B25655P4907K000 [TDK]
PCC Power Capacitor Chip for 650-VR Semiconductor Modules in e-Mobility Applications;
| 型号： | B25655P4907K000 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | PCC Power Capacitor Chip for 650-VR Semiconductor Modules in e-Mobility Applications PC |
| 文件： | 总10页 (文件大小：1107K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
EPCOS Product Brief 2014
Film Capacitors
PCC Power Capacitor Chip for 650-VR Semiconductor Modules
in e-Mobility Applications
www.epcos.com
Technology
Film assembly
Process flow
1) Metal-end spray layer
2) Free margin
3) Metallization, flat or CSP
w. / wo. structuring
4) Heavy-edge
5) Precise extension and
“wavy-smooth” cut
1) Winding of capacitor element 5) Testing of active winding
with metallized film
2) Metal-end spray
6) Wiring, e.g. with busbar and
encapsulation
3) Thermal treatment
4) Sawing of active winding
7) 100% final inspection
Fig. 1: Cross sections of film/foil assembly
Fig. 2: Main working steps
without the contact edge problem,
a well-known and dangerous
constriction effect at the film
period in vacuum. In this way, air
and moisture are extracted from
the inner capacitor to avoid any
oxidation effects at the electrodes
or any partial discharges. This
process step ensures excellent -
+capacitance stability and a long
useful life.
Film assembly
At least two dielectric films are
wound in parallel to form a cap-
acitor element. Fig. 1 shows the
film/foil arrangements in a cross-
sectional view for common PCC
designs: the diagram shows the
most common standard version
with the metallization on one side.
edges of low-cost MKP windings.
Process flow
The process flow for PCC with
power cap formatted stacked
windings is shown in Fig. 2.
The Low Power designs are
boxed (resin-filled) or
unpackaged (naked).
Contacting of windings
The winding technology
The end faces of the windings are
contacted by metal spraying
(Schooping) to ensure a reliable
and low-inductance connection
between the metallized film layers
and to the connection system.
After this working step the cap-
acitor windings will be connected
with leads e. g. busbars which are
welded onto the metal-end spray
layer, Fig. 3.
This developed winding tech-
nology can be used to implement
absolutely flat and wrinkle-free
stacked windings in “power cap
dimensions” for PCC1) using
metallized polymer films, starting
with PP down to 2.5 μm and PET
of 1.8 μm, Fig. 2, 3. The PCC
process flowchart describes the
main production steps. The
flexibility and extremely high
Impregnation and sealing
process quality of the production
line and the polygon winder (PW)
are important for this application.
A special “wavy-smooth” cut
combination produces a maxi-
mum effective contact surface via
a defined small offset and pre-
cisely wound master capacitors
allowing a specially optimized
metal-spraying and contacting
process. The result is an out-
standingly high pulse-current
handling capability far beyond the
minimum requirements laid down
in IEC and EN standards and
1) PCCs can naturally also be designed with
flat windings.
The active winding elements are
heated and dried for a defined
Fig. 3: Left - stacked-winding; right - flat capacitor winding with copper busbars which are
welded onto the metal-end spray layer, ready for assembly
© EPCOS AG - Edition August 2014
PCC for Infineon / HybridPack – 2nd Generation
PRELIMINARY
Picture 1
Picture 2
For HP1 platform
For HP2 platform
Sample for laboratory use only
HP1 platform – FS200R07 / FS400R07
1)
Ordering code
C
L
R
Î
I
S
Dimensions
L x W x H
mm
Graph
Fig.
tan
R
I
self
S
max
kA
120 Hz
μF
300 80
nH
kA
m
A
-4
B25655J4307K001
B25655P4467K0002) 460 80
30
25
25
1.0
0.6
0.5
1.2
1.4
1.6
4.8
5.5
6.0
140 x 72 x 50
140 x 72 x 50
140 x 72 x 50
A
C
B
1
1
1
8 · 10
5 · 10
5 · 10
-4
-4
B25655P4567K000
560 80
HP2 platform – FS400R12 / FS600R07 / FS800R07
1)
Ordering code
C
L
R
Î
I
Dimensions
L x W x H
mm
Graph
Fig.
tan
R
I
self
S
S
max
kA
120 Hz
μF
500 120
nH
kA
m
A
-4
B25655J4507K005
15
15
15
15
15
15
1.0
0.5
0.4
0.4
0.4
0.4
2
8
237 x 72 x 50
237 x 54 x 50
237 x 72 x 50
237 x 72 x 50
237 x 72 x 50
237 x 72 x 50
D
F
2
2
2
2
2
2
8 · 10
5 · 10
5 · 10
5 · 10
5 · 10
5 · 10
B25655P4507K0003) 500 120
2
8
-4
-4
-4
-4
-4
B25655P4707K0002) 700 135
3
9
E
E
E
E
B25655P4847K000
B25655P4907K0002) 900 135
B25655P4108K000 1000 135
840 135
3.6
3.6
4.0
10.5
10.5
11.5
1) Considering maximum hot spot temperature at +105 °C and cooling efficiency to be validated.
2) Preferred types.
3) Samples only available in prototype housing.
© EPCOS AG - Edition August 2014
PCC for Infineon / HybridPack – 2nd Generation
PRELIMINARY
Picture 3
Picture 4
For HP1 platform
For HP2 platform
HP1 platform – FS200R07 / FS400R07 3)
1)
Ordering code
C
L
R
Î
I
S
Dimensions
L x W x H
mm
Graph
Fig.
tan
R
I
self
S
max
kA
120 Hz
μF
B25655P4467K0012) 460 80
B25655P4567K001 560 80
nH
kA
m
A
-4
25
25
0.6
0.5
1.4
1.6
5.5
6.0
140 x 72 x 50
140 x 72 x 50
C
B
3
3
5 · 10
5 · 10
-4
HP2 platform – FS400R12 / FS600R07 / FS800R07 3)
1)
Ordering code
C
L
R
Î
I
Dimensions
L x W x H
mm
Graph
Fig.
tan
R
I
self
S
S
max
kA
120 Hz
μF
500 120
nH
kA
m
A
-4
B25655P4507K001
B25655P4707K0012) 700 135
15
15
15
15
15
0.5
0.4
0.4
0.4
0.4
2
8
237 x 72 x 50
237 x 72 x 50
237 x 72 x 50
237 x 72 x 50
237 x 72 x 50
E
E
E
E
E
4
4
4
4
4
5 · 10
5 · 10
5 · 10
5 · 10
5 · 10
-4
-4
-4
-4
3
9
B25655P4847K001
B25655P4907K0012) 900 135
B25655P4108K001 1000 135
840 135
3.6
3.6
4.0
10.5
10.5
11.5
1) Considering maximum hot spot temperature at +105 °C and cooling efficiency to be validated.
2) Preferred types.
3) Samples only available in prototype housing.
© EPCOS AG - Edition August 2014
PCC for Infineon / HybridPack – 2nd Generation
PRELIMINARY
Maximum ambient temperature diagrams for HybridPackTM - HP1 platform
Graph A
Maximum ambient temperature
Graph B
Maximum ambient temperature
Graph C
Maximum ambient temperature
Dotted line shows the maximum current possible when the bottom plate of the capacitor is firmly fixed on a cooling plate at +85 °C. The continuous line
shows the maximum current possible without cooling at given ambient temperature.
© EPCOS AG - Edition August 2014
PCC for Infineon / HybridPack – 2nd Generation
PRELIMINARY
Maximum ambient temperature diagrams for HybridPackTM – HP2 platform
Graph D
Maximum ambient temperature
Graph E
Maximum ambient temperature
Graph F
Maximum ambient temperature
Dotted line shows the maximum current possible when the bottom plate of the capacitor is firmly fixed on a cooling plate at +85 °C. The continuous line
shows the maximum current possible without cooling at given ambient temperature.
© EPCOS AG - Edition August 2014
PCC for Infineon / HybridPack – 2nd Generation
PRELIMINARY
Dimensional drawing
Fig. 1
Fig. 2
© EPCOS AG - Edition August 2014
PCC for Infineon / HybridPack – 2nd Generation
PRELIMINARY
Dimensional drawing
Fig. 3
Fig. 4
© EPCOS AG - Edition August 2014
General Data
PRELIMINARY
Specifications and characteristics
Capacitance tolerance
10%
2 •10-4
tan δ0
VR
450 VDC
600 VDC
Vs
Test data
Voltage between terminals VTT
Voltage between terminals and case VTC
675 VDC, 10 s
3000 VDC, 10 s
≥10000 s
Rins
C
Life expectancy
Up to 15 000 hours 1)
300 fit
aFQ
Values after Test Ca, IEC 68-2 (21 days, 40 °C, 93% rel. humidity)
|C/C|
tan
≤5%
≤5 •10-4
Rins
C
≤3000 s
Climatic category
40/105/21
-45 ... +110 °C
-40 °C
Tstg
Tmin
Tmax
+105 °C
+105 °C
95%
THS (maximum hot spot temperature)
Max. permissible humidity
Construction and general data
Resin filling
Polyurethane resin
Plastic (Polycarbonate)
Flat copper (tinned)
Case
Terminals
Creepage and clearance distance
Figure 1: 9 mm
Figure 2: 8 mm
Cooling
to be confirmed
Degree of protection
RoHS compliance
Halogen free
Indoor mounting (IP54)
1) To be confirmed; depending on the application
Display of ordering codes for EPCOS products
The ordering code for one and the same product can be represented differently in data sheets, data books, other
publications and the website of EPCOS, or in order-related documents such as shipping notes, order confirmations and
product labels. The varying representations of the ordering codes are due to different processes employed and do
not affect the specifications of the respective products. Detailed information can be found on the Internet under
www.epcos.com/orderingcodes
© EPCOS AG - Edition August 2014
Cautions and Warnings
PRELIMINARY
Cautions & warnings
In case of dents of more than 1 mm depth or any other mechanical damage, capacitors must
not be used at all.
Check tightness of the connections/terminals periodically.
The energy stored in capacitors may be lethal.
To prevent any chance of shock, discharge and short-circuit the capacitor before handling.
Failure to follow cautions may result, worst case, in premature failures, bursting and fire.
Safety
Electrical or mechanical misapplication of capacitors may be hazardous. Personal injury or property
damage may result from bursting of the capacitor or from expulsion of melted material due to mechanical
disruption of the capacitor.
Ensure good, effective grounding for capacitor enclosures.
Observe appropriate safety precautions during operation (self recharging phenomena and the high energy
stored in capacitors).
Handle capacitors carefully, because they may still be charged even after disconnection. The terminals of
capacitors, connected bus bars and cables as well as the devices may also be energized.
Follow good engineering practice.
Thermal load
After installation of the capacitor it is necessary to verify that maximum hot-spot temperature is not
exceeded at extreme service conditions.
Mechanical protection
The capacitor has to be installed in a way that mechanical damages and dents in the case are avoided.
Storage and operating conditions
Do not use or store capacitors in corrosive atmosphere, especially where chloride gas, sulfide gas, acid,
alkali, salt or the like are present. In dusty environments regular maintenance and cleaning especially of the
terminals is required to avoid conductive path between phases and/or phases and ground.
Useful life expectancy
Electrical components do not have an unlimited service life expectancy; this applies to self-healing
capacitors too. The maximum service life expectancy may vary depending on the application the capacitor is
used in.
HybridPack is a trademark of Infineon Technologies AG
Important information Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our
knowledge of typical requirements that are often placed on our products. We expressly point out that these statements cannot be regarded as binding statements about the suitability of
our products for a particular customer application. It is incumbent on the customer to check and decide whether a product is suitable for use in a particular application. This publication
is only a brief product survey which may be changed from time to time. Our products are described in detail in our data sheets. The Important notes (www.epcos.com/ImportantNotes)
and the product-specific Cautions and warnings must be observed. All relevant information is available through our sales offices.
© EPCOS AG • A Member of TDK-EPC Corporation
Edition August, 2014 • Printed in Germany
相关型号：
©2020 ICPDF网 联系我们和版权申明