AVRF060X100LT242 [TDK]
ESD Notch Filters For wireless audio equipment;型号: | AVRF060X100LT242 |
厂家: | TDK ELECTRONICS |
描述: | ESD Notch Filters For wireless audio equipment |
文件: | 总10页 (文件大小:268K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
E M C C o m p o n e n t s
ESD Notch Filters
Cl
Br
Pb
For wireless audio equipment
REACH Halogen
Free
Lead
Free
RoHS
SVHC-Free
AVRF series
FEATURES
This is an electronic component that achieves both ESD protection and noise protection.
TDMA noises generated by radio communication can be suppressed.
The high-attenuation characteristics of the Bluetooth band and the WiFi band are highly effective in preventing degradation of the recep-
tion sensitivity of radio equipment.
It is ideal for audio equipment with low sound distortion and high sound quality.
APPLICATION
ESD protection such as sound lines
Sound lines for devices such as smartphones, tablets, headsets, hearing aids, smart speakers and wearable equipments
ꢀ(earphones, microphones, and speakers)
CIRCUIT EXAMPLE
EQUIVALENT CIRCUIT
Microphone line
2 Zener Diodes
Noise Suppression Filter
Audio
Codec
A capacitance content
Microphone
ESD Notch Filters
Speaker or Receiver line
Noise Suppression Filter
Audio
Codec
Speaker or
Receiver
ESD Notch Filters
INTERNAL CONSTRUCTION
①
No.
(1)
(2)
(3)
(4)
(5)
Name
Semiconductor ceramics
Internal electrode(Pd)
Ag
Ni
Sn
Terminal electrode
②
③
⑤
④
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Please note that the contents may change without any prior notice due to reasons such as upgrading.
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E M C C o m p o n e n t s
AVRF series
PART NUMBER CONSTRUCTION
AVRF
10
1U
6R8
K
T
242
Capacitance
tolerance
(%)
Insertion loss
frequency
(MHz)
L x W dimensions
(mm)
Rated voltage
(V)
Capacitance
(pF)
Series name
Packaging style
06
10
0.6×0.3
1.0×0.5
0V
0W
0X
1P
1U
3.5
5.5
7
12
28
6R8
6.8
K
10
15
20
T
B
Taping
Bulk
242=24×102
8R2
8.2
L
102
212
242
272
1000
2100
2400
2700
100 100=10x100
M
160
600
650
16
60
65
W
L
T
Shape symbol (JIS)
L
W
T
B
0603
1005
0.6 0.03
1.00 0.05
0.30 0.03
0.50 0.05
0.30 0.03
0.50 0.05
0.1min.
0.1min.
B
OPERATING TEMPERATURE RANGE, PACKAGE QUANTITY, PRODUCT WEIGHT
Temperature range
Package quantity
Individual weight
Type
Operating temperature
Storage temperature
(°C)
(°C)
(pieces/reel)
15,000
(mg)
0.2
1.2
AVRF06
AVRF10
–40 to +85
–40 to +85
–40 to +85
–40 to +85
10,000
Operating temperature range includes self-temperature rise.
The storage temperature range is for after the assembly.
TERMINOLOGY
Item
Unit
IL
(dB)
Description
Insertion loss
Power loss when measured by shunt-through connection of a product in a 50 measurement system
DC voltage that is continuously applied between product terminals
Terminal products leakage current-value: 50µA max.
(Rated voltage range)
Vdc
(V)
Rated voltage
C
Capacitance
Oscillator frequency 1kHz or 1MHz, capacitance between product terminal in oscillator voltage 1Vrms
Product terminal voltage when DC1mA was flowed
(pF)
Vbr
(V)
Breakdown voltage
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Please note that the contents may change without any prior notice due to reasons such as upgrading.
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E M C C o m p o n e n t s
AVRF series
PRODUCT CHARACTERISTICS LIST
Insertion loss
Rated voltage Breakdown voltage Capacitance
ESD voltage amount
I=1mA
Vbr
(V)
6.8typ.
8typ.
20typ.
12.8typ.
12.8typ.
39typ.
f=1MHz, osc=1Vrms IEC61000-4-2
C
Item
Application
IL
(dB)
20min.(1GHz)
Vdc
(V)
3.5
5.5
(pF)
150pF/330
8kV
8kV
8kV
8kV
AVRF060V600MT102
AVRF060W650MT102 20min.(1GHz)
AVRF061P160MT212
AVRF060X100LT242
AVRF060X8R2LT272
AVRF101U6R8KT242
60 (48 to 72)
65 (52 to 78)
16 (12.8 to 19.2)
10 (8.5 to 11.5)
8.2 (6.97 to 9.43)
6.8 (6.12 to 7.48)
Cellular
Cellular
Cellular/WiFi/Bluetooth
WiFi/Bluetooth
WiFi/Bluetooth
WiFi/Bluetooth
20min.(2.1GHz) 12
20min.(2.4GHz)
20min.(2.7GHz)
7
7
8kV
8kV
20min.(2.4GHz) 28
ELECTRICAL CHARACTERISTICS
INSERTION LOSS VS. FREQUENCY CHARACTERISTICS
INSERTION LOSS VS. FREQUENCY CHARACTERISTICS
ꢀApplication: WiFi / Bluetooth
0
0
AVRF101U6R8KT242
AVRF101U6R8KT242
5
10
15
5
10
15
20
20
AVRF060V600MT102
25
30
35
AVRF060X8R2LT272
AVRF060X100LT242
25
AVRF061P160MT212
AVRF060W650MT102
1000
40
10
30
100
10000
1000
10000
(MHz)
Frequency
(MHz)
Frequency
CURRENT VS. VOLTAGE CHARACTERISTICS
10–2
AVRF060V600MT102
10–3
AVRF060W650MT102
10–4
AVRF060X100LT242
10–5
AVRF060X8R2LT272
10–6
AVRF061P160MT212
10–7
AVRF101U6R8KT242
10–8
10–9
10–10
0
10
20
30
40
50
(V)
Voltage
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Please note that the contents may change without any prior notice due to reasons such as upgrading.
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E M C C o m p o n e n t s
AVRF series
DISCHARGE VOLTAGE WAVEFORM (EXAMPLE)
DISCHARGE WAVEFORM WITHOUT ESD NOTCH FILTERS AND WITH ESD NOTCH FILTERS INSTALLED
1800
1600
Without Filter
AVRF101U6R8KT242
1400
AVRF060X100LT242
1200
AVRF060X8R2LT272
1000
AVRF061P160MT212
800
AVRF060W650MT102
600
AVRF060V600MT102
400
200
0
–200
–50
0
50
100
Time ns
150
200
250
300
(
)
Test conditions
150pF/330 (IEC61000-4-2)
Contact discharge, Charged voltage 8kV
TEST CIRCUIT DIAGRAM
Discharge gun
Test
Shield
sample
Discharge
Point
SMA
Connector
60dB attenuator
50
Oscilloscope
ESD
simulator
PCB
I/O impedance: 50
ESD Simulator
ESD
Coaxial
Notch Filters Cable
Attenuator(60dB)
50
Oscilloscope
50
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Please note that the contents may change without any prior notice due to reasons such as upgrading.
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E M C C o m p o n e n t s
AVRF series
Attention on a circuit board design
(2) When peak levels panning-at soldering is excessive, by solder
contraction stress, mechanical-thermal stress causes a Yasuku
chip crack. In addition, when the peak level is underestimated, ter-
minal electrode fixed strength is insufficient. This causes chip
dropouts and may affect circuit reliability. Representative example
of the panning of peak levels is shown in the following.
Board design
When attached to products, amount of silver used (fillet size) has
direct impact on products after mounting. Thus, sufficient consider-
ation is necessary.
Set of land dimensions
(1) As the stress rises in the products owing to the increase in sil-
ver, breakage and cracks will occur. Cause including crack, as cau-
tion on board land design, configure the shape and dimensions so
that the amount of silver is appropriate. If you installed 2 or more
parts in the Common Land, separated by a solder resist and spe-
cial land of each component.
Recommended silver dose
Solder stress is increased,
Solder volume
and it is easy for a crack to
form.
overload
Most large serving amount
Minimum prime amount
Decent solder
volume
Fixed strength is weak, and
there is connection a prob-
lem and risk of loss.
C
Solder volume
deficit
B
A
Case and suggested protocol want to avoid
Symbol
A
Improvement example
(land division)
Dimensions shape
Example
Cases to avoid
B
C
0603
1005
0.25 to 0.35
0.30 to 0.50
0.20 to 0.30
0.35 to 0.45
0.25 to 0.35
0.40 to 0.60
Leads
Solder
Leads
Chip
Solder resist
Lead wire and land
of part discrete
doubles up
PCB
Chassis
Solder
(ground solder)
Solder resist
Arrangements in
the vicinity
L1
L2
L2>L1
Land
Arrangements of
chip component's
companion
Excess solder
Solder resist
Land
Missing solder
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Please note that the contents may change without any prior notice due to reasons such as upgrading.
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E M C C o m p o n e n t s
AVRF series
Attention on a circuit board design
Arrangements of components
(2) In payment near by board, depending on mount position of
products, as mechanical stress varies, please refer to the following
diagram.
(1) I was based on camber of substrate and suggested protocol of
products arrangement, as stress does not join to the utmost is
shown in following.
Substrate for flexural stress Substrate for flexural stress
E
A
D
Adverse events
Good example
Perforation
C
Perforation or slit
Perforation or slit
B
Direction of
surface solder
Slit
Solder the mountain fold as a Solder the mountain fold as a
top.
bottom. [Please review the
italicized portion, as I am
unsure what you mean to con-
vey here.]
The order of A > B = C > D > E eases the stress.
Perforation or slit
Perforation or slit
Chip
arrangements
(direction)
Mounted vertically to the per- Mounted horizontally to the
foration and slit.
perforation and slit.
L1
L2
Distance from
perforation
and slit
(L1<L2)
(L1<L2)
portion
Close location is disadvanta- It is an advantage so distant
geous of perforation and slit. location away places the perfo-
ration and slit.
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Please note that the contents may change without any prior notice due to reasons such as upgrading.
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E M C C o m p o n e n t s
AVRF series
Local precautions
Reflow temperature profile
Application to board
Preheating
Soldering
Natural
cooling
Mounting head pressure
Under suction nozzle if dead point too, during implementation,
excessive force joins of products low, as cause causes of crack,
please use with reference to something about following.
1) Being set to top surface of substrate so that under suction nozzle
as for dead center, substrate does not bend back, and adjust,
please.
Peak
T4
T3
T3
T2
t3
t2
2) Nozzle pressure at implementation is 1 to 3N in static load,
please.
T1
t1
3) Substrate fixes up back surface of substrate with support pin in
impact of suction nozzle to wely deflection to the utmost, and
substrate hold deflection, please. A representative example is
shown in the following.
t: Time
Specification
for eutectic mixture Use of lead-free
Cases to avoid
Recommended case
Item
solder
solder
Crack
Preheating temperature
Solder melting temperature
Maximum temperature
Preheating time
Time to reach higher than the
solder melting temperature
160 to 180°C
200°C
150 to 180°C
230°C
260°C max.
120s max.
Single-sided
mounting
240°C max.
100s max.
Support pin
30s max.
40s max.
2 max.
number of possible reflow cycles 2 max.
Double-sided
mounting
Soldering iron
Solder peeling
Support pin
Crack
The tip temperature and also by (1) types of soldering irons, the size
of the substrate, and the geometry of the land pattern. Being earlier,
but when as there is possibility that crack occurs in the heat ander-
son impaction, point soldering iron temperature is high, please do
solder work within the following conditions.
Mechanical shock that, if positioning your nail to wear, ragged edge
of positionings, participates in products are locally, and products, as
there is possibility of crack generated, cut the closed positioning,
and maintenance and inspection, and, exchange of manage dimen-
sions and position nail periodically, please.
Wattage
Temperature
of iron tips
(°C)
Pallet point Soldering time
shape
Frequency
(mm)
(Second)
(W)
Within each
terminal once
(Within total of
twice)
Soldering
30max.
ø3.0max.
5 max.
350max.
Significant impact is possible on the performance of products, flux
checks something about follow, please use.
Direct iron tip is in contact with the (2) products body, and the strain
owing to thermal shock in particular grows even if a crack is gener-
ated. Therefore, please do not touch it directly to the terminal elec-
trodes.
(1) Flux uses one with 0.1wt % (Cl conversion) or less halide sub-
stance contains amounts, please. In addition, do not do this with
strongly acidic objects.
Flux during is soldered (2) Products is applied the smalleset amount
necessary, please.
(3) If Used soluble flux, perform thorough wash particularly, please.
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Please note that the contents may change without any prior notice due to reasons such as upgrading.
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E M C C o m p o n e n t s
AVRF series
Attention after implementation
(2) During each substrate operational check, push pressure with
contact failure of check pin of boards checkers of check pin may be
toned up to be prevented. As substrate is bent under loading, prod-
ucts is broken owing to stress. There is also the possibility that sol-
der on the terminal electrode will peel off. Follow the diagram for
reference, and check that the substrate bends, please.
Cleaning
(1) If cleaning liquid is inappropriate, residues and other foreign
body of fluxes builds up on products, and can degrade the perfor-
mance of products (particularly the insulation resistance).
(2) Wash conditions may compromise performance of products if
they are improper (wash due, wash excess).
Item
Cases to avoid
Recommended case
2-1) For wash due
Peeling
Support pin
(a) By substance of a system in flux residue halide, metal including
terminal electrodes may experience corrosion.
Substrate sags
(b) Substance of a system in flux residue halide builds up on prod-
ucts, and reduces the insulation resistance.
Check pin
Check pin
(c) Soluble flux makes comparisons of colophony series flux, and
there is event with trends of significant (1) and(2).
Single-part component handling
To drop impact, as there is possibility that breakage and crack is
entered, do not products that(1) products falls.
2-2) For excess wash
(1) Owing to lavage, products deteriorates, and reduces perfor-
mance of products.
(2) In ultrasonography, when output is passed, substrate resonates
size, and crack occurs in body and sprang of products in vibra-
tion of substrate. Since this may reduce the strength of the termi-
nal electrode, please note the following conditions. [Please review
the italicized portion, as I am unsure what you mean to convey
here.]
Crack
Floor
(2) At stacking storage after implementation and treatment of sub-
strate, corner of boards is regarded as products. Please be careful,
as there is the possibility that breakage and cracks will occur on
impact.
Ultrasound output
Ultrasonic frequency
Ultrasound cleaning time
2-3) Concentration including halogen that when cleaning liquid to
pollution, when you released is higher, and may cause similar of
results into wash due.
Crack
Board
Substrate handling after component mounting
(1) When substrate is divided, a flexible so that show in following dia-
gram to substrate, and is given by stress including twist, as there is
possibility that crack occurs of products, please check that stress is
within acceptable limits.
Bends
Twist
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Please note that the contents may change without any prior notice due to reasons such as upgrading.
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E M C C o m p o n e n t s
AVRF series
PACKAGING STYLE
REEL DIMENSIONS
2.0 0.5
PACKAGE QUANTITY / INDIVIDUAL WEIGHT
Package quantity
(pieces/reel)
15,000
Individual weight
Type
(mg)
0.2
AVRF06
AVRF10
10,000
1.2
0.8
ø13 0.2
ø21 0.8
9.0max.
14.0max.
ø180 2.0
Dimensions in mm
TAPE DIMENSIONS
1.50+0.1
2.0 0.05
4.0 0.1
T
A
P1
Dimensions in mm
P1 T
Type
0603
1005
A
B
0.38 0.05
0.65+0.05/-0.1
0.68 0.05
1.15+0.05/-0.1
2.0 0.05
2.0 0.05
0.45max.
0.65max.
160min.
Taping
200min.
300min.
Dimensions in mm
Drawing direction
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E M C C o m p o n e n t s
REMINDERS FOR USING THESE PRODUCTS
Before using these products, be sure to request the delivery specifications.
SAFETY REMINDERS
Please pay sufficient attention to the warnings for safe designing when using this products.
REMINDERS
Please pay careful attention to the precautions and follow safe designing practices when using these products.
Please observe the following precautions in order to avoid problems with products such as characteristic degradation and element
destruction
Please store these products in an environment with a temperature of 5 to 40°C and humidity level of 20 to 70%RH, and use them
within six months.
Poor storage conditions may lead to the deterioration of the solderability of the edge electrodes, so please be careful to avoid contact
with humidity, dew condensation, dust, toxic gas (hydrogen, hydrogen sulfide, sulfurous acid, chlorine, ammonia, etc.), direct sunlight,
and so on.
Please do not use products that have been dropped or detached when mounting.
Please solder with the reflow soldering method, and not the flow (dip) soldering method.
Please observe the following precautions to avoid problems with products such as characteristic degradation and element destruction,
which ultimately lead to the generation of heat and smoke with the elements.
Do not use in locations where the temperatures exceed the operating temperature range such as under direct sunlight or near
sources of heat.
Do not use in locations where there are high levels of humidity such as under direct exposure to weather and areas where steam is
released.
Do not use in locations such as dusty areas, high-saline environments, places where the atmosphere is contaminated with corrosive
gas, etc.
Avoid powerful vibrations, impact (such as by dropping), pressure, etc. that may lead to splitting in the products.
Do not use with a voltage that exceeds the rated voltage.
When resin coating (including modular) a product, do not use a resin that will cause deterioration of the product. Be sure never to use
resin that generates hydrogen as palladium is used for the inner electrode.
Avoid attachment near combustible materials.
Please contact our sales offices when considering the use of the products listed on this catalog for applications, whose performance
and/or quality require a more stringent level of safety or reliability, or whose failure, malfunction or trouble could cause serious damage
to society, person or property ('specific uses' such as automobiles, airplanes,medical instruments, nuclear devices, etc.) as well as
when considering the use for applications that exceed the range and conditions of this catalog.
Please also contact us when using these products for automotive applications.
As range of catalog, conditions are transcended, or for damage that generated by was used in application specific, etc, accept no the
responsibility, wish.
Please take appropriate measures such as acquiring protective circuits and devices that meet the uses, applications, and conditions of
the instruments and keeping backup circuits.
Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.
Please note that the contents may change without any prior notice due to reasons such as upgrading.
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