, and PW packages.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
0.3
MAX UNIT
VCC
V+
Supply voltage range
6
V
V
V
V
Positive-output supply voltage range(2)
Negative-output supply voltage range(2)
7
V–
–7
V+ – V– Supply voltage difference(2)
13
Driver (FORCEOFF, FORCEON, EN)
Receiver
–0.3
–25
6
25
VI
Input voltage range
Output voltage range
V
V
Driver
–13.2
–0.3
13.2
VO
Receiver (INVALID)
DB package
VCC + 0.3
70
θJA
Package thermal impedance(3) (4)
DW package
58 °C/W
83
PW package
TJ
Operating virtual junction temperature
Storage temperature range
150
150
°C
°C
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
4
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MAX3223E
www.ti.com.......................................................................................................................................... SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009
RECOMMENDED OPERATING CONDITIONS(1)
See Figure 6
MIN NOM
MAX UNIT
VCC = 3.3 V
VCC = 5 V
VCC = 3.3 V
VCC = 5 V
3
4.5
2
3.3
5
3.6
V
Supply voltage
5.5
Driver and control
high-level input voltage
VIH
VIL
VI
DIN, EN, FORCEOFF, FORCEON
V
2.4
Driver and control
low-level input voltage
DIN, EN, FORCEOFF, FORCEON
DIN, EN, FORCEOFF, FORCEON
0.8
V
Driver and control input voltage
Receiver input voltage
0
–25
0
5.5
25
70
85
V
V
MAX3223EC
MAX3223EI
TA
Operating free-air temperature
°C
–40
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
ELECTRICAL CHARACTERISTICS(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
(2)
PARAMETER
TEST CONDITIONS
MIN TYP
MAX UNIT
Input leakage
current
EN, FORCEOFF,
FORCEON
II
±0.01
±1
μA
VCC = 3.3 V or 5 V, TA = 25°C,
No load, FORCEOFF and FORCEON at VCC
Auto-powerdown disabled
Powered off
0.3
1
1
mA
No load, FORCEOFF at GND
10
ICC Supply current
No load, FORCEOFF at VCC, FORCEON at
μA
Auto-powerdown enabled GND,
All RIN are open or grounded
1
10
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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MAX3223E
SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009.......................................................................................................................................... www.ti.com
DRIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
(2)
PARAMETER
TEST CONDITIONS
MIN TYP
MAX UNIT
VOH
VOL
IIH
High-level output voltage
Low-level output voltage
High-level input current
Low-level input current
DOUT at RL = 3 kΩ to GND
5
5.4
V
V
DOUT at RL = 3 kΩ to GND
VI = VCC
–5
–5.4
±0.01
±0.01
±1
±1
μA
μA
IIL
VI at GND
VCC = 3.6 V, VO = 0 V
IOS
ro
Short-circuit output current(3)
Output resistance
±35
±60
mA
Ω
VCC = 5.5 V, VO = 0 V
VCC, V+, and V– = 0 V, VO = ±2 V
FORCEOFF = GND, VCC = 3 V to 3.6 V, VO = ±12 V
FORCEOFF = GND, VCC = 4.5 V to 5.5 V, VO = ±12 V
300
10M
±25
±25
IOZ
Output leakage current
μA
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
(2)
PARAMETER
TEST CONDITIONS
MIN TYP
MAX UNIT
CL = 1000 pF,
One DOUT switching,
RL = 3 kΩ,
See Figure 1
Maximum data rate
250
500
100
kbit/s
CL = 150 pF to 2500 pF,
See Figure 2
RL = 3 kΩ to 7 kΩ,
tsk(p)
Pulse skew(3)
ns
CL = 150 pF to 1000 pF
CL = 150 pF to 2500 pF
6
4
30
Slew rate, transition region
(See Figure 1)
RL = 3 kΩ to 7 kΩ,
VCC = 3.3 V
SR(tr)
V/μs
30
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
TYP UNIT
Human-Body Model (HBM)
±15
Driver outputs (DOUTx)
IEC61000-4-2, Air-Gap Discharge
IEC61000-4-2, Contact Discharge
±15
±8
kV
6
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Product Folder Link(s): MAX3223E
MAX3223E
www.ti.com.......................................................................................................................................... SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009
RECEIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
(2)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
VOH High-level output voltage
IOH = –1 mA
VCC – 0.6
VCC – 0.1
V
VOL
Low-level output voltage
IOL = 1.6 mA
VCC = 3.3 V
VCC = 5 V
0.4
2.4
2.4
V
1.6
1.9
VIT+ Positive-going input threshold voltage
VIT– Negative-going input threshold voltage
V
VCC = 3.3 V
VCC = 5 V
0.6
0.6
1.1
V
1.4
Vhys Input hysteresis (VIT+ – VIT–
)
0.5
V
IOZ
ri
Output leakage current
Input resistance
EN = VCC
±0.05
5
μA
kΩ
VI = ±3 V to ±25 V
3
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(2)
PARAMETER
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Output enable time
TEST CONDITIONS
TYP
UNIT
ns
tPLH
tPHL
ten
CL = 150 pF, See Figure 3
150
150
200
200
50
CL = 150 pF, See Figure 3
CL = 150 pF, RL = 3 kΩ, See Figure 4
CL = 150 pF, RL = 3 kΩ, See Figure 4
See Figure 3
ns
ns
tdis
Output disable time
ns
tsk(p)
Pulse skew(3)
ns
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
TYP UNIT
Human-Body Model (HBM)
±15
Receiver inputs (RINx)
IEC61000-4-2, Air-Gap Discharge
IEC61000-4-2, Contact Discharge
±15
±8
kV
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Product Folder Link(s): MAX3223E
MAX3223E
SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009.......................................................................................................................................... www.ti.com
AUTO-POWERDOWN SECTION
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
MAX UNIT
Receiver input threshold for
INVALID high-level output voltage
VT+(valid)
VT(valid)
VT(invalid)
VOH
FORCEON = GND,
FORCEOFF = VCC
FORCEOFF = VCC
2.7
0.3
0.4
V
V
V
V
V
Receiver input threshold for
INVALID high-level output voltage
FORCEON = GND,
FORCEON = GND,
–2.7
–0.3
Receiver input threshold for
INVALID low-level output voltage
FORCEOFF = VCC
FORCEON = GND,
IOH = 1 mA,
FORCEOFF = VCC
INVALID high-level output voltage
INVALID low-level output voltage
VCC – 0.6
IOL = 1.6 mA,
FORCEOFF = VCC
FORCEON = GND,
VOL
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (seeFigure 5)
(1)
PARAMETER
TYP
UNIT
μs
tvalid
tinvalid
ten
Propagation delay time, low- to high-level output
1
Propagation delay time, high- to low-level output
Supply enable time
30
μs
100
μs
(1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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MAX3223E
www.ti.com.......................................................................................................................................... SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009
PARAMETER MEASUREMENT INFORMATION
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
3 V
Input
1.5 V
1.5 V
RS-232
Output
0 V
Generator
(see Note B)
50 Ω
C
L
t
R
L
t
TLH
THL
(see Note A)
3 V
FORCEOFF
V
V
OH
3 V
−3 V
3 V
−3 V
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
or t
SR(tr) +
t
THL
TLH
C. CL includes probe and jig capacitance.
D. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
L
t
t
PHL
PLH
R
L
(see Note A)
V
V
OH
3 V
FORCEOFF
50%
50%
Output
OL
TEST CIRCUIT
E. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
F. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
EN
0 V
3 V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
t
t
PLH
PHL
C
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
G. CL includes probe and jig capacitance.
H. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
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MAX3223E
SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009.......................................................................................................................................... www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
3 V
0 V
V
CC
GND
Input
1.5 V
1.5 V
S1
R
L
t
t
PZH
PHZ
(S1 at GND)
(S1 at GND)
3 V or 0 V
Output
V
OH
C
L
Output
50%
(see Note A)
EN
0.3 V
0.3 V
t
PLZ
Generator
(see Note B)
(S1 at V
)
CC
50 Ω
Output
50%
V
OL
t
PZL
(S1 at V )
CC
TEST CIRCUIT
VOLTAGE WAVEFORMS
I.
CL includes probe and jig capacitance.
J. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
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MAX3223E
www.ti.com.......................................................................................................................................... SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009
PARAMETER MEASUREMENT INFORMATION (continued)
3 V
2.7 V
2.7 V
2.7 V
0 V
0 V
EN
Receiver
Input
−2.7 V
ROUT
−3 V
Generator
(see Note B)
50 Ω
t
t
valid
invalid
V
CC
INVALID
Output
50% V
50% V
CC
CC
0 V
t
en
Auto-
powerdown
INVALID
= 30 pF
≈V+
V+
C
L
(see Note A)
0.3 V
V
Supply
CC
0 V
0.3 V
FORCEOFF
FORCEON
Voltages
DIN
DOUT
≈V−
V−
TEST CIRCUIT
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
Indeterminate
2.7 V
0.3 V
If Signal Remains Within This Region
0 V
†
ms, INVALID
for More Than 30
Indeterminate
Valid RS-232 Level, INVALID High
Is Low
0.3 V
2.7 V
†
Auto-powerdown disables drivers and
reduces supply current to 1 µA
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MAX3223E
SLLS707A –JANUARY 2006–REVISED SEPTEMBER 2009.......................................................................................................................................... www.ti.com
APPLICATION INFORMATION
20
1
Auto-
powerdown
EN
FORCEOFF
2
19
18
V
C1+
V+
CC
C
BYPASS
= 0.1mF
+
3
4
GND
C1
†
C3
17
16
DOUT1
C1
C2+
C2
V
5
RIN1
+
+
C2
C4
6
15
ROUT1
5 kΩ
7
14
13
FORCEON
DIN1
8
DOUT2
9
12
11
RIN2
DIN2
10
ROUT2
INVALID
5 kΩ
†
C3 can be connected to V or GND.
CC
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
V
CC
vs CAPACITOR VALUES
V
C1
C2, C3, and C4
0.1 µF
CC
0.1 µF
0.047 µF
0.1 µF
3.3 V " 0.3 V
5 V " 0.5 V
3 V to 5.5 V
0.33 µF
0.47 µF
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Product Folder Link(s): MAX3223E
PACKAGE OPTION ADDENDUM
www.ti.com
16-Jun-2009
PACKAGING INFORMATION
Orderable Device
MAX3223ECDB
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3223ECDBG4
MAX3223ECDBR
MAX3223ECDBRG4
MAX3223ECDW
MAX3223ECDWG4
MAX3223ECDWR
MAX3223ECDWRG4
MAX3223ECPW
SSOP
SSOP
SSOP
SOIC
DB
DB
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
PW
PW
PW
PW
DB
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
SSOP
SSOP
SSOP
SSOP
SOIC
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3223ECPWG4
MAX3223ECPWR
MAX3223ECPWRG4
MAX3223EIDB
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3223EIDBG4
MAX3223EIDBR
MAX3223EIDBRG4
MAX3223EIDW
DB
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
PW
PW
PW
PW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3223EIDWG4
MAX3223EIDWR
MAX3223EIDWRG4
MAX3223EIPW
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3223EIPWG4
MAX3223EIPWR
MAX3223EIPWRG4
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Jun-2009
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
MAX3223ECDBR
MAX3223ECDWR
MAX3223ECPWR
MAX3223EIDBR
MAX3223EIDWR
MAX3223EIPWR
SSOP
SOIC
DB
DW
PW
DB
20
20
20
20
20
20
2000
2000
2000
2000
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
16.4
24.4
16.4
16.4
24.4
16.4
8.2
10.8
6.95
8.2
7.5
13.0
7.1
2.5
2.7
1.6
2.5
2.7
1.6
12.0
12.0
8.0
16.0
24.0
16.0
16.0
24.0
16.0
Q1
Q1
Q1
Q1
Q1
Q1
TSSOP
SSOP
SOIC
7.5
12.0
12.0
8.0
DW
PW
10.8
6.95
13.0
7.1
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
MAX3223ECDBR
MAX3223ECDWR
MAX3223ECPWR
MAX3223EIDBR
MAX3223EIDWR
MAX3223EIPWR
SSOP
SOIC
DB
DW
PW
DB
20
20
20
20
20
20
2000
2000
2000
2000
2000
2000
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
45.0
38.0
38.0
45.0
38.0
TSSOP
SSOP
SOIC
DW
PW
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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